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    • 4. 发明授权
    • Elimination of dehydrogenation step when forming a silicon thin film
device by low-temperature laser-annealing
    • 通过低温激光退火形成硅薄膜器件时,消除脱氢步骤
    • US6080643A
    • 2000-06-27
    • US021826
    • 1998-02-11
    • Takashi NoguchiHajime YagiYasuhiro Kanaya
    • Takashi NoguchiHajime YagiYasuhiro Kanaya
    • G02F1/136G02F1/1368H01L21/20H01L21/336H01L29/786H01L21/36
    • H01L21/2026
    • Disclosed is a process of forming a silicon thin film used as an active layer of a thin film transistor, which process is improved for enhancing a quality and a productivity of the silicon thin film. At a physical vapor deposition step, an amorphous silicon thin film is physically formed on a substrate in vacuum. Then, at a laser annealing step, directly after formation of the amorphous silicon thin film without the need of dehydrogenation, a laser light is irradiated to the amorphous silicon thin film, to convert the amorphous silicon thin film into a polycrystalline silicon thin film. After that, the polycrystalline silicon thin film thus converted is processed to form a thin film transistor. In the physical vapor deposition step, an amorphous silicon thin film may be formed by sputtering using a target made from a silicon crystal body or a silicon sintered body. In the sputtering, an amorphous silicon thin film can be formed by sputtering using a target previously mixed with an impurity in a desired concentration. By introducing an impurity in the amorphous silicon thin film at the film formation stage, a threshold characteristic of a thin film transistor can be previously controlled.
    • 公开了形成用作薄膜晶体管的有源层的硅薄膜的工艺,该方法被改进以提高硅薄膜的质量和生产率。 在物理气相沉积步骤中,非晶硅薄膜在真空中物理地形成在衬底上。 然后,在激光退火工序中,直接在形成非晶硅薄膜而不需要脱氢之后,向非晶硅薄膜照射激光,将非晶硅薄膜转换为多晶硅薄膜。 之后,将这样转换的多晶硅薄膜加工成薄膜晶体管。 在物理气相沉积步骤中,可以使用由硅晶体或硅烧结体制成的靶通过溅射形成非晶硅薄膜。 在溅射中,可以使用预先与期望浓度的杂质混合的靶通过溅射形成非晶硅薄膜。 通过在成膜阶段引入非晶硅薄膜中的杂质,可以预先控制薄膜晶体管的阈值特性。
    • 5. 发明授权
    • Bonding method and adhesive useful for the method
    • US4950701A
    • 1990-08-21
    • US229458
    • 1988-08-08
    • Naomi OkamuraHiroshi AokiJunzo MakinoHajime YagiYasuo AraiTakashi Yamanaka
    • Naomi OkamuraHiroshi AokiJunzo MakinoHajime YagiYasuo AraiTakashi Yamanaka
    • C08L35/04C08L83/04C09J5/04
    • C09J5/04C08L35/04C08L83/04C09J2483/00
    • A method for bonding two objects by means of the following two adhesives:(A) a moisture-inducible room temperature anion polymerization curing adhesive composed essentially of at least one anion polymerizable compound selected from the group consisting of an .alpha.-cyanoacrylate compound of the formula: ##STR1## wherein R is an alkyl group having from 1 to 16 carbon atoms, an alkoxyalkyl group having 2 to 16 carbon atoms, a haloalkyl group having from 1 to 16 carbon atoms, a cyanoalkyl group having from 2 to 16 carbon atoms, an aralkyl group having from 6 to 12 atoms, an acyloxyalkyl group having from 2 to 16 carbon atoms, a cycloalkyl group having from 3 to 16 carbon atoms, an alkenyl group having from 2 to 16 carbon atoms or an aryl group having from 6 to 12 carbon atoms, and a 1,1-disubstituted diene compound of the formula: ##STR2## wherein each of R.sup.1 and R.sup.2 which may be the same or different, is a hydrogen atom, an alkyl group having from 1 to 5 carbon atoms, an aryl group, an aralkyl group having from 6 to 12 carbon atoms or a halogen atom, R.sup.3 is a hydrogen atom or a methyl group, each of X and Y which may be the same or different, is a cyano group, a carboxylic acid ester group having from 2 to 12 carbon atoms, an ethylsulfone group, a phenylsulfone group, a formyl group, an acetyl group, a benzoyl group, an amide group, a diethyl sulfonyl group, or a phenyl group; and(B) a room temperature self-curing adhesive containing from 0.05 to 50% by weight of an anion polymerization accelerator, said self-curing adhesive being selected from the group consisting of (1) a room temperature moisture-curing adhesive, (2) a room temperature curing two-part type epoxy resin adhesive, and (3) a room temperature curing synthetic resin aqueous emulsion adhesive, which comprises applying said two adhesives (A) and (B) at the bonding interface of the objects so that they do not contact each other and pressing the objects to each other to bring the two adhesives in contact with each other.
    • 9. 发明授权
    • Bonding method and adhesive useful for the method
    • 粘合方法和粘合剂对该方法有用
    • US4793886A
    • 1988-12-27
    • US69187
    • 1987-07-02
    • Naomi OkamuraHiroshi AokiJunzo MakinoHajime YagiYasuo AraiTakashi Yamanaka
    • Naomi OkamuraHiroshi AokiJunzo MakinoHajime YagiYasuo AraiTakashi Yamanaka
    • C08L35/04C08L83/04C09J5/04C09J5/02
    • C09J5/04C08L35/04C08L83/04C09J2483/00Y10T428/31536
    • A method for bonding two objects by means of the following two adhesives:(A) a moisture-inducible room temperature anion polymerization curing adhesive composed essentially of at least one anion polymerizable compound selected from the group consisting of an .alpha.-cyanoacrylate compound, and a 1,1-disubstituted diene compound;and(B) a room temperature self-curing adhesive containing from 0.05 to 50% by weight of an anion polymerization accelerator, said self-curing adhesive being selected from the group consisting of (1) a room temperature moisture-curing adhesive, (2) a room temperature curing two-part type epoxy resin adhesive, and (3) a room temperature curing synthetic resin aqueous emulsion adhesive, which comprises applying said two adhesives (A) and (B) at the bonding interface of the objects so that they do not contact each other and pressing the objects to each other to bring the two adhesives in contact with each other.
    • 一种通过以下两种粘合剂粘结两个物体的方法:(A)一种水分诱导型室温阴离子聚合固化粘合剂,其基本上由至少一种选自由α-氰基丙烯酸酯化合物组成的组的阴离子可聚合化合物和 1,1-二取代二烯化合物; 和(B)含有0.05〜50重量%阴离子聚合促进剂的室温自固化粘合剂,所述自固化粘合剂选自(1)室温湿固化粘合剂,(2) )室温固化二部分型环氧树脂粘合剂,和(3)室温固化合成树脂水乳液粘合剂,其包括在物体的粘合界面处施加所述两种粘合剂(A)和(B),使得它们 不要彼此接触并且彼此按压物体以使两个粘合剂彼此接触。