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1. 发明申请

US20080055588A1 Via hole depth detector 有权
公开(公告)号：US20080055588A1
公开(公告)日：2008-03-06
申请号：US11896336
申请日：2007-08-31
申请人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
发明人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
IPC分类号： G01N21/00
CPC分类号： G01B11/22 , B23K26/03 , B23K26/034 , B23K26/0643 , B23K26/382 , B23K26/40 , B23K2103/50
摘要： A via hole depth detector for detecting the depth of a via hole formed in a workpiece held on a chuck table, comprising: a first surface position detection means which comprises a first detection laser beam oscillation means for oscillating a first detection laser beam having a predetermined wavelength and detects the height position of an illuminated portion of the workpiece based on the reflected light of the first detection laser beam; a second surface position detection means which comprises a second detection laser beam oscillation means for oscillating a second detection laser beam having a wavelength different from the wavelength of the first detection laser beam and detects the height position of an illuminated portion of the workpiece based on the reflected light of the second detection laser beam; and a control means for obtaining the depth of the via hole formed in the workpiece based on a detection value obtained by the first surface position detection means and a detection value obtained by the second surface position detection means.

2. 发明授权

US07471384B2 Via hole depth detector 有权
标题翻译：通孔深度检测器
公开(公告)号：US07471384B2
公开(公告)日：2008-12-30
申请号：US11896336
申请日：2007-08-31
申请人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
发明人： Keiji Nomaru , Hiroshi Morikazu , Yasuomi Kaneuchi , Kouichi Nehashi , Yutaka Kobayashi
IPC分类号： G01N21/00
CPC分类号： G01B11/22 , B23K26/03 , B23K26/034 , B23K26/0643 , B23K26/382 , B23K26/40 , B23K2103/50
摘要： A via hole depth detector for detecting the depth of a via hole formed in a workpiece held on a chuck table, comprising: a first surface position detection means which comprises a first detection laser beam oscillation means for oscillating a first detection laser beam having a predetermined wavelength and detects the height position of an illuminated portion of the workpiece based on the reflected light of the first detection laser beam; a second surface position detection means which comprises a second detection laser beam oscillation means for oscillating a second detection laser beam having a wavelength different from the wavelength of the first detection laser beam and detects the height position of an illuminated portion of the workpiece based on the reflected light of the second detection laser beam; and a control means for obtaining the depth of the via hole formed in the workpiece based on a detection value obtained by the first surface position detection means and a detection value obtained by the second surface position detection means.
摘要翻译：一种通孔深度检测器，用于检测形成在保持在卡盘台上的工件中的通孔的深度，包括：第一表面位置检测装置，包括第一检测激光束振荡装置，用于振荡具有预定基于第一检测激光束的反射光检测被照射部分的高度位置; 第二表面位置检测装置，其包括用于振荡具有与第一检测激光束的波长不同的波长的第二检测激光束的第二检测激光束振荡装置，并且基于该第二检测激光束振荡装置检测工件的被照射部分的高度位置第二检测激光束的反射光; 以及控制装置，用于基于由第一表面位置检测装置获得的检测值和由第二表面位置检测装置获得的检测值来获得形成在工件中的通孔的深度。

3. 发明申请

US20080037596A1 Laser beam irradiation apparatus and laser working machine 有权
标题翻译：激光束照射设备和激光加工机
公开(公告)号：US20080037596A1
公开(公告)日：2008-02-14
申请号：US11890826
申请日：2007-08-08
申请人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru , Yasuomi Kaneuchi
发明人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru , Yasuomi Kaneuchi
IPC分类号： H01S3/10 , A61N5/01
CPC分类号： G02F1/33 , B23K26/0624 , B23K26/0853 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50 , G02F1/113 , G02F2001/291 , G02F2201/16
摘要： A laser beam irradiation apparatus includes a laser beam oscillation unit including a pulse laser beam oscillator for oscillating a pulse laser beam and a cycle frequency setting unit for setting the cycle frequency, an acousto-optic deflection unit for deflecting the optical axis of the pulse laser beam oscillated from the laser beam oscillation section, and a control unit for controlling the acousto-optic deflection unit. The control unit outputs a driving pulse signal having a predetermined time width including a pulse width of the pulse laser beam oscillated from the pulse laser beam oscillator to the acousto-optic deflection unit based on the cycle frequency setting signal from the cycle frequency setting section.
摘要翻译：激光束照射装置包括激光束振荡单元，其包括用于振荡脉冲激光束的脉冲激光束振荡器和用于设定周期频率的周期频率设定单元，用于偏转脉冲激光器的光轴的声光偏转单元从激光束振荡部分振荡的光束，以及用于控制声光偏转单元的控制单元。控制单元根据来自循环频率设定部的周期频率设定信号，将具有从脉冲激光束振荡器振荡的脉冲激光束的脉冲宽度的预定时间宽度的驱动脉冲信号输出到声光偏转部。

