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1. 发明公开

EP2648211A4 COATING LIQUID FOR IMPURITY DIFFUSION 审中-公开
标题翻译：涂布液扩散污染状况
公开(公告)号：EP2648211A4
公开(公告)日：2014-07-30
申请号：EP11845216
申请日：2011-11-29
申请人： NIPPON SYNTHETIC CHEM IND
发明人： SATO HIROAKI , KATSUMA KATSUHIKO , KATO KUNIYASU , TSUTSUMI YUKA
IPC分类号： C09D129/04 , C08K3/32 , C08K3/38 , C08L71/02 , H01L21/225 , H01L31/04
CPC分类号： H01L21/228 , C08K3/32 , C08K2003/329 , C09D129/04 , C30B29/06 , C30B29/08 , C30B31/04 , H01L21/2225 , H01L29/36 , H01L31/1804 , Y02E10/547 , Y02P70/521 , C08K5/053 , C08L71/02

2. 发明专利

JP2014148750A Metal composite superfine particle and its manufacturing method 审中-公开
标题翻译：金属复合超细颗粒及其制造方法
公开(公告)号：JP2014148750A
公开(公告)日：2014-08-21
申请号：JP2014002218
申请日：2014-01-09
申请人： Nippon Synthetic Chem Ind Co Ltd:The , 日本合成化学工業株式会社
发明人： SATO HIROAKI
IPC分类号： B22F1/02 , B22F1/00 , B22F9/24 , H01B5/00 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a metal composite superfine particle excellent in reactivity and method of manufacturing the metal composite superfine particle manufacturing the particle in high efficiency.SOLUTION: Metal composite superfine particles are used having an average 1.2 or more of circularity of particles photographed by a transmission electron microscope and an average particle major axis of 1 to 200 nm. There is provided a method of manufacturing the metal composite superfine particle whose metal species are gold, silver and copper, by reacting inorganic metal salts and higher alcohols with heating and stirring the inorganic metal salts and the higher alcohols, including a process of stirring at 20 to 120°C for at least 5 minutes and a process of stirring at 120°C to 300°C for at least 5 minutes, and the stirring processes satisfy a condition represented by the formula (1). 0.05≤Δt/D≤0.8 (1), where D is a radius of a swirl on a surface of a liquid during stirring and Δt is difference of the lowest point and the highest point of the swirl.
摘要翻译：要解决的问题：提供一种反应性优异的金属复合超细颗粒和制造高效率的颗粒的金属复合超细颗粒的方法。解决方案：使用金属复合超细颗粒，其平均具有1.2或更多的圆形颗粒拍摄通过透射电子显微镜，平均粒子长轴为1〜200nm。提供了一种通过加热和搅拌无机金属盐和高级醇来制造金属种类为金，银和铜的金属复合超细颗粒的方法，包括在20℃下搅拌的过程至120℃至少5分钟，并在120℃至300℃下搅拌至少5分钟，并且搅拌过程满足由式（1）表示的条件。 0.05≤＆Dgr; t /D≤0.8（1）其中D是搅拌期间液体表面的漩涡半径，Dgr是最低点和最高点之间的差。

