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1. 发明授权

US07368933B2 Method for testing standby current of semiconductor package 失效
标题翻译：半导体封装待机电流测试方法
公开(公告)号：US07368933B2
公开(公告)日：2008-05-06
申请号：US11335270
申请日：2006-01-18
申请人： Moon-Bo Sim , Joo-Seok Kwak , Seong-Su Kim , Yun-Bo Yang , Sun-Ki Kim
发明人： Moon-Bo Sim , Joo-Seok Kwak , Seong-Su Kim , Yun-Bo Yang , Sun-Ki Kim
IPC分类号： G01R31/01 , G01R31/28 , G01R31/26
CPC分类号： G01R31/3008
摘要： A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number, collecting measured values of standby current of the semiconductor chips, and storing the measured values of standby current in a database, by using a wafer tester; recognizing a wafer run number of each of semiconductor packages to be tested; downloading measured values of standby current of semiconductor chips corresponding to the recognized wafer run number from the database to a semiconductor package tester; extracting a boundary value defining predetermined upper values of the downloaded measured values of standby current, by using the semiconductor package tester; setting the boundary value as a standby current limit of a program for testing the semiconductor packages by use of the semiconductor package tester; and testing the semiconductor packages based on the standby current limit.
摘要翻译：提供一种用于测试半导体封装的待机电流的系统和方法。该方法包括测试形成在具有预定晶圆行程号的晶片上的半导体芯片，收集半导体芯片的待机电流的测量值，并通过使用晶片测试器将待机电流的测量值存储在数据库中; 识别要测试的每个半导体封装的晶片运行次数; 将与识别的晶片运行数相对应的半导体芯片的待机电流的测量值从数据库下载到半导体封装测试器; 通过使用半导体封装测试器提取定义下载的待机电流测量值的预定上限值的边界值; 将边界值设置为通过使用半导体封装测试器来测试半导体封装的程序的备用电流极限; 并根据待机电流限制测试半导体封装。

2. 发明申请

US20060158205A1 Method for testing standby current of semiconductor package 失效
标题翻译：半导体封装待机电流测试方法
公开(公告)号：US20060158205A1
公开(公告)日：2006-07-20
申请号：US11335270
申请日：2006-01-18
申请人： Moon-Bo Sim , Joo-Seok Kwak , Seong-Su Kim , Yun-Bo Yang , Sun-Ki Kim
发明人： Moon-Bo Sim , Joo-Seok Kwak , Seong-Su Kim , Yun-Bo Yang , Sun-Ki Kim
IPC分类号： G01R31/02
CPC分类号： G01R31/3008
摘要： A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number, collecting measured values of standby current of the semiconductor chips, and storing the measured values of standby current in a database, by using a wafer tester; recognizing a wafer run number of each of semiconductor packages to be tested; downloading measured values of standby current of semiconductor chips corresponding to the recognized wafer run number from the database to a semiconductor package tester; extracting a boundary value defining predetermined upper values of the downloaded measured values of standby current, by using the semiconductor package tester; setting the boundary value as a standby current limit of a program for testing the semiconductor packages by use of the semiconductor package tester; and testing the semiconductor packages based on the standby current limit.
摘要翻译：提供一种用于测试半导体封装的待机电流的系统和方法。该方法包括测试形成在具有预定晶圆行程号的晶片上的半导体芯片，收集半导体芯片的待机电流的测量值，并通过使用晶片测试器将待机电流的测量值存储在数据库中; 识别要测试的每个半导体封装的晶片运行次数; 将与识别的晶片运行数相对应的半导体芯片的待机电流的测量值从数据库下载到半导体封装测试器; 通过使用半导体封装测试器提取定义下载的待机电流测量值的预定上限值的边界值; 将边界值设置为通过使用半导体封装测试器来测试半导体封装的程序的备用电流极限; 并根据待机电流限制测试半导体封装。

3. 发明授权

US08769353B2 Memory card 有权
标题翻译：存储卡
公开(公告)号：US08769353B2
公开(公告)日：2014-07-01
申请号：US13227004
申请日：2011-09-07
申请人： Yun-Bo Yang , Young-Jae Jung , Kui-Hyun Ro , Sung-Eun Yun
发明人： Yun-Bo Yang , Young-Jae Jung , Kui-Hyun Ro , Sung-Eun Yun
IPC分类号： G11C29/00 , G11C29/48 , G11C29/16 , G06F11/27 , G11C29/04
CPC分类号： G11C29/12 , G06F11/27 , G11C29/16 , G11C29/48 , G11C2029/0401
摘要： A memory card includes a memory cell, a connector, a controller, and firmware. The memory cell can switch between a plurality of states. The connector can be connected to an external device and exchange signals including commands and data with the external device. The controller exchanges signals with the connector, analyzes a received signal, and accesses the memory cell to record, retrieve or modify data based on the analysis result. The firmware is located within the controller, controls the operation of the controller, and can be set to a test mode or a user mode. When the firmware receives a test command from the external device and the firmware is set to the test mode, the firmware performs a defect test on the memory cell and transmits the result of the defect test to the external device through the connector.
摘要翻译：存储卡包括存储单元，连接器，控制器和固件。存储单元可以在多个状态之间切换。连接器可以连接到外部设备，并与外部设备交换包括命令和数据的信号。控制器与连接器交换信号，分析接收到的信号，并根据分析结果访问存储单元记录，检索或修改数据。固件位于控制器内，控制控制器的操作，并可设置为测试模式或用户模式。当固件从外部设备接收到测试命令并将固件设置为测试模式时，固件对存储单元进行缺陷测试，并通过连接器将缺陷测试结果发送到外部设备。

4. 发明申请

US20140281765A1 MEMORY CARD 审中-公开
标题翻译：存储卡
公开(公告)号：US20140281765A1
公开(公告)日：2014-09-18
申请号：US14289078
申请日：2014-05-28
申请人： Yun-Bo Yang , Young-Jae Jung , Kui-Hyun Ro , Sung-Eun Yun
发明人： Yun-Bo Yang , Young-Jae Jung , Kui-Hyun Ro , Sung-Eun Yun
IPC分类号： G11C29/12
CPC分类号： G11C29/12 , G06F11/27 , G11C29/16 , G11C29/48 , G11C2029/0401
摘要： A memory card includes a memory cell, a connector, a controller, and firmware. The memory cell can switch between a plurality of states. The connector can be connected to an external device and exchange signals including commands and data with the external device. The controller exchanges signals with the connector, analyzes a received signal, and accesses the memory cell to record, retrieve or modify data based on the analysis result. The firmware is located within the controller, controls the operation of the controller, and can be set to a test mode or a user mode. When the firmware receives a test command from the external device and the firmware is set to the test mode, the firmware performs a defect test on the memory cell and transmits the result of the defect test to the external device through the connector.
摘要翻译：存储卡包括存储单元，连接器，控制器和固件。存储单元可以在多个状态之间切换。连接器可以连接到外部设备，并与外部设备交换包括命令和数据的信号。控制器与连接器交换信号，分析接收到的信号，并根据分析结果访问存储单元记录，检索或修改数据。固件位于控制器内，控制控制器的操作，并可设置为测试模式或用户模式。当固件从外部设备接收到测试命令并将固件设置为测试模式时，固件对存储单元进行缺陷测试，并通过连接器将缺陷测试结果发送到外部设备。

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