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1. 发明专利

JP2003188490A SHEET FOR BORING PRINTED WIRING BOARD AND METHOD OF BORING PRINTED WIRING BOARD USING THE SAME 审中-公开
公开(公告)号：JP2003188490A
公开(公告)日：2003-07-04
申请号：JP2001383983
申请日：2001-12-18
申请人： NIPPON SYNTHETIC CHEM IND , SHINETSU FUJITSU KK
发明人： IZUMI TSUKASA , TAKASHI HIROSHI
IPC分类号： H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a sheet for boring printed wiring board that is excellent in boring position accuracy and plating covering power at the time of boring a printed wiring board, and to provide a method of boring printed wiring board using the sheet. SOLUTION: The sheet for boring printed wiring board is composed of a resin composition layer containing a water-soluble polyoxyalkylene compound (A) having a weight-average molecular weight of ≥10,000, and another polyoxyalkylene compound (B) having a weight-average molecular weight of 300-10,000 or a laminated layer of the resin composition layer and a substrate, and the resin composition layer is satin-finished. At the time of boring a through hole through the printed wiring board, the sheet is used. COPYRIGHT: (C)2003,JPO

2. 发明专利

JP2004210829A Sheet for punching printed wiring substrate and method of punching printed wiring substrate using the sheet 有权
公开(公告)号：JP2004210829A
公开(公告)日：2004-07-29
申请号：JP2002378820
申请日：2002-12-27
申请人： Nippon Synthetic Chem Ind Co Ltd:The , 日本合成化学工業株式会社
发明人： IZUMI TSUKASA
IPC分类号： C08J7/04 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a sheet for punching a printed wiring substrate excellent in positioning accuracy in punching the substrate and in throwing power in plating and a method of punching a printed wiring substrate using the sheet.
SOLUTION: The sheet for punching a printed wiring substrate comprises arranging an aqueous tackifier layer [II] on one side of a plastic film or a metal foil [I] or arranging the aqueous tackifier layer [II] on one side of the plastic film or the metal foil [I] and further arranging at least one layer [III] consisting of the component selected from the group consisting of (A) an aqueous lubricant, (B) a water-soluble polymer, (C) a resin composition containing a copolymer having a compound shown in general formula (1) as a copolymer component and (D) a resin composition containing a water-soluble polymer and a water-soluble lubricant on the other side of the plastic film or the metal foil [I]. A method of punching a printed wiring substrate using the sheet is also presented.
COPYRIGHT: (C)2004,JPO&NCIPI

3. 发明专利

JPH1165086A FORMATION OF PATTERN 失效
公开(公告)号：JPH1165086A
公开(公告)日：1999-03-05
申请号：JP22480897
申请日：1997-08-21
申请人： NIPPON SYNTHETIC CHEM IND
发明人： NAKAJIMA HIROYUKI , IZUMI TSUKASA
IPC分类号： G03F7/004 , G03F1/00 , G03F1/70 , H01J9/02 , H01J9/14 , G03F1/08
摘要： PROBLEM TO BE SOLVED: To provide a forming method capable of providing an intended ideal pattern having no bias of an inorganic pattern such as phosphor resulting from even contraction in burning, and particularly provide a method for forming the multicolor fluorescent face of a plasma display panel(PDP). SOLUTION: In the case of exposure of a mineral-containing photosensitive resin composition R containing mineral such as phosphor, a pattern mask M having a fine shield portion M1 ' of a resolution limit or less provided in a non-shield portion M0 is used as the pattern mask M comprising the non-shield portion M0 and the shield portion M1 , and the mineral-containing photosensitive resin composition R containing the mineral is exposed via the pattern mask M. Thereby, a half cured portion R1 ' is formed in a cured portion R1 by the exposure of the composition R. After the exposure, developing is conducted, and final burning is conducted.