3. 发明专利

JP2013072136A Method for producing metal composite hyperfine particle 有权
标题翻译：生产金属复合高分子粒子的方法
公开(公告)号：JP2013072136A
公开(公告)日：2013-04-22
申请号：JP2011214654
申请日：2011-09-29
申请人： Nippon Synthetic Chem Ind Co Ltd:The , 日本合成化学工業株式会社
发明人： SATO HIROAKI
IPC分类号： B22F9/20 , B22F1/02 , B22F9/30 , B82Y40/00 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a method for producing metal composite hyperfine particles, which produces the metal composite hyperfine particles in good yield by improving reactivity in the production of metal composite hyperfine particles.SOLUTION: In the method for producing metal composite hyperfine particles by heating an inorganic metal salt and a higher alcohol and bringing them into reaction, the reaction is performed while removing moisture content obtained as a by-product in the heating reaction of the inorganic metal salt and the higher alcohol.
摘要翻译：要解决的问题：提供一种制备金属复合超细颗粒的方法，其通过提高金属复合超细颗粒的制备中的反应性而以良好的收率产生金属复合超细颗粒。解决方案：在通过加热无机金属盐和高级醇并使其反应生产金属复合超细颗粒的方法中，在除去在加热反应中作为副产物获得的水分含量的同时进行反应无机金属盐和高级醇。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2007035719A Coating liquid for boron diffusion 有权
标题翻译：涂料液用于硼的扩散
公开(公告)号：JP2007035719A
公开(公告)日：2007-02-08
申请号：JP2005213030
申请日：2005-07-22
申请人： Naoetsu Electronics Co Ltd , Nippon Synthetic Chem Ind Co Ltd:The , Sanken Electric Co Ltd , サンケン電気株式会社 , 日本合成化学工業株式会社 , 直江津電子工業株式会社
发明人： SATO HIROAKI
IPC分类号： H01L21/225
CPC分类号： H01L21/2225
摘要： PROBLEM TO BE SOLVED: To provide a coating liquid for boron diffusion for diffusing boron in higher concentration to a large size wafer larger than 4 inches without fluctuation of resistance value of a semiconductor device.
SOLUTION: In the coating liquid for boron diffusion; (A) a boron compound, (B) a water-soluble polymer compound, and (C) water are contained, and viscosity at 20°C is ranged to 100,000 mPa s from 500 mPa s.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于硼扩散的涂布液，用于将硼浓度更高的硼扩散到大于4英寸的大尺寸晶片，而半导体器件的电阻值没有波动。
解决方案：在硼扩散涂层液中; （A）硼化合物，（B）水溶性聚合物化合物和（C）水，并且在20℃下的粘度从500mPa·s到达100,000mPa·s。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006178083A Photosensitive resin composition, and photoresist film and resist pattern forming method using the same 审中-公开
标题翻译：光敏树脂组合物和光刻胶膜及其形成方法
公开(公告)号：JP2006178083A
公开(公告)日：2006-07-06
申请号：JP2004369717
申请日：2004-12-21
申请人： Nippon Synthetic Chem Ind Co Ltd:The , 日本合成化学工業株式会社
发明人： SATO HIROAKI , TSUJIMOTO ATSUSHI
IPC分类号： G03F7/004 , G03F7/027 , G03F7/033 , G03F7/11 , H01J9/02 , H01J11/02 , H01J11/22 , H01J11/34
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition and a photoresist film very excellent in sensitivity, resolution, thin line adhesion and pattern forming property even under a low exposure condition. SOLUTION: The photosensitive resin composition contains a carboxylic polymer (A), an ethylenically unsaturated compound (B), a photopolymerization initiator (C) and a compound (D) represented by formula (I) wherein R 1 and R 2 each independently denote a 1-10C alkyl, a 6-20C aryl, a 6-20C alkyl-substituted aryl, a 6-20C aryloxy-substituted aryl or a 6-20C alkoxy-substituted aryl; R 7 and R 8 each independently denote H, a 1-10C alkyl, a 6-20C aryl, a 1-10C alkoxy or a 6-20C aryloxy; and X denotes a divalent group represented by specific formula. The photoresist film and a resist pattern forming method using the photosensitive resin composition are also provided. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使在低曝光条件下，也提供了灵敏度，分辨率，细线粘附性和图案形成性能非常优异的感光性树脂组合物和光致抗蚀剂膜。解决方案：感光性树脂组合物含有羧酸聚合物（A），烯键式不饱和化合物（B），光聚合引发剂（C）和式（I）表示的化合物（D），其中R / SP>和R 2 各自独立地表示1-10C烷基，6-20C芳基，6-20C烷基取代的芳基，6-20C芳氧基取代的芳基或6-20C 烷氧基取代的芳基; R 7 和R 8 各自独立地表示H，1-10C烷基，6-20C芳基，1-10C烷氧基或6-20C芳氧基; X表示由具体式表示的二价基团。还提供了光致抗蚀剂膜和使用该感光性树脂组合物的抗蚀剂图案形成方法。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005321587A Photosensitive resin composition, and photoresist film and resist pattern forming method using the same 有权
标题翻译：光敏树脂组合物和光刻胶膜及其形成方法
公开(公告)号：JP2005321587A
公开(公告)日：2005-11-17
申请号：JP2004139335
申请日：2004-05-10
申请人： Nippon Synthetic Chem Ind Co Ltd:The , 日本合成化学工業株式会社
发明人： SATO HIROAKI , KATSUMA KATSUHIKO , TSUJIMOTO ATSUSHI
IPC分类号： G03F7/033 , C08F2/50 , G03F7/004 , G03F7/027
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition and a photoresist film having high sensitivity, high resolution, high adhesion of thin lines and excellent pattern forming property even under a condition of low exposure energy by blue-violet laser exposure. SOLUTION: The photosensitive resin composition and the photoresist film used in exposure with a laser exposure machine giving an exposure wavelength of 390-420 nm comprise a carboxylic polymer (A), an ethylenically unsaturated compound (B), a photopolymerization initiator (C) and at least one compound (D) selected from perylene, naphtho[2,3-a]pyrene, benzopyrene, dibenzo[b,def]chrysene and 9,10-diphenylanthracene. A resist pattern forming method using the same is also provided. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使在通过蓝紫激光曝光的低曝光能量的条件下，提供具有高灵敏度，高分辨率，细线粘附性和优异的图案形成性能的光敏树脂组合物和光致抗蚀剂膜。解决方案：用曝光波长为390-420nm的激光曝光机曝光的感光性树脂组合物和光致抗蚀剂膜包含羧酸聚合物（A），烯属不饱和化合物（B），光聚合引发剂（ C）和至少一种选自苝，萘并[2,3-a]芘，苯并芘，二苯并[b，def]和9,10-二苯基蒽的化合物（D）。还提供了使用其的抗蚀剂图案形成方法。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2003026945A Water-dispersible resin composition for printed circuit board punching, sheet prepared therefrom, and punching method for printed circuit board using the sheet 有权
标题翻译：用于印刷电路板打孔的水分散树脂组合物，其制备的片材以及使用该片材的印刷电路板的打孔方法
公开(公告)号：JP2003026945A
公开(公告)日：2003-01-29
申请号：JP2001216186
申请日：2001-07-17
申请人： Nippon Synthetic Chem Ind Co Ltd:The , 日本合成化学工業株式会社
发明人： IZUMI TSUKASA , SATO HIROAKI
IPC分类号： B23B35/00 , C08J5/18 , C08L29/04 , C08L33/06 , C08L101/00 , C08L101/14 , H05K1/03 , H05K3/00 , H05K3/42 , H05K3/46
CPC分类号： C08L101/00 , C08L101/14 , H05K3/0047 , H05K2203/0214 , H05K2203/0769 , H05K2203/0786 , H05K2203/127 , Y10T29/49117 , Y10T428/31692 , Y10T428/31699 , Y10T428/31855 , C08L2666/04
摘要： PROBLEM TO BE SOLVED: To provide a water-dispersible resin composition for printed circuit board punching which is excellent in accuracy of working position during punching and in throwing power of plating; a sheet for punching; and a punching method for a printed circuit board using the sheet. SOLUTION: This water-dispersible resin composition contains (A) a water-soluble polymer and (B) a polymer containing polymerized units derived from a compound represented by formula (1) (wherein R is H or methyl; and n is an integer of 10-22). A sheet for punching prepared from the resin composition and a punching method for a printed circuit board using the sheet are also provided.
摘要翻译：要解决的问题：提供一种印刷电路板冲孔用水分散性树脂组合物，其在冲压加工中的工作位置的精度和电镀抛光力均优异; 打孔片以及使用该片材的印刷电路板的冲压方法。解决方案：该水分散性树脂组合物含有（A）水溶性聚合物和（B）含有由式（1）表示的化合物衍生的聚合单元的聚合物（其中R为H或甲基; n为整数 10-22）。还提供了由树脂组合物制备的冲孔用片材和使用该片材的印刷电路板的冲压方法。