4. 发明授权

US08487208B2 Laser beam irradiation apparatus and laser working machine 有权
标题翻译：激光束照射设备和激光加工机
公开(公告)号：US08487208B2
公开(公告)日：2013-07-16
申请号：US11890826
申请日：2007-08-08
申请人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru , Yasuomi Kaneuchi
发明人： Yutaka Kobayashi , Kouichi Nehashi , Keiji Nomaru , Yasuomi Kaneuchi
IPC分类号： B23K26/00
CPC分类号： G02F1/33 , B23K26/0624 , B23K26/0853 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50 , G02F1/113 , G02F2001/291 , G02F2201/16
摘要： A laser beam irradiation apparatus includes a laser beam oscillation unit including a pulse laser beam oscillator for oscillating a pulse laser beam and a cycle frequency setting unit for setting the cycle frequency, an acousto-optic deflection unit for deflecting the optical axis of the pulse laser beam oscillated from the laser beam oscillation section, and a control unit for controlling the acousto-optic deflection unit. The control unit outputs a driving pulse signal having a predetermined time width including a pulse width of the pulse laser beam oscillated from the pulse laser beam oscillator to the acousto-optic deflection unit based on the cycle frequency setting signal from the cycle frequency setting section.
摘要翻译：激光束照射装置包括激光束振荡单元，其包括用于振荡脉冲激光束的脉冲激光束振荡器和用于设定周期频率的周期频率设定单元，用于偏转脉冲激光器的光轴的声光偏转单元从激光束振荡部分振荡的光束，以及用于控制声光偏转单元的控制单元。控制单元根据来自循环频率设定部的周期频率设定信号，将具有从脉冲激光束振荡器振荡的脉冲激光束的脉冲宽度的预定时间宽度的驱动脉冲信号输出到声光偏转部。

5. 发明申请

US20070138156A1 Laser beam processing machine 有权
标题翻译：激光束加工机
公开(公告)号：US20070138156A1
公开(公告)日：2007-06-21
申请号：US11635539
申请日：2006-12-08
申请人： Keiji Nomaru , Yasuomi Kaneuchi , Hiroshi Morikazu
发明人： Keiji Nomaru , Yasuomi Kaneuchi , Hiroshi Morikazu
IPC分类号： B23K26/06
CPC分类号： B23K26/0869 , B23K26/082 , B23K26/0853 , B23K2101/40
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction (X-axis direction), and an indexing-feed means for moving the chuck table and the laser beam application means relative to each other in an indexing-feed direction (Y-axis direction) perpendicular to the processing-feed direction (X-axis direction), wherein the laser beam application means comprises a laser oscillation means for oscillating a laser beam, a first acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the processing-feed direction (X-axis direction), and a second acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the indexing-feed direction (Y-axis direction).
摘要翻译：一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，用于使卡盘台和激光束施加装置相对移动的加工进给装置（X轴方向）彼此相对移动夹具台和激光束施加机构的分度供给机构，使其相对于彼此垂直的分度方向（Y轴方向）相对移动到处理供给方向（X轴方向），其中激光束施加装置包括用于振荡激光束的激光振荡装置，用于偏转激光振荡的激光束的光轴的第一声光偏转装置光束振荡意味着处理进给方向（X轴方向），以及用于偏转由激光束振荡振荡的激光束的光轴的第二声光偏转装置意味着分度进给方向（Y轴方向）。