4. 发明专利

JPH10275557A METHOD FOR FORMING MULTICOLOR FLUORESCENT SURFACE 失效
公开(公告)号：JPH10275557A
公开(公告)日：1998-10-13
申请号：JP7690797
申请日：1997-03-28
申请人： NIPPON SYNTHETIC CHEM IND
发明人： NAKAJIMA HIROYUKI , IZUMI TSUKASA
IPC分类号： H01J9/227
摘要： PROBLEM TO BE SOLVED: To provide a method for surely forming a multicolor fluorescent surface having reliability, which can easily cope with a high definition panel, with excellent operability by using a photoresist film, which does not include phosphor, so as to cleverly form vacant cells in order in the cells provided between partitioning walls on a board, and filling the vacant cells with the phosphor in order. SOLUTION: All or a part of cells of a substrate 1, which is previously provided with partitioning walls 2, is filled with plural kinds of resist 3a, 3b, 3c resulted from the photoresist film and having different peeling property. A vacant cell generated by selectively peeling each resist is filled with the composition 4R, 4B, 4G, which contains phosphor in a different color, and finally, hardened material in each cell is burned so as to fix the phosphor R, G, B.

5. 发明专利

JPH10198034A PHOTOSENSITIVE RESIN COMPOSITION AND ITS USE 失效
公开(公告)号：JPH10198034A
公开(公告)日：1998-07-31
申请号：JP1336097
申请日：1997-01-08
申请人： NIPPON SYNTHETIC CHEM IND
发明人： NAKAJIMA HIROYUKI , SUGITA HIROSUKE , IZUMI TSUKASA
IPC分类号： G03F7/004 , G03F7/027 , G03F7/028 , G03F7/033 , G03F7/075 , H01J9/02
摘要： PROBLEM TO BE SOLVED: To obtain a photosensitive resin compsn. having high adhesion to a glass substrate and excellent in removability in alkali development by using (meth)acrylic ester, (meth)acrylic acid and hydroxyl group-contg. (meth)acrylic ester as the copolymer components of a base polymer. SOLUTION: This photosensitive resin compsn. contains a base polymer, an ethylenic unsatd. compd. and a photopolymn. initiator or further contains a silane compd. Alkyl acrylate, acrylic acid and hydroxyl group-contg. alkyl acrylate are used as the copolymer components of the base polymer. Acrylic resin is used as the base polymer and (meth)acrylic ester, (meth)acrylic acid and hydroxyl group-contg. (meth)acrylic ester are used as the essential copolymer components of the acrylic resin.

6. 发明专利

JPH10198032A PHOTOSENSITIVE RESIN COMPOSITION AND ITS USE 失效
公开(公告)号：JPH10198032A
公开(公告)日：1998-07-31
申请号：JP1335997
申请日：1997-01-08
申请人： NIPPON SYNTHETIC CHEM IND
发明人： SUGITA HIROSUKE , IZUMI TSUKASA , NAKAJIMA HIROYUKI
IPC分类号： G03F7/004 , G03F7/027 , G03F7/028 , G03F7/033 , G03F7/075 , H01J9/02
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin compsn. having high adhesion to a glass substrate and excellent in removability by alkali development by using at least polyethylene glycol di(meth)acrylate as an ethylenic unsatd. compd. SOLUTION: This photosensitive resin compsn. contains a base polymer, an ethylenic unsatd. compd., a photopolymn. initiator and a silane compd. At least polyethylene glycol di(meth)acrylate, e.g. tetraethylene glycol di(meth) acrylate is used as the ethylenic unsatd. compd. Acrylic resin, polyester resin, polyurethane resin or other resin is used as the base polymer.

7. 发明专利

JPH0896711A PHOSPHOR PATTERN FORMING METHOD 失效
公开(公告)号：JPH0896711A
公开(公告)日：1996-04-12
申请号：JP25294794
申请日：1994-09-20
申请人： NIPPON SYNTHETIC CHEM IND , MITSUBISHI ELECTRIC CORP
发明人： IZUMI TSUKASA , SUGITA HIROSUKE , ARIMOTO HIRONOBU
IPC分类号： H01J9/22
摘要： PURPOSE: To form a phosphor pattern excellent in close adhesiveness and shape stability by applying a cross linking agent to a substrate surface, laminating a phosphor-contained photosensitive resin composition layer on this applied surface, and performing exposure through a pattern mask. CONSTITUTION: A cross linking agent is applied to a surface of a glass substrate provided with a conductive circuit of an ITO film. As this cross linking agent, any of a silane compound, aluminum compound and a titanate compound is preferable. A phosphor-contained photosensitive resin composition layer is applied by a liquid state or preformed into a film, pasted and laminated to this cross linking agent applied surface. Next on this photosensitive layer, a pattern mask is provided by dry film resist and exposed by applying an ultraviolet ray. Thereafter, the mask is removed, to perform developing by an alkali diluted water solution, further to perform burning at about 500 to 550 deg.C, and to fix a phosphor. In this way, a high accurate phosphor pattern, excellent in adhesiveness with the glass substrate and in stability of pattern shape, is formed in good workability.

