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    • 6. 发明授权
    • Method for testing standby current of semiconductor package
    • 半导体封装待机电流测试方法
    • US07368933B2
    • 2008-05-06
    • US11335270
    • 2006-01-18
    • Moon-Bo SimJoo-Seok KwakSeong-Su KimYun-Bo YangSun-Ki Kim
    • Moon-Bo SimJoo-Seok KwakSeong-Su KimYun-Bo YangSun-Ki Kim
    • G01R31/01G01R31/28G01R31/26
    • G01R31/3008
    • A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number, collecting measured values of standby current of the semiconductor chips, and storing the measured values of standby current in a database, by using a wafer tester; recognizing a wafer run number of each of semiconductor packages to be tested; downloading measured values of standby current of semiconductor chips corresponding to the recognized wafer run number from the database to a semiconductor package tester; extracting a boundary value defining predetermined upper values of the downloaded measured values of standby current, by using the semiconductor package tester; setting the boundary value as a standby current limit of a program for testing the semiconductor packages by use of the semiconductor package tester; and testing the semiconductor packages based on the standby current limit.
    • 提供一种用于测试半导体封装的待机电流的系统和方法。 该方法包括测试形成在具有预定晶圆行程号的晶片上的半导体芯片,收集半导体芯片的待机电流的测量值,并通过使用晶片测试器将待机电流的测量值存储在数据库中; 识别要测试的每个半导体封装的晶片运行次数; 将与识别的晶片运行数相对应的半导体芯片的待机电流的测量值从数据库下载到半导体封装测试器; 通过使用半导体封装测试器提取定义下载的待机电流测量值的预定上限值的边界值; 将边界值设置为通过使用半导体封装测试器来测试半导体封装的程序的备用电流极限; 并根据待机电流限制测试半导体封装。