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1. 发明授权

US08881381B2 Method of manufacturing printed circuit board 有权
标题翻译：制造印刷电路板的方法
公开(公告)号：US08881381B2
公开(公告)日：2014-11-11
申请号：US12631594
申请日：2009-12-04
申请人： Mi Sun Hwang , Myung Sam Kang , Ok Tae Kim , Seon Ha Kang , Gil Yong Shin , Kil Yong Yun , Min Jung Cho
发明人： Mi Sun Hwang , Myung Sam Kang , Ok Tae Kim , Seon Ha Kang , Gil Yong Shin , Kil Yong Yun , Min Jung Cho
IPC分类号： H05K3/36 , H05K3/10 , H05K3/20 , H05K3/46 , H05K3/00 , H05K3/42
CPC分类号： H05K3/4685 , H05K3/0097 , H05K3/205 , H05K3/421 , H05K2201/0376 , H05K2203/0152 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.
摘要翻译：本文公开了一种制造印刷电路板的方法，包括：制备第一载体，其包括在其一侧上形成的第一图案; 制备包括在其一侧上顺序形成的第一阻焊层和第二图案的第二载体; 按压第一载体和第二载体，使得第一图案嵌入绝缘层的一侧，并且将第二图案嵌入绝缘层的另一侧，然后移除第一载体和第二载体以制造两个基板 ; 使用粘合层将两个基板彼此连接，使得第一阻焊层彼此面对; 以及形成用于在绝缘层中连接第一图案与第二图案的通孔，在设置有第一图案的绝缘层上形成第二阻焊剂，然后除去粘合层。

2. 发明申请

US20110067233A1 Method of fabricating printed circuit board 审中-公开
标题翻译：制造印刷电路板的方法
公开(公告)号：US20110067233A1
公开(公告)日：2011-03-24
申请号：US12654669
申请日：2009-12-29
申请人： Seon Ha Kang , Myung Sam Kang , Mi Sun Hwang , Kil Yong Yun , Min Jung Cho , Gil Yong Shin , Ok Tae Kim
发明人： Seon Ha Kang , Myung Sam Kang , Mi Sun Hwang , Kil Yong Yun , Min Jung Cho , Gil Yong Shin , Ok Tae Kim
IPC分类号： H05K3/10
CPC分类号： H05K3/465 , H05K3/0041 , H05K3/045 , H05K3/064 , H05K3/107 , H05K3/108 , H05K3/4602 , H05K3/4611 , H05K2201/09036 , Y10T29/49155
摘要： A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity.
摘要翻译：一种制造印刷电路板的方法，所述方法包括：提供具有形成有第一电路图案的第一表面的绝缘基体和与所述第一表面相对的第二表面; 将绝缘基体的第一表面压在绝缘层的至少一个表面上，使得第一电路图案嵌入绝缘层中; 在绝缘基体的第二表面上形成具有所需图案的抗蚀剂; 通过在其上形成有抗蚀剂的绝缘基体的第二表面上进行等离子体处理来形成沟槽; 以及通过用导电材料填充所述沟槽来形成第二电路图案。因此，可以使用简单的工艺形成导电图案，从而提高处理速度和生产率。

3. 发明申请

US20100193232A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20100193232A1
公开(公告)日：2010-08-05
申请号：US12424511
申请日：2009-04-15
申请人： Myung Sam Kang , Ok Tae Kim , Gil Yong Shin , Kil Yong Yun
发明人： Myung Sam Kang , Ok Tae Kim , Gil Yong Shin , Kil Yong Yun
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K3/4084 , H05K3/205 , H05K3/328 , H05K2201/091 , H05K2203/063 , H05K2203/1115 , H05K2203/1572 , Y10T29/49155
摘要： Disclosed herein are a printed circuit board and a process of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and circuit layers disposed at both sides of the insulating layer, each of the circuit layers including a land part and a pattern part. The land parts formed on both sides of the insulating layer are coupled to each other using electrical resistance welding. There is no need for a separate interlayer connection structure such as vias or bumps and a process of forming the interlayer connection structure, thus simplifying the printed circuit board and the process.
摘要翻译：这里公开了印刷电路板和制造印刷电路板的工艺。印刷电路板包括绝缘层和设置在绝缘层两侧的电路层，每个电路层包括焊盘部分和图案部分。形成在绝缘层两侧的接地部分使用电阻焊接彼此连接。不需要诸如通孔或凸块的单独的层间连接结构和形成层间连接结构的过程，因此简化了印刷电路板和工艺。

