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1. 发明申请

US20120039015A1 LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压型陶瓷电子元件及其制造方法
公开(公告)号：US20120039015A1
公开(公告)日：2012-02-16
申请号：US13208416
申请日：2011-08-12
申请人： Masahito SARUBAN , Makoto OGAWA , Akihiro MOTOKI , Takehisa SASABAYASHI , Takayuki KAYATANI
发明人： Masahito SARUBAN , Makoto OGAWA , Akihiro MOTOKI , Takehisa SASABAYASHI , Takayuki KAYATANI
IPC分类号： H01G4/30 , H01G7/00
CPC分类号： H01G4/005 , H01G4/30 , Y10T29/43 , Y10T29/435
摘要： In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.
摘要翻译：在层叠型陶瓷电子部件中，当通过电镀直接形成在主体的表面上的外部电极时，作为外部电极的镀膜可以相对于部件主体具有低的固定强度。为了防止这个问题，外部电极包括由Ni-B镀膜组成的第一镀层，并且首先形成为以至少沉积作为起点的各内部电极的露出端沉积的电镀沉积组件主体的端面。然后，在第一镀层上形成由基本不含B的Ni镀膜构成的第二镀层。优选构成第一镀层的Ni-B镀膜的B含量为约0.1重量％〜约6重量％。

2. 发明申请

US20120039014A1 LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压型陶瓷电子元件及其制造方法
公开(公告)号：US20120039014A1
公开(公告)日：2012-02-16
申请号：US13208393
申请日：2011-08-12
申请人： Makoto OGAWA , Akihiro MOTOKI , Takehisa SASABAYASHI , Takayuki KAYATANI
发明人： Makoto OGAWA , Akihiro MOTOKI , Takehisa SASABAYASHI , Takayuki KAYATANI
IPC分类号： H01G4/30 , H01G7/00
CPC分类号： H01G4/005 , H01G4/30
摘要： In a laminate type ceramic electronic component, when an external electrode for a laminated ceramic capacitor is formed directly by plating onto a surface of a component main body, the film that is directly plated may have a low fixing strength with respect to the component main body. As the external electrode, a first plating layer composed of a Ni—P plating film with a P content rate of about 9 weight % or more is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no P is formed on the first plating layer. Preferably, the first plating layer is formed by electroless plating, whereas the second plating layer is formed by electrolytic plating.
摘要翻译：在层叠型陶瓷电子部件中，当通过电镀直接形成在组件主体的表面上的层叠陶瓷电容器的外部电极时，直接镀膜的膜相对于部件主体可具有低的固定强度。作为外部电极，首先形成由P含量为约9重量％以上的Ni-P镀膜构成的第一镀层，以使各个内部电极的露出端作为起点沉积的电镀沉积为在组件主体的至少一个端面上生长。然后，在第一镀层上形成由基本上不含P的Ni镀膜构成的第二镀层。优选地，通过无电镀形成第一镀层，而通过电解电镀形成第二镀层。

3. 发明申请

US20110255209A1 CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：陶瓷电子元件
公开(公告)号：US20110255209A1
公开(公告)日：2011-10-20
申请号：US13079049
申请日：2011-04-04
申请人： Atsushi ISHIDA , Takumi TANIGUCHI , Takehisa SASABAYASHI , Tomoyuki KUWANO , Akihiro MOTOKI , Toshiyuki IWANAGA
发明人： Atsushi ISHIDA , Takumi TANIGUCHI , Takehisa SASABAYASHI , Tomoyuki KUWANO , Akihiro MOTOKI , Toshiyuki IWANAGA
IPC分类号： H01G4/228
CPC分类号： H01G4/2325 , H01G4/232 , H01G4/30
摘要： A ceramic electronic component includes a ceramic element including opposed side surfaces, an inner electrode, and an external terminal electrode. The external terminal electrode includes a first conductive layer and a second conductive layer. The first conductive layer is formed by plating so as to be electrically coupled to an exposed section of the internal electrode exposed to the side surfaces. The second conductive layer is arranged so as to cover the first conductive layer and includes conductive resin. The value of T2/T1 is in the range of about 3.4 to about 11.3, where T1 indicates the thickness of the first conductive layer and T2 indicates the thickness of the second conductive layer.
摘要翻译：陶瓷电子部件包括：陶瓷元件，其包括相对的侧面，内部电极和外部端子电极。外部端子电极包括第一导电层和第二导电层。第一导电层通过电镀形成，以便电连接到暴露于侧表面的内部电极的暴露部分。第二导电层被布置成覆盖第一导电层并且包括导电树脂。 T2 / T1的值在约3.4至约11.3的范围内，其中T1表示第一导电层的厚度，T2表示第二导电层的厚度。

4. 发明申请

US20110267736A1 ELECTRONIC COMPONENT 有权
标题翻译：电子元件
公开(公告)号：US20110267736A1
公开(公告)日：2011-11-03
申请号：US13092996
申请日：2011-04-25
申请人： Takehisa SASABAYASHI , Takumi TANIGUCHI
发明人： Takehisa SASABAYASHI , Takumi TANIGUCHI
IPC分类号： H01G4/002
CPC分类号： H01G4/005 , H01G4/228 , H01G4/232 , H01G4/30
摘要： A laminate includes insulating layers laminated to each other. Capacitor conductors are embedded in the laminate and have exposed portions exposed between the insulating layers at respective surfaces of the laminate. The capacitor conductors define a capacitor. External electrodes are provided by plating on the respective surfaces of the laminate so as to directly cover the respective exposed portions. When the laminate is viewed in plan in a y axis direction, the length of each of the exposed portions is approximately 35% to approximately 45% of the length of an outer periphery of the insulating layer.
摘要翻译：层压体包括彼此层叠的绝缘层。电容器导体嵌入在层叠体中，并且暴露在层压体的相应表面处的绝缘层之间的暴露部分。电容器导体定义电容器。通过电镀在层叠体的各个表面上以直接覆盖各个露出部分来提供外部电极。当在y轴方向上平面地观察层压体时，每个暴露部分的长度约为绝缘层外周长度的35％至约45％。

5. 发明申请

US20100271751A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：多层陶瓷电子元件
公开(公告)号：US20100271751A1
公开(公告)日：2010-10-28
申请号：US12765965
申请日：2010-04-23
申请人： Takehisa SASABAYASHI
发明人： Takehisa SASABAYASHI
IPC分类号： H01G4/30
CPC分类号： H01G4/30 , H01G4/012 , H01G4/232
摘要： In a multilayer ceramic electronic component, in an exposed area defined by exposed portions of a plurality of internal conductors, an area ratio of exposed portions in an end section of the exposed area is smaller than that of exposed portions in a center section of the exposed area.
摘要翻译：在多层陶瓷电子部件中，在由多个内部导体的暴露部分限定的暴露区域中，暴露区域的端部中的暴露部分的面积比小于暴露部分的暴露部分的暴露部分的面积比区。

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