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1. 发明申请

US20120255935A1 LASER PROCESSING METHOD 有权
标题翻译：激光加工方法
公开(公告)号：US20120255935A1
公开(公告)日：2012-10-11
申请号：US13369076
申请日：2012-02-08
申请人： Motoki KAKUI , Hiroshi Kohda , Yasuomi Kaneuchi , Shinobu Tamaoki , Shigehiro Nagano , Yoshiyuki Uno , Yasuhiro Okamoto , Kenta Takahashi
发明人： Motoki KAKUI , Hiroshi Kohda , Yasuomi Kaneuchi , Shinobu Tamaoki , Shigehiro Nagano , Yoshiyuki Uno , Yasuhiro Okamoto , Kenta Takahashi
IPC分类号： B23K26/00
CPC分类号： B23K26/40 , B23K26/0006 , B23K26/0617 , B23K26/0869 , B23K26/10 , B23K26/36 , B23K26/361 , B23K26/364 , B23K26/38 , B23K26/53 , B23K26/57 , B23K2103/50 , B23K2103/56 , H01L21/302
摘要： There is obtained a laser processing method by which an excellent shape of a cut surface can be achieved and an increase in cost can be suppressed. A laser processing method includes the steps of: preparing a material to be processed; and forming a modified area in the material to be processed, by irradiating the material to be processed with laser beam. In the aforementioned step, pulsed laser beam having a continuous spectrum is focused with a lens, thereby forming a focusing line constituted by a plurality of focuses that are obtained by predetermined bands forming the continuous spectrum of the laser beam, and the material to be processed is irradiated with the laser beam such that at least a part of the focusing line is located on a surface of the material to be processed, thereby forming the modified area on an axis of the focusing line.
摘要翻译：获得能够实现切割面的优良形状并且可以抑制成本增加的激光加工方法。激光加工方法包括以下步骤：准备待加工材料; 并且通过用激光束照射被处理材料，在被处理材料中形成改质区域。在上述步骤中，具有连续光谱的脉冲激光束与透镜聚焦，从而形成由通过形成激光束的连续光谱的预定带获得的多个聚焦构成的聚焦线，以及待处理的材料用激光束照射使得聚焦线的至少一部分位于待处理材料的表面上，从而在聚焦线的轴上形成改质区域。

2. 发明授权

US08933367B2 Laser processing method 有权
标题翻译：激光加工方法
公开(公告)号：US08933367B2
公开(公告)日：2015-01-13
申请号：US13369076
申请日：2012-02-08
申请人： Motoki Kakui , Hiroshi Kohda , Yasuomi Kaneuchi , Shinobu Tamaoki , Shigehiro Nagano , Yoshiyuki Uno , Yasuhiro Okamoto , Kenta Takahashi
发明人： Motoki Kakui , Hiroshi Kohda , Yasuomi Kaneuchi , Shinobu Tamaoki , Shigehiro Nagano , Yoshiyuki Uno , Yasuhiro Okamoto , Kenta Takahashi
IPC分类号： B23K26/36 , B23K26/00 , B23K26/08 , B23K26/10 , B23K26/38 , B23K26/40 , H01L21/302
CPC分类号： B23K26/40 , B23K26/0006 , B23K26/0617 , B23K26/0869 , B23K26/10 , B23K26/36 , B23K26/361 , B23K26/364 , B23K26/38 , B23K26/53 , B23K26/57 , B23K2103/50 , B23K2103/56 , H01L21/302
摘要： There is obtained a laser processing method by which an excellent shape of a cut surface can be achieved and an increase in cost can be suppressed. A laser processing method includes the steps of: preparing a material to be processed; and forming a modified area in the material to be processed, by irradiating the material to be processed with laser beam. In the aforementioned step, pulsed laser beam having a continuous spectrum is focused with a lens, thereby forming a focusing line constituted by a plurality of focuses that are obtained by predetermined bands forming the continuous spectrum of the laser beam, and the material to be processed is irradiated with the laser beam such that at least a part of the focusing line is located on a surface of the material to be processed, thereby forming the modified area on an axis of the focusing line.
摘要翻译：获得能够实现切割面的优良形状并且可以抑制成本增加的激光加工方法。激光加工方法包括以下步骤：准备待加工材料; 并且通过用激光束照射被处理材料，在被处理材料中形成改质区域。在上述步骤中，具有连续光谱的脉冲激光束与透镜聚焦，从而形成由通过形成激光束的连续光谱的预定带获得的多个聚焦构成的聚焦线，以及待处理的材料用激光束照射使得聚焦线的至少一部分位于待处理材料的表面上，从而在聚焦线的轴上形成改质区域。