8. 发明专利

JPH0895239A PHOTORESIST FILM 失效
公开(公告)号：JPH0895239A
公开(公告)日：1996-04-12
申请号：JP25294594
申请日：1994-09-20
申请人： NIPPON SYNTHETIC CHEM IND , MITSUBISHI ELECTRIC CORP
发明人： IZUMI TSUKASA , ARIMOTO HIRONOBU
IPC分类号： G03F7/004 , C09K11/54 , C09K11/64 , C09K11/78 , G03F7/028 , G03F7/033 , H01J9/227
摘要： PURPOSE: To form a photoresist layer excellent in the dispersion stability of a phosphor and to ensure superior pattern forming precision and adhesion to a substrate of glass, etc., by incorporating the phosphor and inorg. powder into a photosensitive resin compsn. and laminating the resultant compsn. on a base film. CONSTITUTION: A phosphor and inorg. powder are incorporated into a photosensitive resin compsn. and the resultant compsn. is laminated on a base film to obtain the objective photoresist film. The photosensitive resin compsn. consists of a base polymer, an ethylenically unsatd. compd. and a photopolymn. initiator. Acrylic resin, polyester resin or polyurethane resin is, e.g. used as the base polymer. The phosphor is not especially limited but a phosphor obtd. by activating a matrix such as oxyhalide of a rare earth element with an activator is preferably used. The inorg. powder is, e.g. glass powder, alumina powder, silica powder, magnesium oxide powder or tin oxide powder, glass powder is preferably used and silicate glass powder is especially important.

9. 发明专利

JP2003152307A SHEET FOR BORING PRINTED WIRING BOARD AND METHOD OF BORING PRINTED WIRING BOARD USING THE SAME 审中-公开
公开(公告)号：JP2003152307A
公开(公告)日：2003-05-23
申请号：JP2001343936
申请日：2001-11-09
申请人： NIPPON SYNTHETIC CHEM IND
发明人： IZUMI TSUKASA , SATO HIROAKI
IPC分类号： H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a sheet for boring a printed wiring board that is excellent in high boring position accuracy or plating throwing power when a printed wiring board is bored and is easily dissolved and removed by washing with water after boring, and to provide a method of boring printed wiring board using the sheet. SOLUTION: The sheet for boring a printed wiring board is constituted by laminating a water-soluble lubricant composed of a polyoxyalkylene compound having a weight-average molecular weight of 300-less than 10,000 upon a base material composed of a water-soluble polymer. Through holes are bored through the printed wiring board by using the sheet.

10. 发明专利

JP2001250478A FLUOR FIXING METHOD 失效
公开(公告)号：JP2001250478A
公开(公告)日：2001-09-14
申请号：JP2000059792
申请日：2000-03-06
申请人： NIPPON SYNTHETIC CHEM IND
发明人： IZUMI TSUKASA
IPC分类号： C08K3/00 , C08F2/44 , C08F2/50 , C08F291/06 , C08L101/00 , G03F7/004 , G03F7/027 , G03F7/028 , G03F7/032 , G03F7/033 , H01J9/227 , H01J11/22 , H01J11/34 , H01J11/42 , H01J11/02
摘要： PROBLEM TO BE SOLVED: To offer a fluor fixing method giving birth to an excellent fixing of uniformly thick fluors in the case of fixing a fluor in a cell on a modified production line and enabling its excellent fixing even using a resin composition containing a fluor stored for a long period. SOLUTION: In fixing the fluor in the cell, a layer of a resin composition containing a fluor, base polymer, ethylenic unsaturated compound and specific copolymer, and a layer of a photosensitive resin compound are formed sequentially and thereafter exposure and developing are applied to these layers.

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