4. 发明申请

US20110061912A1 Printed circuit board and manufacturing method thereof 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20110061912A1
公开(公告)日：2011-03-17
申请号：US12654668
申请日：2009-12-29
申请人： Myung Sam Kang , Mi Sun Hwang , Ok Tae Kim , Seon Ha Kang , Gil Yong Shin , Kil Yong Yun , Min Jung Cho
发明人： Myung Sam Kang , Mi Sun Hwang , Ok Tae Kim , Seon Ha Kang , Gil Yong Shin , Kil Yong Yun , Min Jung Cho
IPC分类号： H05K1/00 , H05K1/11 , B32B38/10 , B29C65/00
CPC分类号： H05K3/4611 , H05K3/045 , H05K3/4069 , H05K3/421 , H05K3/4652 , H05K2201/0355 , H05K2201/0394 , H05K2201/09509 , H05K2201/09518 , H05K2201/096 , H05K2203/1461 , H05K2203/1536 , Y10T156/10
摘要： Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.
摘要翻译：提供了一种印刷电路板（PCB）及其制造方法。 PCB包括堆叠结构，其包括其间插入有第一绝缘层的第二绝缘层和第三绝缘层，以及具有第一至第四导电通孔的导电通孔。在第一绝缘层中埋设第二层电路图形和第三层电路图案，在第二绝缘层上形成第一层电路图案，在第三绝缘层上形成第四层电路图形。第一导电通孔连接第一层电路图案和第二层电路图案，第二导电通孔连接第一层电路图案和第三层电路图案，第三导电通孔连接第二层电路图案和第四层电路图案和第四导电通孔连接第三层电路图案和第四层电路图案。

5. 发明申请

US20100132985A1 Printed circuit board having metal bump and method of manufacring the same 有权
标题翻译：具有金属凸块的印刷电路板及其制造方法
公开(公告)号：US20100132985A1
公开(公告)日：2010-06-03
申请号：US12379684
申请日：2009-02-26
申请人： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
发明人： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
IPC分类号： H05K1/09 , H05K3/20 , H05K1/11
CPC分类号： H05K1/111 , H05K1/09 , H05K1/115 , H05K3/205 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2203/0323 , H05K2203/0376 , Y02P70/611 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
摘要： The invention relates to a printed circuit board having metal bumps which are of even heights and are directly connected to a circuit pattern without using additional bump pads thus allowing an arrangement thereof at fine pitches.
摘要翻译：本发明涉及具有均匀高度的金属凸块并且直接连接到电路图案的印刷电路板，而不使用额外的凸块，从而允许以细间距进行布置。

6. 发明申请

US20120061132A1 Printed circuit board having metal bumps 审中-公开
标题翻译：具有金属凸块的印刷电路板
公开(公告)号：US20120061132A1
公开(公告)日：2012-03-15
申请号：US13373388
申请日：2011-11-14
申请人： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
发明人： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
IPC分类号： H05K1/09 , H05K1/11 , H05K1/02
CPC分类号： H05K1/111 , H05K1/09 , H05K1/115 , H05K3/205 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2203/0323 , H05K2203/0376 , Y02P70/611 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
摘要： A printed circuit board having a metal bump, including: an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; wherein the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer.
摘要翻译：一种具有金属凸块的印刷电路板，包括：上电路层，包括嵌入在绝缘层的上部的电路图案，所述电路图案由导电金属制成; 其中所述金属凸块与所述电路图形一体地形成并且从所述电路图案突出并且在所述绝缘层上方突出。

7. 发明授权

US08464423B2 Method of manufacturing a printed circuit board having metal bumps 有权
标题翻译：制造具有金属凸块的印刷电路板的方法
公开(公告)号：US08464423B2
公开(公告)日：2013-06-18
申请号：US13373387
申请日：2011-11-14
申请人： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
发明人： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
IPC分类号： H01R9/00 , H01R43/16 , H01R43/00 , H05K3/00 , H05K3/02 , H05K3/10
CPC分类号： H05K1/111 , H05K1/09 , H05K1/115 , H05K3/205 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2203/0323 , H05K2203/0376 , Y02P70/611 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
摘要： A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.
摘要翻译：一种制造具有金属凸块的印刷电路板的方法，包括：在第一载体上形成用于形成金属凸块的凹部，在第一载体上形成第一阻挡层，并在第一阻挡层上形成上电路层所述上电路层包括充电在所述凹部中的金属凸块和电路图案; 在第二载体上形成第二阻挡层，并在第二阻挡层上形成下电路层; 制备绝缘层，并将上下电路层转移到绝缘层; 移除第一和第二载体; 以及去除所述第一和第二阻挡层。