3. 发明授权

US08581949B2 Laser marking method 有权
标题翻译：激光打标法
公开(公告)号：US08581949B2
公开(公告)日：2013-11-12
申请号：US12536780
申请日：2009-08-06
申请人： Yasuomi Kaneuchi , Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
发明人： Yasuomi Kaneuchi , Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
IPC分类号： B41J2/435
CPC分类号： B41J2/471 , B41J2/442 , B41M5/24 , H01S3/0064 , H01S3/0078 , H01S3/06708 , H01S3/06758 , H01S3/094003 , H01S3/094007 , H01S3/09408 , H01S3/09415 , H01S3/1618
摘要： The present invention relates to a laser marking method which is capable of changing the grey level of a marking even in the case of a high processing speed. The laser marking method forms a marking pattern on a marking object by irradiating the marking object with pulsed light oscillated from a pulsed light source of a MOPA structure in which a semiconductor laser outputting directly-modulated pulsed light is used as a seed light source. At this time, the pulse duration of the pulsed light is changed in order to change a gray level of the marking pattern to be formed. In this way, a peak power of the pulsed light is changed by changing the pulse duration, so that it is possible to positively change the gray level of the marking pattern without changing the processing speed.
摘要翻译：本发明涉及即使在高处理速度的情况下也能够改变标记的灰度级的激光打标方法。激光标记方法通过用从其中输出直接调制的脉冲光的半导体激光器用作种子光源的MOPA结构的脉冲光源振荡的脉冲光照射标记物体来在标记物体上形成标记图案。此时，改变脉冲光的脉冲持续时间以改变要形成的标记图案的灰度级。以这种方式，通过改变脉冲持续时间来改变脉冲光的峰值功率，从而可以在不改变处理速度的情况下肯定地改变标记图案的灰度级。

4. 发明授权

US08073025B2 Laser light source 有权
标题翻译：激光光源
公开(公告)号：US08073025B2
公开(公告)日：2011-12-06
申请号：US12702613
申请日：2010-02-09
申请人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki , Yasuomi Kaneuchi
发明人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki , Yasuomi Kaneuchi
IPC分类号： H01S3/10 , H01S3/08
CPC分类号： H01S3/067 , H01S3/0811 , H01S3/0812 , H01S3/09415 , H01S3/117 , H01S3/1618
摘要： The present invention relates to a laser light source having a structure for narrowing a wavelength bandwidth of output light. The laser light source comprises, at least, a laser resonator, a pumping light source, an optical path switch device, a diffraction grating, and a total reflection mirror. The laser resonator has a light amplifying fiber for output of emission light arranged on a resonance optical path thereof. The optical path switch device has a first port and a second port on the resonance optical path of the laser resonator. The diffraction grating spectrally separates the emission light outputted from the second port. The total reflection mirror reflects a specific wavelength component out of wavelength components spectrally separated by the diffraction grating, so as to feed the specific wavelength component back to the second port. Particularly, the optical path switch device controls a light transmittable state of the emission light outputted from the light amplifying fiber, at the second port.
摘要翻译：本发明涉及具有使输出光的波长带宽变窄的结构的激光光源。激光源至少包括激光谐振器，泵浦光源，光路开关器件，衍射光栅和全反射镜。激光谐振器具有用于输出布置在其共振光路上的发射光的光放大光纤。光路开关装置在激光谐振器的共振光路上具有第一端口和第二端口。衍射光栅将从第二端口输出的发射光谱分光。全反射镜反射由衍射光栅光谱分离的波长分量中的特定波长分量，以将特定波长分量反馈回第二端口。特别地，光路开关装置控制在第二端口处从光放大光纤输出的发射光的透光状态。

