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    • 2. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20110228583A1
    • 2011-09-22
    • US13035134
    • 2011-02-25
    • Mitsuhiro NOGUCHIKenji SAWAMURATakeshi KAMIGAICHIKatsuaki ISOBE
    • Mitsuhiro NOGUCHIKenji SAWAMURATakeshi KAMIGAICHIKatsuaki ISOBE
    • G11C5/06
    • G11C5/025G11C16/0483G11C16/26
    • According to one embodiment, a semiconductor memory device includes a memory cell array, a first sense amplifier circuit, and a second sense amplifier circuit. The memory cell array includes a plurality of first memory cell units, a plurality of second memory cell units, a plurality of first interconnects, and a plurality of second interconnects. The first sense amplifier circuit is connected to the plurality of first interconnects. The second sense amplifier circuit is connected to the plurality of second interconnects. Heights of upper surfaces of interconnects are equal. At least one of a width of each of the plurality of second interconnects along a second direction perpendicular to the first direction and a thickness of each of the plurality of second interconnects along a third direction perpendicular to the first direction and the second direction is set smaller than each of the plurality of first interconnects, and the first sense amplifier circuit and the second sense amplifier circuit are disposed to face each other across the memory cell array.
    • 根据一个实施例,半导体存储器件包括存储单元阵列,第一读出放大器电路和第二读出放大器电路。 存储单元阵列包括多个第一存储单元单元,多个第二存储单元单元,多个第一互连和多个第二互连。 第一读出放大器电路连接到多个第一互连。 第二读出放大器电路连接到多个第二互连。 互连上表面的高度相等。 沿着与第一方向垂直的第二方向的多个第二互连件的每一个的宽度中的至少一个以及沿着垂直于第一方向和第二方向的第三方向的多个第二互连件中的每一个的厚度被设置得较小 并且第一读出放大器电路和第二读出放大器电路被设置为跨越存储单元阵列彼此面对。
    • 4. 发明申请
    • SEMICONDUCTOR STORAGE DEVICE
    • 半导体存储设备
    • US20110298033A1
    • 2011-12-08
    • US13051355
    • 2011-03-18
    • Junya MATSUNAMIMitsuhiro NOGUCHI
    • Junya MATSUNAMIMitsuhiro NOGUCHI
    • H01L29/788
    • H01L27/11521G11C16/0483H01L27/11524H01L29/7883
    • According to one embodiment, a semiconductor storage device includes a charge storage layer, a control gate. The charge storage layer is formed above a semiconductor substrate with first insulating film disposed therebetween. The control gate is formed above the charge storage layer with second insulating film disposed therebetween. The control gate includes a nickel silicide region. The side surface expands outwardly in at least a partial region thereof, and height of the control gate from a portion at which the side surface thereof starts to expand outwardly to a top of the control gate is greater than maximum width of the control gate in a region above the portion at which the side surface starts to expand outwardly.
    • 根据一个实施例,半导体存储装置包括电荷存储层,控制栅极。 电荷存储层形成在半导体衬底之上,第一绝缘膜位于它们之间。 控制栅极形成在电荷存储层上方,其间设置有第二绝缘膜。 控制栅极包括硅化镍区域。 侧表面在其至少部分区域中向外扩张,并且控制门从其侧表面开始向外膨胀到控制栅极顶部的部分的高度大于控制栅极的最大宽度 在侧面开始向外膨胀的部分之上的区域。
    • 7. 发明申请
    • NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND DEPLETION-TYPE MOS TRANSISTOR
    • 非易失性半导体存储器件和漏电型MOS晶体管
    • US20090218637A1
    • 2009-09-03
    • US12359643
    • 2009-01-26
    • Kenji GOMIKAWAMitsuhiro NOGUCHI
    • Kenji GOMIKAWAMitsuhiro NOGUCHI
    • H01L29/78
    • H01L29/7838H01L27/11526H01L27/11534
    • A peripheral circuit includes at least a first transistor. The first transistor comprises a gate electrode formed on a surface of a semiconductor layer via a gate insulating film. A channel region of a first conductivity type having a first impurity concentration is formed on a surface of the semiconductor layer directly below and in the vicinity of the gate electrode.A source-drain diffusion region of the first conductivity type is formed on the surface of the semiconductor layer to sandwich the gate electrode and has a second impurity concentration greater than the first impurity concentration. An overlapping region of the first conductivity type is formed on the surface of the semiconductor layer directly below the gate electrode where the channel region and the source-drain diffusion region overlap. The overlapping region has a third impurity concentration greater than the second impurity concentration.
