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    • 1. 发明申请
    • Semiconductor integrated circuit having test function and manufacturing method
    • 具有测试功能和制造方法的半导体集成电路
    • US20060184848A1
    • 2006-08-17
    • US11335606
    • 2006-01-20
    • Mitsuo SerizawaKaname YamasakiMasafumi YamamotoKazuo Kato
    • Mitsuo SerizawaKaname YamasakiMasafumi YamamotoKazuo Kato
    • G01R31/28
    • G11C29/4401G01R31/318569G11C29/44G11C29/848G11C2029/0401G11C2029/0405G11C2029/3202
    • The logic integrated circuit comprises a logic circuit having the predetermined logic functions, a read/write memory circuit, a test circuit for testing whether fail bit is included in the memory circuit or not, and a boundary latch circuit formed of a plurality of flip-flop circuits which are capable of latching signals between said logic circuit and said memory circuit and also forming a shift register. Moreover, the logic integrated circuit is further provided with a fail relief information generating circuit for storing test result to the boundary latch circuit during execution of the test with the test circuit and generating the fail relief information for relieving fail of said memory circuit based on the stored test result. The test circuit mounted on the logic integrated circuit can generate the information for relieving fail bit in parallel with the test of a built-in memory circuit and can also output the same information to external side and relieve the RAM within a chip.
    • 逻辑集成电路包括具有预定逻辑功能的逻辑电路,读/写存储器电路,用于测试故障位是否包含在存储器电路中的测试电路,以及由多个触发器组成的边界锁存电路, 触发电路,其能够在所述逻辑电路和所述存储器电路之间锁存信号,并且还形成移位寄存器。 此外,逻辑集成电路还设置有故障补救信息生成电路,用于在与测试电路执行测试期间将测试结果存储到边界锁存电路,并且基于该测试电路产生用于缓解所述存储器电路的故障的故障排除信息 存储测试结果。 安装在逻辑集成电路上的测试电路可以生成与内置存储器电路的测试并行的解除故障位的信息,并且还可以向外部输出相同的信息并释放芯片内的RAM。
    • 3. 发明授权
    • Signal transmission circuit and semiconductor memory using the same
    • 信号传输电路和半导体存储器使用相同
    • US06438050B1
    • 2002-08-20
    • US10038914
    • 2002-01-08
    • Kazuo KanetaniHiroaki NambuKaname YamasakiTakeshi KusunokiFumihiko Arakawa
    • Kazuo KanetaniHiroaki NambuKaname YamasakiTakeshi KusunokiFumihiko Arakawa
    • G11C700
    • H03K3/356139
    • A transmission circuit for transmitting a data signal between circuit units through a signal wire. The data signal is transmitted for precharging the signal wire to high potential during a precharge period and discharging it to low potential according to data transmitted during an evaluation period or keeping the signal wire as it is. Latch type Source-Coupled-Logic is configured so that a first node and a second node used as an output terminal to the next stage are respectively charged together to high potential during the precharge period. The second node is discharged according to a potential at the first node during the evaluation period, and the first node is discharged according to a potential on the signal wire. Thus, the operation of discharging the signal wire by the driver circuit can be sped up.
    • 一种用于通过信号线在电路单元之间传输数据信号的传输电路。 发送数据信号,用于在预充电期间将信号线预充电到高电位,并根据在评估期间传输的数据将其放电到低电位,或保持信号线原样。 锁存型源耦合逻辑被配置为使得用作下一级的输出端的第一节点和第二节点在预充电周期期间分别充电到高电位。 第二节点在评估期间根据第一节点的电位放电,第一节点根据信号线上的电位放电。 因此,可以加快由驱动电路对信号线进行放电的动作。
    • 7. 发明授权
    • Semiconductor chip and method of repair design of the same
    • 半导体芯片和维修方法的设计一样
    • US08400853B2
    • 2013-03-19
    • US12778120
    • 2010-05-12
    • Chizu MatsumotoKaname YamasakiMichinobu NakaoYoshikazu Saitou
    • Chizu MatsumotoKaname YamasakiMichinobu NakaoYoshikazu Saitou
    • G11C7/00
    • G11C29/44G11C29/4401G11C29/88
    • A repair circuit achieving “group repair of mixed multiple repair methods” and a repair design method for making a product margin suitable are provided. In a chip mounting multiple RAMs, a repair circuit and a repair design method in consideration of a trade-off of chip yield and area increase along with mounting a repair circuit are provided. A repair circuit achieving “group repair of mixed multiple repair methods” which can select existence of a repair circuit, and one or more repair methods from I/O, column, and row repairs on the RAMS in the chip, respectively, when a repair circuit is mounted. The repair circuit performs repair per RAM group by sorting the RAMs mounting a repair circuit into a plurality of RAM groups. Also, a repair method which makes a number of acquired good chips in a wafer and an estimation method of the RAM grouping method are provided.