5. 发明授权

US08995479B2 Laser apparatus and laser processing method 有权
标题翻译：激光设备和激光加工方法
公开(公告)号：US08995479B2
公开(公告)日：2015-03-31
申请号：US13477490
申请日：2012-05-22
申请人： Yasuomi Kaneuchi , Motoki Kakui
发明人： Yasuomi Kaneuchi , Motoki Kakui
IPC分类号： H01S3/113 , B23K26/06 , H01S3/067 , H01S3/00 , H01S3/0941 , H01S3/16 , H01S3/094 , H01S3/10
CPC分类号： B23K26/0622 , H01S3/0057 , H01S3/0064 , H01S3/0078 , H01S3/06758 , H01S3/094007 , H01S3/09415 , H01S3/10023 , H01S3/1618
摘要： The present invention relates to a laser apparatus having a structure for removing a skirt portion contained in pulsed light, and a laser processing method using the laser apparatus. The laser apparatus comprises a MOPA fiber laser light source which outputs pulsed light having a skirt portion with a light intensity lower than a predetermined value, and a saturable absorber which removes a skirt portion from the pulsed light outputted from the MOPA fiber laser light source.
摘要翻译：本发明涉及具有去除包含在脉冲光中的裙部的结构的激光装置和使用该激光装置的激光加工方法。激光装置包括输出具有低于预定值的光强度的裙部的脉冲光的MOPA光纤激光光源和从MOPA光纤激光光源输出的脉冲光中除去裙部的可饱和吸收体。

6. 发明申请

US20070138156A1 Laser beam processing machine 有权
标题翻译：激光束加工机
公开(公告)号：US20070138156A1
公开(公告)日：2007-06-21
申请号：US11635539
申请日：2006-12-08
申请人： Keiji Nomaru , Yasuomi Kaneuchi , Hiroshi Morikazu
发明人： Keiji Nomaru , Yasuomi Kaneuchi , Hiroshi Morikazu
IPC分类号： B23K26/06
CPC分类号： B23K26/0869 , B23K26/082 , B23K26/0853 , B23K2101/40
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction (X-axis direction), and an indexing-feed means for moving the chuck table and the laser beam application means relative to each other in an indexing-feed direction (Y-axis direction) perpendicular to the processing-feed direction (X-axis direction), wherein the laser beam application means comprises a laser oscillation means for oscillating a laser beam, a first acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the processing-feed direction (X-axis direction), and a second acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the indexing-feed direction (Y-axis direction).
摘要翻译：一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，用于使卡盘台和激光束施加装置相对移动的加工进给装置（X轴方向）彼此相对移动夹具台和激光束施加机构的分度供给机构，使其相对于彼此垂直的分度方向（Y轴方向）相对移动到处理供给方向（X轴方向），其中激光束施加装置包括用于振荡激光束的激光振荡装置，用于偏转激光振荡的激光束的光轴的第一声光偏转装置光束振荡意味着处理进给方向（X轴方向），以及用于偏转由激光束振荡振荡的激光束的光轴的第二声光偏转装置意味着分度进给方向（Y轴方向）。

7. 发明授权

US07625810B2 Wafer processing method 有权
标题翻译：晶圆加工方法
公开(公告)号：US07625810B2
公开(公告)日：2009-12-01
申请号：US11471532
申请日：2006-06-21
申请人： Keiichi Kajiyama , Koichi Kondo , Yasuomi Kaneuchi
发明人： Keiichi Kajiyama , Koichi Kondo , Yasuomi Kaneuchi
IPC分类号： H01L21/46
CPC分类号： H01L21/3043 , B23K26/382 , B23K26/40 , B23K26/60 , B23K2103/50 , H01L21/304 , H01L21/67132 , H01L21/6836 , H01L21/76898 , H01L24/05 , H01L2221/68327 , H01L2924/14 , Y10S438/94 , Y10S438/959 , Y10S438/977 , H01L2924/00
摘要： A method of processing a wafer having a device area where a plurality of devices are formed on the front surface and an extra area surrounding the device area and comprising electrodes which are formed in the device area, comprising: a reinforcement forming step for removing an area, which corresponds to the device area, in the back surface of the wafer to reduce the thickness of the device area to a predetermined value and keeping an area, which corresponds to the extra area, in the back surface of the wafer to form an annular reinforcement; and a via-hole forming step for forming a via-hole in the electrodes of the wafer which has been subjected to the reinforcement forming step.
摘要翻译：一种处理晶片的方法，所述晶片具有在前表面上形成多个器件的器件区域和围绕器件区域的额外区域，并且包括形成在器件区域中的电极，包括：加强层形成步骤，用于去除区域，其对应于晶片的后表面，以将器件面积的厚度减小到预定值，并将与多余面积对应的面积保持在晶片的背面中，以形成环形加强; 以及通孔形成步骤，用于在经过加强成形步骤的晶片的电极中形成通孔。