    • 外围电路至少包括第一晶体管。 第一晶体管包括通过栅极绝缘膜形成在半导体层的表面上的栅电极。 具有第一杂质浓度的第一导电类型的沟道区形成在栅电极正下方和附近的半导体层的表面上。 第一导电类型的源极 - 漏极扩散区形成在半导体层的表面上以夹着栅电极,并且具有大于第一杂质浓度的第二杂质浓度。 第一导电类型的重叠区域形成在沟道区域和源极 - 漏极扩散区域重叠的栅电极正下方的半导体层的表面上。 重叠区域具有大于第二杂质浓度的第三杂质浓度。
    • 8. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20120236619A1
    • 2012-09-20
    • US13231510
    • 2011-09-13
    • Hiroyuki KUTSUKAKEKikuko SUGIMAEMitsuhiro NOGUCHI
    • Hiroyuki KUTSUKAKEKikuko SUGIMAEMitsuhiro NOGUCHI
    • G11C5/06
    • G11C16/0483G11C5/063G11C8/14H01L27/0207H01L27/088H01L27/11519H01L27/11529
    • According to one embodiment, a semiconductor memory device includes a memory array and a peripheral circuit. The memory array has a plurality of memory cells, word lines, and bit lines, in which a first, second, and third blocks are set in the order along the bit line. The peripheral circuit has a transistor group. The transistor group includes a first transfer transistor belonging to the first block, a second transfer transistor belonging to the second block, and a third transfer transistor belonging to the third block. The first, second, and third transfer transistors share the other of a source and a drain of each. With regard to a direction in which either of the source and the drain is connected to the other in each of the first, second, and third transfer transistors, the directions of the adjacent transfer transistors are different from each other by 90° or 180°.
    • 根据一个实施例,半导体存储器件包括存储器阵列和外围电路。 存储器阵列具有多个存储单元,字线和位线,其中按照位线的顺序设置第一,第二和第三块。 外围电路具有晶体管组。 晶体管组包括属于第一块的第一转移晶体管,属于第二块的第二转移晶体管和属于第三块的第三转移晶体管。 第一,第二和第三转移晶体管共享每个的源极和漏极中的另一个。 关于源极和漏极中的任一个与第一,第二和第三转移晶体管中的每一个连接到另一个的方向,相邻的转移晶体管的方向彼此相差90°或180° 。
    • 9. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20100038617A1
    • 2010-02-18
    • US12540896
    • 2009-08-13
    • Shingo NAKAJIMAEiji ITOMitsuhiro NOGUCHI
    • Shingo NAKAJIMAEiji ITOMitsuhiro NOGUCHI
    • H01L47/00H01L21/36
    • H01L27/24
    • A semiconductor memory device having a first wiring layer which is provided on a first insulator, and which extends in a first direction, and a non-volatile memory cell which is provided in a pillar shape on the first wiring layer, and which includes a non-ohmic element and variable resistance element connected in series. The resistance value of the variable resistance element changes in accordance with a voltage or current applied thereto. A barrier layer is provided on the memory cell and is configured in an in-plane direction. A conductive layer is provided on the barrier layer and is configured in an in-plane direction. A second insulator is provided on the first insulator and covers side surfaces of the memory cell, the barrier layer, and the conductive layer. A second wiring layer is provided on the conductive layer and extends in a second direction.
    • 一种具有设置在第一绝缘体上并沿第一方向延伸的第一布线层的半导体存储器件和在第一布线层上以柱形形式设置的非易失性存储单元, 元件和可变电阻元件串联连接。 可变电阻元件的电阻值根据施加到其上的电压或电流而变化。 阻挡层设置在存储单元上并且被配置在面内方向上。 导电层设置在阻挡层上并且被配置在面内方向上。 第二绝缘体设置在第一绝缘体上并且覆盖存储单元,阻挡层和导电层的侧表面。 第二布线层设置在导电层上并沿第二方向延伸。
    • 10. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE REDUCING RESISTANCE FLUCTUATION OF DATA TRANSFER LINE
    • 半导体存储器件降低数据传输线的电阻波动
    • US20110096600A1
    • 2011-04-28
    • US12877563
    • 2010-09-08
    • Mitsuhiro NOGUCHI
    • Mitsuhiro NOGUCHI
    • G11C16/04
    • G11C16/0483G11C16/08H01L27/11519H01L27/11524H01L2924/0002H01L2924/00
    • According to one embodiment, a semiconductor memory device includes first and second memory cell blocks and an interconnect rerouting unit provided therebetween. The first memory cell block includes first interconnects and second interconnects provided in each space between the first interconnects. The second memory cell block includes a plurality of third interconnects provided on lines extending from the first interconnects and a plurality of fourth interconnects provided on lines extending from the second interconnects. A width and a thickness of the second and fourth interconnects are smaller than a width and a thickness of the first and second interconnects. Each of the first to fourth interconnects is connected to one end of first to fourth cell units including memory cells. The interconnect rerouting unit connects one of the fourth interconnects to one of the first interconnects and connects one of the third interconnects to the second interconnects.
    • 根据一个实施例,半导体存储器件包括第一和第二存储单元块以及设置在其间的互连重路由单元。 第一存储单元块包括设置在第一互连之间的每个空间中的第一互连和第二互连。 第二存储单元块包括设置在从第一互连线延伸的线上的多个第三互连以及设置在从第二互连延伸的线上的多个第四互连。 第二和第四互连的宽度和厚度小于第一和第二互连的宽度和厚度。 第一至第四互连中的每一个连接到包括存储单元的第一至第四单元单元的一端。 互连重路由单元将第四互连中的一个连接到第一互连中的一个,并将第三互连中的一个连接到第二互连。