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    • 2. 发明申请
    • APPARATUS AND METHODS FOR TRANSPORT OF CHARGED BIOLOGICAL MATERIALS
    • 用于运输带电生物材料的装置和方法
    • WO0032744A9
    • 2000-11-23
    • PCT/US9927668
    • 1999-11-22
    • NANOGEN INC
    • ACKLEY DONALD ESHELDON EDWARD LKRIHAK MICHAEL K
    • C12M1/40
    • C12M1/40
    • Methods, apparatus, and applications for use of a stacked, reconfigurable system for electrophoretic transport are provided. In one embodiment, a system having a first chamber including at least a bottom support and an intermediate support, and a second chamber, said second chamber including a bottom support and a top member, the first and second chambers being coupled through a via. Electrophoretic, and optional electroosmotic and thermal, transport is effected. In another aspect of this invention, three or more chambers are coupled by an electrophoretic buss. The electrophoretic buss includes driving electrodes and is adapted to receive fluid containing materials for transport. The chambers are coupled to the electrophoretic buss and serve as a tap from the buss for delivery of charged materials. In one embodiment, certain functions are performed in different chambers. For example, the first chamber may receive the sample and perform sample processing functions, the second chamber may perform amplification procedures, yet a third chamber may perform hybridization or other assays, and yet another chamber may perform immunoassays. By separating various functions to different chambers, speed and sensitivity may be improved. In yet another aspect of this invention, analysis from a earlier stage may be utilized in a subsequent stage to reconfigure the system for optimum use. In one application, analysis at a first level is utilized to determine an action at a second level, such as the synthesis of a compound. The synthesized compound in response to a biohazard may comprise vaccine or antidote.
    • 提供了用于电泳传输的堆叠可重构系统的方法,设备和应用。 在一个实施例中,一种具有第一腔室和第二腔室的系统,所述第一腔室包括至少底部支撑件和中间支撑件以及第二腔室,所述第二腔室包括底部支撑件和顶部构件,所述第一和第二腔室通过通孔耦合。 电泳和任选的电渗透和热传输是有效的。 在本发明的另一方面,三个或更多个腔室通过电泳总线耦合。 电泳总线包括驱动电极并且适于接收包含运输材料的流体。 这些腔室连接到电泳总线上,并用作来自总线的抽头以输送带电材料。 在一个实施例中,某些功能在不同的室中执行。 例如,第一室可以接收样品并执行样品处理功能,第二室可以执行扩增程序,但第三室可以执行杂交或其他测定,而另一室可以执行免疫测定。 通过将不同的功能分离到不同的室中,可以提高速度和灵敏度。 在本发明的另一个方面,可以在后续阶段利用来自较早阶段的分析来重新配置系统以获得最佳使用。 在一个应用中,利用第一级的分析来确定第二级的作用,例如化合物的合成。 响应生物危害的合成化合物可以包含疫苗或解毒剂。
    • 10. 发明专利
    • LAMINATED ASSEMBLY FOR ACTIVE BIOELECTRONIC DEVICES
    • CA2274047A1
    • 1998-06-11
    • CA2274047
    • 1997-11-26
    • NANOGEN INC
    • SHELDON EDWARD L IIIACKLEY DONALD EJACKSON THOMAS R
    • G01N27/447B01J19/00B01L3/00B01L7/00C07B61/00C07H21/00C07K1/04C12Q1/68C40B40/06C40B40/10C40B40/12C40B60/14F04B19/00G11C13/02G11C19/00H01L21/336H01L21/98H01L29/78F04B43/04G01N33/543
    • Methods of manufacture and devices for performing active biological operations utilize laminated structures (30, 110). In the preferred embodiment, a first planar sample support (50, 72, 104, 122) includes at least one sample through hole (56, 74, 90) a planar electrode (32, 70, 94, 112, 114) is disposed adjacent the first planar sample support (50, 72, 104, 122), and includes an electrode through region (38, 76), a second planar support (40, 78, 96, 102, 124) includes a vent through hole (48, 80, 92, 98), the planar electrode (32, 70, 94, 112, 114) being in a laminated relationship between the first planar sample support (50, 72, 104, 122) and the second planar support (40, 78, 96, 102, 124), further characterized in that the sample through hole (56, 74, 90), electrode through hole (38, 76) and vent through hole (48, 80, 92, 98) are in overlapping arrangement. Preferably, some or all of the through holes, through regions and vent through holes are aligned. In one embodiment, the lateral dimension of the vent through hole is larger than the lateral dimension of the electrode through hole. In an alternative embodiment, the lateral dimension of the sample through hole is larger than the lateral dimension of the vent through hole. In the preferred embodiment, the sample support and planar support are formed of sheet material, most preferably polyimide, having a thickness from substantially 1 to substantially 5 mils. Electrodes are preferably chosen from noble metals, especially gold. Holes or through regions are preferably formed through laser drilling, optionally followed by chemical etching. Interconnect vias provide conductive paths through multiple supports, and are advantageously utilized with hybridized circuitry, especially chip-on flex circuitry.