8. 发明申请

US20080055588A1 Via hole depth detector 有权
公开(公告)号：US20080055588A1
公开(公告)日：2008-03-06
申请号：US11896336
申请日：2007-08-31
申请人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
发明人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
IPC分类号： G01N21/00
CPC分类号： G01B11/22 , B23K26/03 , B23K26/034 , B23K26/0643 , B23K26/382 , B23K26/40 , B23K2103/50
摘要： A via hole depth detector for detecting the depth of a via hole formed in a workpiece held on a chuck table, comprising: a first surface position detection means which comprises a first detection laser beam oscillation means for oscillating a first detection laser beam having a predetermined wavelength and detects the height position of an illuminated portion of the workpiece based on the reflected light of the first detection laser beam; a second surface position detection means which comprises a second detection laser beam oscillation means for oscillating a second detection laser beam having a wavelength different from the wavelength of the first detection laser beam and detects the height position of an illuminated portion of the workpiece based on the reflected light of the second detection laser beam; and a control means for obtaining the depth of the via hole formed in the workpiece based on a detection value obtained by the first surface position detection means and a detection value obtained by the second surface position detection means.

9. 发明申请

US20060292826A1 Wafer processing method 有权
公开(公告)号：US20060292826A1
公开(公告)日：2006-12-28
申请号：US11471532
申请日：2006-06-21
申请人： Keiichi Kajiyama , Koichi Kondo , Yasuomi Kaneuchi
发明人： Keiichi Kajiyama , Koichi Kondo , Yasuomi Kaneuchi
IPC分类号： H01L21/30
CPC分类号： H01L21/3043 , B23K26/382 , B23K26/40 , B23K26/60 , B23K2103/50 , H01L21/304 , H01L21/67132 , H01L21/6836 , H01L21/76898 , H01L24/05 , H01L2221/68327 , H01L2924/14 , Y10S438/94 , Y10S438/959 , Y10S438/977 , H01L2924/00
摘要： A method of processing a wafer having a device area where a plurality of devices are formed on the front surface and an extra area surrounding the device area and comprising electrodes which are formed in the device area, comprising: a reinforcement forming step for removing an area, which corresponds to the device area, in the back surface of the wafer to reduce the thickness of the device area to a predetermined value and keeping an area, which corresponds to the extra area, in the back surface of the wafer to form an annular reinforcement; and a via-hole forming step for forming a via-hole in the electrodes of the wafer which has been subjected to the reinforcement forming step.

10. 发明申请

US20080037596A1 Laser beam irradiation apparatus and laser working machine 有权
标题翻译：激光束照射设备和激光加工机
公开(公告)号：US20080037596A1
公开(公告)日：2008-02-14
申请号：US11890826
申请日：2007-08-08
申请人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru , Yasuomi Kaneuchi
发明人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru , Yasuomi Kaneuchi
IPC分类号： H01S3/10 , A61N5/01
CPC分类号： G02F1/33 , B23K26/0624 , B23K26/0853 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50 , G02F1/113 , G02F2001/291 , G02F2201/16
摘要： A laser beam irradiation apparatus includes a laser beam oscillation unit including a pulse laser beam oscillator for oscillating a pulse laser beam and a cycle frequency setting unit for setting the cycle frequency, an acousto-optic deflection unit for deflecting the optical axis of the pulse laser beam oscillated from the laser beam oscillation section, and a control unit for controlling the acousto-optic deflection unit. The control unit outputs a driving pulse signal having a predetermined time width including a pulse width of the pulse laser beam oscillated from the pulse laser beam oscillator to the acousto-optic deflection unit based on the cycle frequency setting signal from the cycle frequency setting section.
摘要翻译：激光束照射装置包括激光束振荡单元，其包括用于振荡脉冲激光束的脉冲激光束振荡器和用于设定周期频率的周期频率设定单元，用于偏转脉冲激光器的光轴的声光偏转单元从激光束振荡部分振荡的光束，以及用于控制声光偏转单元的控制单元。控制单元根据来自循环频率设定部的周期频率设定信号，将具有从脉冲激光束振荡器振荡的脉冲激光束的脉冲宽度的预定时间宽度的驱动脉冲信号输出到声光偏转部。

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