8. 发明申请

US20120060365A1 Method of manufacturing a printed circuit board having metal bumps 有权
标题翻译：制造具有金属凸块的印刷电路板的方法
公开(公告)号：US20120060365A1
公开(公告)日：2012-03-15
申请号：US13373387
申请日：2011-11-14
申请人： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
发明人： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
IPC分类号： H05K3/00
CPC分类号： H05K1/111 , H05K1/09 , H05K1/115 , H05K3/205 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2203/0323 , H05K2203/0376 , Y02P70/611 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
摘要： A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.
摘要翻译：一种制造具有金属凸块的印刷电路板的方法，包括：在第一载体上形成用于形成金属凸块的凹部，在第一载体上形成第一阻挡层，并在第一阻挡层上形成上电路层所述上电路层包括充电在所述凹部中的金属凸块和电路图案; 在第二载体上形成第二阻挡层，并在第二阻挡层上形成下电路层; 制备绝缘层，并将上下电路层转移到绝缘层; 移除第一和第二载体; 以及去除所述第一和第二阻挡层。

9. 发明授权

US08141241B2 Method of manufacturing a printed circuit board having metal bumps 有权
标题翻译：制造具有金属凸块的印刷电路板的方法
公开(公告)号：US08141241B2
公开(公告)日：2012-03-27
申请号：US12379684
申请日：2009-02-26
申请人： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
发明人： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
IPC分类号： H01R9/00 , H01R43/16 , H01R43/00 , H05K3/00 , H05K3/02 , H05K3/10 , H05K1/11
CPC分类号： H05K1/111 , H05K1/09 , H05K1/115 , H05K3/205 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2203/0323 , H05K2203/0376 , Y02P70/611 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
摘要： A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a metal carrier; forming a barrier layer on the metal carrier including the recess; forming an upper circuit layer on the barrier layer, the upper circuit layer including the metal bump charged in the recess and a circuit pattern; preparing an insulating layer, and transferring the upper circuit layer to the insulating layer; and removing the metal carrier and the barrier layer.
摘要翻译：一种制造具有金属凸块的印刷电路板的方法，包括：在金属载体上形成用于形成金属凸块的凹槽; 在包括所述凹部的所述金属载体上形成阻挡层; 在所述阻挡层上形成上层电路层，所述上层电路层包括填充在所述凹部中的所述金属凸块和电路图案; 制备绝缘层，并将上电路层转移到绝缘层; 并移除金属载体和阻挡层。

10. 发明授权

US08080741B2 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US08080741B2
公开(公告)日：2011-12-20
申请号：US12149522
申请日：2008-05-02
申请人： Myung Sam Kang , Chin Kwan Kim
发明人： Myung Sam Kang , Chin Kwan Kim
IPC分类号： H05K1/11
CPC分类号： H05K3/4007 , H05K3/246 , H05K3/3457 , H05K3/4069 , H05K2201/0347 , H05K2201/0367 , H05K2201/0376 , H05K2201/09481 , H05K2201/09745
摘要： A printed circuit board, which increases the contact area between an IC and a printed circuit board, thus increasing the degree of adhesion, is disclosed. The printed circuit board includes: an insulation layer which includes a first circuit pattern, including at least one via land, embedded in the upper surface of the insulation layer to be flush with the upper surface, and a second circuit pattern formed in the lower surface of the insulation layer to be flush with the lower surface; a solder resist layer formed on the insulation layer; a via hole and a bump integrally formed on the second circuit pattern through the via hole and the via land such that it protrudes from the insulation layer to be higher than the solder resist layer.
摘要翻译：公开了一种印刷电路板，其增加了IC和印刷电路板之间的接触面积，从而增加了粘合度。印刷电路板包括：绝缘层，其包括嵌入在绝缘层的上表面中以与上表面齐平的至少一个通孔焊盘的第一电路图案，以及形成在下表面中的第二电路图案的绝缘层与下表面齐平; 形成在绝缘层上的阻焊层; 通孔和通过通孔和通孔焊盘一体地形成在第二电路图案上的突起，使得其从绝缘层突出成高于阻焊层。

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