8. 发明专利

JP2002214781A PHOTOSENSITIVE RESIN COMPOSITION 审中-公开
公开(公告)号：JP2002214781A
公开(公告)日：2002-07-31
申请号：JP2001356185
申请日：2001-11-21
申请人： NIPPON SYNTHETIC CHEM IND
发明人： SATO HIROAKI
IPC分类号： G03F7/027 , G03F7/004 , H01J9/02 , H01J11/22 , H01J11/34 , H01J11/36 , H01J11/02
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in developing solution resistance, sandblast resistance, etc. SOLUTION: The photosensitive resin composition contains a specified carboxyl-containing urethane-acrylic resin (A), an acrylic polymer (B) containing a hydroxyl-containing monofunctional monomer by >=50 wt.% as proportion in copolymerization and having

9. 发明专利

JP2001117226A PHOTOSENSITIVE RESIN COMPOSITION 失效
公开(公告)号：JP2001117226A
公开(公告)日：2001-04-27
申请号：JP29311499
申请日：1999-10-15
申请人： NIPPON SYNTHETIC CHEM IND
发明人： SATO HIROAKI
IPC分类号： G03F7/004 , G03F7/027 , H01J11/22 , H01J11/34 , H01J11/36 , H01J11/02
摘要： PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition having high sandblast resistance and excellent in handleability owing to the lowering of the peeling strength of a protective film when it is formed as a dry film resist. SOLUTION: The photosensitive resin composition contains a carboxyl- containing urethane (meth)acrylate compound (A) having 10-150 mgKOH/g acid value, a photopolymerization initiator (B) and a hydroxy-fatty acid or its derivative (C). Preferably the composition further contains a urethane (meth)acrylate compound (D) having no acid value.

10. 发明专利

JP2001092131A PHOTOSENSITIVE RESIN COMPOSITION 失效
公开(公告)号：JP2001092131A
公开(公告)日：2001-04-06
申请号：JP36627899
申请日：1999-12-24
申请人： NIPPON SYNTHETIC CHEM IND
发明人： SATO HIROAKI , KATSUMA KATSUHIKO
IPC分类号： C08F2/48 , C08F299/06 , G03F7/004 , G03F7/027 , G03F7/028 , G03F7/033 , H01J11/20 , H01J11/36 , H01J11/02
摘要： PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition excellent in developing solution resistance, sandblast resistance, handleability, preservability, etc. SOLUTION: The photosensitive resin composition contains a carboxy- containing urethane (meth)acrylate compound (A), a high molecular compound (B) containing vinylpyrrolidone and/or vinylcaprolactam as a copolymerized component and a photopolymerization initiator (C). Preferably the composition further contains a specified urethane acrylic resin (D).

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