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1. 发明申请

US20120119867A1 MULTILAYER COIL COMPONENT 有权
标题翻译：多层线圈组件
公开(公告)号：US20120119867A1
公开(公告)日：2012-05-17
申请号：US13357582
申请日：2012-01-24
申请人： Mitsuru ODAHARA , Akihiro MOTOKI , Akihiro ONO
发明人： Mitsuru ODAHARA , Akihiro MOTOKI , Akihiro ONO
IPC分类号： H01F5/00 , H01F41/04
CPC分类号： H01F41/04 , H01F17/0013 , H01F17/04 , H01F27/2804 , H01F41/046 , H01F2027/2809
摘要： A multilayer coil component is provided to have high reliability and in which internal stress arising from the difference in firing shrinkage behavior and/or thermal expansion coefficient between ferrite layers and internal conductor layers is alleviated without forming conventional voids between the ferrite layers and the internal conductor layers. A method of manufacturing a multilayer coil includes a step of isolating interfaces between internal conductors and surrounding ferrite by allowing a complexing agent solution to reach interfaces between the internal conductors and the surrounding ferrite through side gap portions from side surfaces of a ferrite element including a helical coil. The complexing agent solution contains at least one selected from the group consisting of an aminocarboxylic acid, a salt of the aminocarboxylic acid, an oxycarboxylic acid, a salt of the oxycarboxylic acid, an amine, phosphoric acid, a salt of phosphoric acid, and a lactone compound.
摘要翻译：提供多层线圈部件以具有高可靠性，并且在铁氧体层和内部导体之间不形成常规的空隙而减轻铁氧体层和内部导体层之间的烧制收缩性能和/或热膨胀系数差异产生的内部应力层。制造多层线圈的方法包括通过使络合剂溶液通过包括螺旋形的铁氧体元件的侧表面的侧面间隙部分的内部导体和周围的铁氧体之间的界面来分离内部导体和周围的铁氧体之间的界面的步骤线圈络合剂溶液含有至少一种选自氨基羧酸，氨基羧酸的盐，羟基羧酸，羟基羧酸的盐，胺，磷酸，磷酸的盐和内酯化合物。

2. 发明申请

US20120236461A1 CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：陶瓷电子元件
公开(公告)号：US20120236461A1
公开(公告)日：2012-09-20
申请号：US13419545
申请日：2012-03-14
申请人： Yoji YAMAMOTO , Akihiro MOTOKI , Syunsuke TAKEUCHI , Makoto OGAWA , Toshiyuki IWANAGA
发明人： Yoji YAMAMOTO , Akihiro MOTOKI , Syunsuke TAKEUCHI , Makoto OGAWA , Toshiyuki IWANAGA
IPC分类号： H01G4/008 , H01C7/13 , H01L41/047 , H01F5/00
CPC分类号： H01C7/008 , H01C1/14 , H01G4/005 , H01G4/008 , H01G4/012 , H01G4/12
摘要： A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.
摘要翻译：陶瓷电子部件包括大致矩形的陶瓷元件组件，第一外部电极和第二外部电极。第一外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第一镀膜。类似地，第二外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第二镀膜。在平面图中，第一和第二电镀膜的每单位面积的表面积等于或大于约1.02。

3. 发明申请

US20120169180A1 LAMINATE TYPE ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压型电子元件及其制造方法
公开(公告)号：US20120169180A1
公开(公告)日：2012-07-05
申请号：US13337445
申请日：2011-12-27
申请人： Masahito SARUBAN , Makoto OGAWA , Wataru OGAWA , Akihiro MOTOKI , Syunsuke TAKEUCHI , Yoji YAMAMOTO
发明人： Masahito SARUBAN , Makoto OGAWA , Wataru OGAWA , Akihiro MOTOKI , Syunsuke TAKEUCHI , Yoji YAMAMOTO
IPC分类号： H01L41/00 , H01F5/00 , B05D3/02 , H01C7/10 , B05D5/12 , H01G4/12 , H01C7/13
CPC分类号： H01G4/232 , H01G4/012 , H01G4/30
摘要： In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.
摘要翻译：在层压型电子部件的制造方法中，在通过使成膜主体中的多个内部电极的露出端上沉积的镀层析出来形成至少部分地限定外部电极的镀膜之后进行热处理电镀膜的存在不仅可以干扰湿气的释放，而且还可能导致镀膜中的起泡或凸起缺陷，同时通过蒸发除去组分主体中的电镀溶液等水分。为了避免这种问题，在内部电极的延伸部分中形成将暴露端分割为多个部分的切割。因此，电镀膜包括在与切口的位置相对应的位置沿堆叠方向延伸的狭缝。