6. 发明授权

US07675002B2 Laser beam processing machine 有权
标题翻译：激光束加工机
公开(公告)号：US07675002B2
公开(公告)日：2010-03-09
申请号：US11635539
申请日：2006-12-08
申请人： Keiji Nomaru , Yasuomi Kaneuchi , Hiroshi Morikazu
发明人： Keiji Nomaru , Yasuomi Kaneuchi , Hiroshi Morikazu
IPC分类号： B23K26/38 , B23K26/067
CPC分类号： B23K26/0869 , B23K26/082 , B23K26/0853 , B23K2101/40
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application device for applying a laser beam to the workpiece held on the chuck table, a processing-feed device for moving the chuck table and the laser beam application device relative to each other in a processing-feed direction (X-axis direction), and an indexing-feed device for moving the chuck table and the laser beam application device relative to each other in an indexing-feed direction (Y-axis direction) perpendicular to the processing-feed direction (X-axis direction), wherein the laser beam application device includes a laser oscillation device for oscillating a laser beam, a first acousto-optic deflection device for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation device in the processing-feed direction (X-axis direction), and a second acousto-optic deflection device for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation device in the indexing-feed direction (Y-axis direction).
摘要翻译：一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到夹持在夹盘上的工件的激光束施加装置，用于使卡盘台和激光束施加装置相对移动的加工进给装置（X轴方向）彼此相对移动夹具台和激光束施加装置的分度供给装置，使其相对于彼此垂直的分度方向（Y轴方向）移动到处理供给方向（X轴方向），其中激光束施加装置包括用于振荡激光束的激光振荡装置，用于偏转由激光振荡的激光束的光轴的第一声光偏转装置处理进给方向（X轴方向）的光束振荡装置，以及用于偏转由激光束振荡的激光束的光轴的第二声光偏转装置（Y轴方向）上的错误装置。

7. 发明申请

US20120255935A1 LASER PROCESSING METHOD 有权
标题翻译：激光加工方法
公开(公告)号：US20120255935A1
公开(公告)日：2012-10-11
申请号：US13369076
申请日：2012-02-08
申请人： Motoki KAKUI , Hiroshi Kohda , Yasuomi Kaneuchi , Shinobu Tamaoki , Shigehiro Nagano , Yoshiyuki Uno , Yasuhiro Okamoto , Kenta Takahashi
发明人： Motoki KAKUI , Hiroshi Kohda , Yasuomi Kaneuchi , Shinobu Tamaoki , Shigehiro Nagano , Yoshiyuki Uno , Yasuhiro Okamoto , Kenta Takahashi
IPC分类号： B23K26/00
CPC分类号： B23K26/40 , B23K26/0006 , B23K26/0617 , B23K26/0869 , B23K26/10 , B23K26/36 , B23K26/361 , B23K26/364 , B23K26/38 , B23K26/53 , B23K26/57 , B23K2103/50 , B23K2103/56 , H01L21/302
摘要： There is obtained a laser processing method by which an excellent shape of a cut surface can be achieved and an increase in cost can be suppressed. A laser processing method includes the steps of: preparing a material to be processed; and forming a modified area in the material to be processed, by irradiating the material to be processed with laser beam. In the aforementioned step, pulsed laser beam having a continuous spectrum is focused with a lens, thereby forming a focusing line constituted by a plurality of focuses that are obtained by predetermined bands forming the continuous spectrum of the laser beam, and the material to be processed is irradiated with the laser beam such that at least a part of the focusing line is located on a surface of the material to be processed, thereby forming the modified area on an axis of the focusing line.
摘要翻译：获得能够实现切割面的优良形状并且可以抑制成本增加的激光加工方法。激光加工方法包括以下步骤：准备待加工材料; 并且通过用激光束照射被处理材料，在被处理材料中形成改质区域。在上述步骤中，具有连续光谱的脉冲激光束与透镜聚焦，从而形成由通过形成激光束的连续光谱的预定带获得的多个聚焦构成的聚焦线，以及待处理的材料用激光束照射使得聚焦线的至少一部分位于待处理材料的表面上，从而在聚焦线的轴上形成改质区域。

8. 发明授权

US07625810B2 Wafer processing method 有权
标题翻译：晶圆加工方法
公开(公告)号：US07625810B2
公开(公告)日：2009-12-01
申请号：US11471532
申请日：2006-06-21
申请人： Keiichi Kajiyama , Koichi Kondo , Yasuomi Kaneuchi
发明人： Keiichi Kajiyama , Koichi Kondo , Yasuomi Kaneuchi
IPC分类号： H01L21/46
CPC分类号： H01L21/3043 , B23K26/382 , B23K26/40 , B23K26/60 , B23K2103/50 , H01L21/304 , H01L21/67132 , H01L21/6836 , H01L21/76898 , H01L24/05 , H01L2221/68327 , H01L2924/14 , Y10S438/94 , Y10S438/959 , Y10S438/977 , H01L2924/00
摘要： A method of processing a wafer having a device area where a plurality of devices are formed on the front surface and an extra area surrounding the device area and comprising electrodes which are formed in the device area, comprising: a reinforcement forming step for removing an area, which corresponds to the device area, in the back surface of the wafer to reduce the thickness of the device area to a predetermined value and keeping an area, which corresponds to the extra area, in the back surface of the wafer to form an annular reinforcement; and a via-hole forming step for forming a via-hole in the electrodes of the wafer which has been subjected to the reinforcement forming step.
摘要翻译：一种处理晶片的方法，所述晶片具有在前表面上形成多个器件的器件区域和围绕器件区域的额外区域，并且包括形成在器件区域中的电极，包括：加强层形成步骤，用于去除区域，其对应于晶片的后表面，以将器件面积的厚度减小到预定值，并将与多余面积对应的面积保持在晶片的背面中，以形成环形加强; 以及通孔形成步骤，用于在经过加强成形步骤的晶片的电极中形成通孔。