    • 提供了一种修复电路,实现混合多种修复方法的组修复和用于制作商品边缘的修复设计方法。 在安装多个RAM的芯片中,提供了考虑到芯片产量和面积增加的权衡以及安装修复电路的修复电路和修复设计方法。 修复电路分别实现了可以选择修复电路的存在的混合多种修复方法的组修复,以及在修复电路是否在芯片中的RAMS时分别从I / O,列和行修复中的一种或多种修复方法 安装。 修复电路通过将安装修复电路的RAM分类为多个RAM组来对每个RAM组进行修复。 此外,提供了使晶片中获得的多个芯片的数量的修复方法和RAM分组方法的估计方法。
    • 8. 发明申请
    • SEMICONDUCTOR CHIP AND METHOD OF REPAIR DESIGN OF THE SAME
    • 半导体芯片及其修复方法
    • US20100290299A1
    • 2010-11-18
    • US12778120
    • 2010-05-12
    • Chizu MATSUMOTOKaname YamasakiMichinobu NakaoYoshikazu Saitou
    • Chizu MATSUMOTOKaname YamasakiMichinobu NakaoYoshikazu Saitou
    • G11C29/00G11C29/12G06F17/50
    • G11C29/44G11C29/4401G11C29/88
    • A repair circuit achieving “group repair of mixed multiple repair methods” and a repair design method for making a product margin suitable are provided. In a chip mounting multiple RAMs, a repair circuit and a repair design method in consideration of a trade-off of chip yield and area increase along with mounting a repair circuit are provided. A repair circuit achieving “group repair of mixed multiple repair methods” which can select existence of a repair circuit, and one or more repair methods from I/O, column, and row repairs on the RAMS in the chip, respectively, when a repair circuit is mounted. The repair circuit performs repair per RAM group by sorting the RAMs mounting a repair circuit into a plurality of RAM groups. Also, a repair method which makes a number of acquired good chips in a wafer and an estimation method of the RAM grouping method are provided.
    • 提供了实现“混合多重修复方法的组修复”的维修电路和用于制造商品边缘的修理设计方法。 在安装多个RAM的芯片中,提供了考虑到芯片产量和面积增加的权衡以及安装修复电路的修复电路和修复设计方法。 分别在芯片上的RAMS上实现“可以选择修复电路的存在的”混合多重修复方法的组修复“以及I / O,列和行修复中的一种或多种修复方法的修复电路 电路安装。 修复电路通过将安装修复电路的RAM分类为多个RAM组来对每个RAM组进行修复。 此外,提供了使晶片中获得的多个芯片的数量的修复方法和RAM分组方法的估计方法。
    • 10. 发明授权
    • Signal transmission circuit and semiconductor memory using the same
    • 信号传输电路和半导体存储器使用相同
    • US06337581B1
    • 2002-01-08
    • US09599738
    • 2000-06-23
    • Kazuo KanetaniHiroaki NambuKaname YamasakiTakeshi KusunokiFumihiko Arakawa
    • Kazuo KanetaniHiroaki NambuKaname YamasakiTakeshi KusunokiFumihiko Arakawa
    • H03K190185
    • H03K3/356139
    • Disclosed herein is a transmission circuit for transmitting a data signal between circuit units on a semiconductor integrated circuit through a signal wire. The data signal is transmitted by a driver circuit for precharging the signal wire to a high potential during a precharge period and discharging the signal wire to a low potential according to data to be transmitted during an evaluation period or keeping the signal wire at a high potential as floating as it is. Latch type Source-Coupled-Logic configured so that a first node and a second node used as an output terminal to the next stage are respectively charged together to a high potential during the precharge period, the second node is discharged according to a potential at the first node during the evaluation period, and the first node is discharged according to a potential on the signal wire, is used as a receiving circuit, whereby a distinction as to a high or low level of the potential on the signal wire is made with early timing provided to perform the operation of discharging the signal wire by the driver circuit.
    • 这里公开了一种用于通过信号线在半导体集成电路上的电路单元之间传输数据信号的发送电路。 数据信号由驱动电路传输,用于在预充电期间将信号线预充电到高电位,并根据在评估期间要发送的数据将信号线放电到低电位,或者将信号线保持在高电位 像浮动一样。 锁存型源耦合逻辑被配置为使得用作到下一级的输出端的第一节点和第二节点在预充电周期期间分别充电到高电位,第二节点根据在 在评估期间的第一节点和第一节点根据信号线上的电位放电,被用作接收电路,从而对信号线上的电位的高电平或低电平进行区分以提前 提供用于执行由驱动器电路放电信号线的操作的定时。