4. 发明申请

US20120039015A1 LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压型陶瓷电子元件及其制造方法
公开(公告)号：US20120039015A1
公开(公告)日：2012-02-16
申请号：US13208416
申请日：2011-08-12
申请人： Masahito SARUBAN , Makoto OGAWA , Akihiro MOTOKI , Takehisa SASABAYASHI , Takayuki KAYATANI
发明人： Masahito SARUBAN , Makoto OGAWA , Akihiro MOTOKI , Takehisa SASABAYASHI , Takayuki KAYATANI
IPC分类号： H01G4/30 , H01G7/00
CPC分类号： H01G4/005 , H01G4/30 , Y10T29/43 , Y10T29/435
摘要： In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.
摘要翻译：在层叠型陶瓷电子部件中，当通过电镀直接形成在主体的表面上的外部电极时，作为外部电极的镀膜可以相对于部件主体具有低的固定强度。为了防止这个问题，外部电极包括由Ni-B镀膜组成的第一镀层，并且首先形成为以至少沉积作为起点的各内部电极的露出端沉积的电镀沉积组件主体的端面。然后，在第一镀层上形成由基本不含B的Ni镀膜构成的第二镀层。优选构成第一镀层的Ni-B镀膜的B含量为约0.1重量％〜约6重量％。

5. 发明申请

US20110193448A1 LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20110193448A1
公开(公告)日：2011-08-11
申请号：US13020886
申请日：2011-02-04
申请人： Masahito SARUBAN , Makoto OGAWA , Akihiro MOTOKI , Syunsuke TAKEUCHI , Kiyoyasu SAKURADA
发明人： Masahito SARUBAN , Makoto OGAWA , Akihiro MOTOKI , Syunsuke TAKEUCHI , Kiyoyasu SAKURADA
IPC分类号： H01L41/00 , H01G4/30 , H01F5/00 , H01C7/13 , B05D5/12
CPC分类号： H01G4/30 , H01F17/0013 , H01G4/005 , H01G13/00 , H01L41/293
摘要： A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are formed as external terminal electrodes, the entire component main body is treated with a water repellent agent after the formation of the first plating layers, and the water repellent agent on the first plating layers is then removed before the formation of the second plating layers. The gaps between the end edges of the first plating films on the outer surface of the component main body and the outer surface of the component main body are filled with the water repellent agent.
摘要翻译：一种层叠电子部件的制造方法，其中，当分别连接多个内部电极彼此连接的第一镀层和提高层压电子部件的安装性的第二镀层形成为外部端子电极时，整个部件主体在形成第一镀层之后，用防水剂处理体，然后在形成第二镀层之前去除第一镀层上的防水剂。在组件主体的外表面上的第一镀膜的端缘与部件主体的外表面之间的间隙填充有防水剂。

6. 发明申请

US20100243133A1 LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20100243133A1
公开(公告)日：2010-09-30
申请号：US12796688
申请日：2010-06-09
申请人： Tatsuo KUNISHI , Yoshihiko TAKANO , Shigeyuki KURODA , Akihiro MOTOKI , Hideyuki KASHIO , Takashi NOJI
发明人： Tatsuo KUNISHI , Yoshihiko TAKANO , Shigeyuki KURODA , Akihiro MOTOKI , Hideyuki KASHIO , Takashi NOJI
IPC分类号： B32B38/00 , B32B38/10
CPC分类号： C25D3/12 , C25D5/02 , C25D7/00 , C25D21/10 , H01G4/2325 , H01G4/30 , Y10T29/435 , Y10T29/49126 , Y10T29/49147 , Y10T29/49163 , Y10T29/49204
摘要： A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 μm or less, and a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 μm or less. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.
摘要翻译：制备层叠体，其中相邻的内部电极在内部电极暴露的端面处彼此电绝缘，在绝缘层的厚度方向上测量的相邻内部电极之间的空间为约10μm 相邻的内部电极与端面的退出距离为1μm以下。在电镀步骤中，沉积在相邻内部电极的端部上的电镀沉积物彼此连接。

7. 发明申请

US20100118467A1 LAMINATED CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：层压陶瓷电子元件
公开(公告)号：US20100118467A1
公开(公告)日：2010-05-13
申请号：US12616844
申请日：2009-11-12
申请人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
发明人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.
摘要翻译：在层叠陶瓷电子部件中，外部端子电极包括直接覆盖陶瓷元件组件的端面上的内部电极的露出部分的电镀膜。在陶瓷元件组件的端面和主面之间的边界上，设置大致圆角，并且镀膜被布置成使得镀膜的端部停止在角部并且不从主表面突出。