9. 发明申请

US20060292826A1 Wafer processing method 有权
公开(公告)号：US20060292826A1
公开(公告)日：2006-12-28
申请号：US11471532
申请日：2006-06-21
申请人： Keiichi Kajiyama , Koichi Kondo , Yasuomi Kaneuchi
发明人： Keiichi Kajiyama , Koichi Kondo , Yasuomi Kaneuchi
IPC分类号： H01L21/30
CPC分类号： H01L21/3043 , B23K26/382 , B23K26/40 , B23K26/60 , B23K2103/50 , H01L21/304 , H01L21/67132 , H01L21/6836 , H01L21/76898 , H01L24/05 , H01L2221/68327 , H01L2924/14 , Y10S438/94 , Y10S438/959 , Y10S438/977 , H01L2924/00
摘要： A method of processing a wafer having a device area where a plurality of devices are formed on the front surface and an extra area surrounding the device area and comprising electrodes which are formed in the device area, comprising: a reinforcement forming step for removing an area, which corresponds to the device area, in the back surface of the wafer to reduce the thickness of the device area to a predetermined value and keeping an area, which corresponds to the extra area, in the back surface of the wafer to form an annular reinforcement; and a via-hole forming step for forming a via-hole in the electrodes of the wafer which has been subjected to the reinforcement forming step.

10. 发明授权

US08933367B2 Laser processing method 有权
标题翻译：激光加工方法
公开(公告)号：US08933367B2
公开(公告)日：2015-01-13
申请号：US13369076
申请日：2012-02-08
申请人： Motoki Kakui , Hiroshi Kohda , Yasuomi Kaneuchi , Shinobu Tamaoki , Shigehiro Nagano , Yoshiyuki Uno , Yasuhiro Okamoto , Kenta Takahashi
发明人： Motoki Kakui , Hiroshi Kohda , Yasuomi Kaneuchi , Shinobu Tamaoki , Shigehiro Nagano , Yoshiyuki Uno , Yasuhiro Okamoto , Kenta Takahashi
IPC分类号： B23K26/36 , B23K26/00 , B23K26/08 , B23K26/10 , B23K26/38 , B23K26/40 , H01L21/302
CPC分类号： B23K26/40 , B23K26/0006 , B23K26/0617 , B23K26/0869 , B23K26/10 , B23K26/36 , B23K26/361 , B23K26/364 , B23K26/38 , B23K26/53 , B23K26/57 , B23K2103/50 , B23K2103/56 , H01L21/302
摘要： There is obtained a laser processing method by which an excellent shape of a cut surface can be achieved and an increase in cost can be suppressed. A laser processing method includes the steps of: preparing a material to be processed; and forming a modified area in the material to be processed, by irradiating the material to be processed with laser beam. In the aforementioned step, pulsed laser beam having a continuous spectrum is focused with a lens, thereby forming a focusing line constituted by a plurality of focuses that are obtained by predetermined bands forming the continuous spectrum of the laser beam, and the material to be processed is irradiated with the laser beam such that at least a part of the focusing line is located on a surface of the material to be processed, thereby forming the modified area on an axis of the focusing line.
摘要翻译：获得能够实现切割面的优良形状并且可以抑制成本增加的激光加工方法。激光加工方法包括以下步骤：准备待加工材料; 并且通过用激光束照射被处理材料，在被处理材料中形成改质区域。在上述步骤中，具有连续光谱的脉冲激光束与透镜聚焦，从而形成由通过形成激光束的连续光谱的预定带获得的多个聚焦构成的聚焦线，以及待处理的材料用激光束照射使得聚焦线的至少一部分位于待处理材料的表面上，从而在聚焦线的轴上形成改质区域。

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