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1. 发明专利

JP2013232691A Manufacture intermediate product of power module substrate, and manufacturing method of power module substrate 有权
标题翻译：功率模块基板的制造中间产品及功率模块基板的制造方法
公开(公告)号：JP2013232691A
公开(公告)日：2013-11-14
申请号：JP2013169938
申请日：2013-08-19
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGASE TOSHIYUKI , YUYAMA HIDEKI
IPC分类号： H01L23/13 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a power module substrate for preventing attachment of a wax material onto a circuit formation surface, while reliably joining a ceramic substrate to a metal board by brazing.SOLUTION: A production intermediate product is used in a power module substrate manufacturing process, which comprises: a ceramic substrate 11; and a metal board 15 jointed to a surface of the ceramic substrate 11 with a wax material 19, and where the metal board 15 comprises a protrusion 15a to be protruded from the ceramic substrate 11 in a surface direction, and surplus of the wax material 19 leaked from between the ceramic substrate 11 and the metal board 15 is held on the surface of the protrusion 15a on a side of the ceramic substrate 11.
摘要翻译：要解决的问题：提供一种用于防止蜡材料附着在电路形成表面上的功率模块基板的制造方法，同时通过钎焊可靠地将陶瓷基板接合到金属板。解决方案：使用生产中间产品功率模块衬底制造工艺，其包括：陶瓷衬底11; 以及用蜡材料19连接到陶瓷基板11的表面的金属板15，并且金属板15包括从表面方向从陶瓷基板11突出的突起15a，并且多余的蜡材料19 从陶瓷基板11和金属板15之间漏出的陶瓷基板11被保持在陶瓷基板11一侧的突起15a的表面上。

2. 发明专利

JP2010114166A Manufacture intermediate of power module substrate, and power module substrate manufacturing method 审中-公开
标题翻译：功率模块基板的制造中间件和功率模块基板制造方法
公开(公告)号：JP2010114166A
公开(公告)日：2010-05-20
申请号：JP2008283759
申请日：2008-11-04
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGASE TOSHIYUKI , YUYAMA HIDEKI
IPC分类号： H01L23/13
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a production intermediate of a power module substrate for preventing the attachment of a wax material onto a circuit formation surface, while reliably joining a ceramic substrate to a metal board by brazing, and to provide a power module substrate manufacturing method. SOLUTION: The production intermediate is used in a power module substrate manufacturing process, which includes: the ceramic substrate 11; and a metal board 15 jointed to the surface of the ceramic substrate 11 with the use of the wax material 19, and where the metal board 15 includes a protrusion 15a to be protruded from the ceramic substrate 11 in a surface direction, and the surplus of the wax material 19 leaked from a part between the ceramic substrate 11 and the metal board 15 is held on the surface of the protrusion 15a on the side of the ceramic substrate 11. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供用于防止蜡材料附着到电路形成表面上的功率模块基板的生产中间体，同时通过钎焊可靠地将陶瓷基板接合到金属板，并且提供功率模块衬底制造方法。解决方案：生产中间体用于功率模块衬底制造工艺中，其包括：陶瓷衬底11; 以及通过使用蜡材料19连接到陶瓷基板11的表面的金属板15，并且金属板15包括从表面方向从陶瓷基板11突出的突起15a，并且剩余的从陶瓷基板11和金属板15之间的部分露出的蜡材19被保持在陶瓷基板11一侧的凸部15a的表面上。（C）2010，JPO＆INPIT

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