8. 发明申请

US20100091426A1 MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：多层电子元件及其制造方法
公开(公告)号：US20100091426A1
公开(公告)日：2010-04-15
申请号：US12543549
申请日：2009-08-19
申请人： Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA , Akihiro YOSHIDA , Takayuki KAYATANI
发明人： Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA , Akihiro YOSHIDA , Takayuki KAYATANI
IPC分类号： H01G4/30 , H01G7/00 , H01G4/005
CPC分类号： H01G4/2325 , H01C1/148 , H01C7/18 , H01G4/30 , Y10T29/435
摘要： A method is used to manufacture a multilayer electronic component including a multilayer composite including internal electrodes having ends that are exposed at a predetermined surface of the multilayer composite. In the method, the exposed ends of the internal electrodes are coated with a metal film primarily composed of at least one metal selected from the group consisting of Pd, Au, Pt and Ag and having a thickness of at least about 0.1 μm by immersing the multilayer composite in a liquid containing a metal ion or a metal complex. Then, a continuous plating layer is formed by depositing a plating metal on the ends of the internal electrodes exposed at the predetermined surface of the multilayer composite, and subsequently growing the deposits of the plating metal so as to be connected to each other. Thus, exposed ends of the internal electrodes are electrically connected to each other.
摘要翻译：一种方法用于制造包括多层复合材料的多层电子部件，所述多层复合材料包括具有在所述多层复合材料的预定表面露出的端部的内部电极。在该方法中，内部电极的露出端涂覆有主要由选自Pd，Au，Pt和Ag的至少一种金属的金属膜，并且具有至少约0.1μm的厚度，通过将在含有金属离子或金属络合物的液体中的多层复合材料。然后，通过在暴露于多层复合材料的预定表面的内部电极的端部上沉积电镀金属，随后使电镀金属的沉积物彼此连接而形成连续镀层。因此，内部电极的露出端彼此电连接。

9. 发明申请

US20090323253A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MAKING THE SAME 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US20090323253A1
公开(公告)日：2009-12-31
申请号：US12490471
申请日：2009-06-24
申请人： Tatsunori KOBAYASHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA , Shunsuke TAKEUCHI , Kenichi KAWASAKI
发明人： Tatsunori KOBAYASHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA , Shunsuke TAKEUCHI , Kenichi KAWASAKI
IPC分类号： H01G4/30 , B05D5/12
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A multilayer ceramic electronic component includes external terminal electrodes that are formed by depositing metal plating films on exposed portions of internal conductors embedded in a ceramic body, depositing a copper plating films that cover the metal plating films and make contact with the ceramic body around the metal plating films, and heat-treating the ceramic body to generate a copper liquid phase, an oxygen liquid phase, and a copper solid phase between the copper plating films and the ceramic body. The mixed phase including these phases forms a region at which a copper oxide is present in a discontinuous manner inside the copper plating film at least at the interfaces between the ceramic body and the copper plating films. The copper oxide securely attaches the copper plating films to the ceramic body and enhances the bonding force of the external terminal electrodes.
摘要翻译：多层陶瓷电子部件包括外部端子电极，其通过在嵌入陶瓷体的内部导体的露出部分上沉积金属电镀膜而形成，沉积覆盖金属电镀膜的铜电镀膜并与金属周围的陶瓷体接触并对该陶瓷体进行热处理，以在铜镀膜和陶瓷体之间产生铜液相，氧液相，铜固相。包括这些相的混合相至少在陶瓷体和镀铜膜之间的界面处形成铜镀层内不连续地存在氧化铜的区域。铜氧化物将铜电镀膜牢固地附着在陶瓷体上，提高外部端子电极的结合力。

10. 发明申请

US20080145551A1 METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT 审中-公开
标题翻译：制造多层电子元件的方法
公开(公告)号：US20080145551A1
公开(公告)日：2008-06-19
申请号：US12041889
申请日：2008-03-04
申请人： Tatsuo KUNISHI , Makoto OGAWA , Akihiro MOTOKI
发明人： Tatsuo KUNISHI , Makoto OGAWA , Akihiro MOTOKI
IPC分类号： B05D1/18 , B05D5/12
CPC分类号： H01G4/2325 , H01G4/12 , H01G4/30 , H01G13/006
摘要： An electroless plating step for forming external electrodes includes preparing a plating solution including a reducing agent and metal ions having a more electochemically positive deposition potential than the oxidation-reduction potential of the reducing agent, placing a laminate for a multilayer electronic component together with a conductive medium having catalytic activity for an oxidation reaction of the reducing agent in a vessel, and stirring the laminate and the conductive medium in the plating solution by rotation, shaking, inclination, or vibration. Electroless plating proceeds to connect each other plating deposits deposited on the ends of a plurality of internal electrodes.
摘要翻译：用于形成外部电极的化学镀步骤包括制备包含还原剂的电镀溶液和具有比还原剂的氧化还原电位更具有电化学正的沉积电位的金属离子，将多层电子部件的层压体与导电具有对容器中还原剂的氧化反应的催化活性的介质，通过旋转，摇动，倾斜或振动来搅拌电镀液中的层压体和导电介质。化学镀继续连接沉积在多个内部电极的端部上的彼此沉积的镀敷沉积物。

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