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1. 发明专利

JP2013225714A Manufacturing method of printed wiring board 有权
标题翻译：印刷线路板的制造方法
公开(公告)号：JP2013225714A
公开(公告)日：2013-10-31
申请号：JP2013165311
申请日：2013-08-08
申请人： Mitsubishi Electric Corp , 三菱電機株式会社 , Nippon Avionics Co Ltd , 日本アビオニクス株式会社
发明人： OSUGA HIROYUKI , SAMEJIMA SOHEI , SAKURADA KAZUHITO , YAGASAKI AKIRA , HIUGA TATSUYA
IPC分类号： H05K3/46 , H05K1/02
CPC分类号： H05K3/42 , H05K1/0243 , H05K1/0366 , H05K1/0373 , H05K1/115 , H05K1/181 , H05K3/303 , H05K3/4611 , H05K2201/0187 , H05K2201/0323 , H05K2203/0228
摘要： PROBLEM TO BE SOLVED: To prevent a CFRP to be exposed on a side surface of a core even if an outer edge of the core is cut after a circuit is formed at the core.SOLUTION: A core including a carbon fiber reinforced plastic is prepared. A first through hole penetrating through the core is formed. A paste resin 24 including an inorganic filler fills the first through hole. A second through hole 4, which penetrates through the core and partially overlaps with the first through hole in a plane view thereby defining an outer edge 80 of a region that should be a printed wiring board with the first through hole 4, is formed. Another resin 70 including an inorganic filler fills the second through hole 4. The core is cut along the outer edge 80 defined by the first through hole and the second through hole 4.
摘要翻译：要解决的问题：为了防止CFRP暴露在芯的侧表面上，即使在芯线形成电路之后切割芯的外边缘。解决方案：制备包括碳纤维增强塑料的芯。形成贯穿芯的第一通孔。包含无机填料的糊状树脂24填充第一通孔。第二通孔4穿过芯部并且在平面图中部分地与第一通孔重叠，从而形成了应当是具有第一通孔4的印刷线路板的区域的外边缘80。包括无机填料的另一树脂70填充第二通孔4.芯沿着由第一通孔和第二通孔4限定的外边缘80切割。

2. 发明专利

JP2011044646A Method of manufacturing printed wiring board 有权
标题翻译：制造印刷线路板的方法
公开(公告)号：JP2011044646A
公开(公告)日：2011-03-03
申请号：JP2009193189
申请日：2009-08-24
申请人： Mitsubishi Electric Corp , Nippon Avionics Co Ltd , 三菱電機株式会社 , 日本アビオニクス株式会社
发明人： SAMEJIMA SOHEI , OZAKI TAKESHI , OSUGA HIROYUKI , SAKURADA KAZUHITO , HIUGA TATSUYA
IPC分类号： H05K3/44
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board improved in reliability.
SOLUTION: The method of manufacturing the printed wiring board 10 includes the processes of: forming a core including carbon fiber-reinforced plastic having a first through hole; forming a first film on a lower surface of the core to cover the first through hole and filling the first through hole with a first insulating member; removing the first film; forming a second through hole in the core; forming a second film on an upper surface of the core to cover the second through hole and filling the second through hole with a second insulating member; removing the second film; and forming a circuit at least on one of the first and second insulating members.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种提高可靠性的印刷线路板的制造方法。解决方案：制造印刷电路板10的方法包括以下工艺：形成包括具有第一通孔的碳纤维增强塑料的芯; 在所述芯的下表面上形成第一膜以覆盖所述第一通孔并用第一绝缘构件填充所述第一通孔; 去除第一个胶片; 在所述芯中形成第二通孔; 在所述芯的上表面上形成第二膜以覆盖所述第二通孔并用第二绝缘构件填充所述第二通孔; 去除第二片; 以及在所述第一和第二绝缘构件中的至少一个上形成电路。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2003031927A Method of manufacturing printed wiring board 审中-公开
标题翻译：制造印刷线路板的方法
公开(公告)号：JP2003031927A
公开(公告)日：2003-01-31
申请号：JP2001213268
申请日：2001-07-13
申请人： Nippon Avionics Co Ltd , 日本アビオニクス株式会社
发明人： HIUGA TATSUYA
IPC分类号： H05K3/24 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board through a semi-additive method which does not require a pattern forming film, to be corrected for the line width of a conductor pattern and is suitable for the formation of a fine pattern.
SOLUTION: In this printed wiring board, a conductor pattern is formed through a semi-additive method. An electroless nickel plating 2 is formed on all the surface of a laminate, having no copper foil, a conductor pattern is electroplated with copper 4, and then only the nickel plating 2 is selectively etched for the formation of the conductor pattern.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种通过不需要图案形成膜的半添加方法制造印刷线路板的方法，以针对导体图案的线宽进行校正，并且适于形成细微的模式。解决方案：在该印刷电路板中，通过半添加方法形成导体图案。在没有铜箔的层叠体的全部表面上形成化学镀镍2，用铜4电镀导体图案，然后仅选择性地蚀刻镀镍层2以形成导体图案。

4. 发明专利

JP2014086547A Manufacturing method of flex-rigid printed wiring board 有权
标题翻译：柔性印刷布线板的制造方法
公开(公告)号：JP2014086547A
公开(公告)日：2014-05-12
申请号：JP2012234005
申请日：2012-10-23
申请人： Nippon Avionics Co Ltd , 日本アビオニクス株式会社
发明人： IIKUBO TAKAYUKI , HIUGA TATSUYA
IPC分类号： H05K3/46 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a flex-rigid printed wiring board with which work is facilitated and reliability is improved.SOLUTION: An adhesive sheet and a rigid wiring board are manufactured having openings equal in size formed thereon. The adhesive sheet and the rigid wiring board are overlapped and affixed in this order from both sides of a flexible wiring board so that primary lamination is performed. A mold removable auxiliary material which is freely removable and of which the outer diameter is smaller than an inner diameter of the openings, fills the openings, and the adhesive sheet and a conductor layer are affixed in order from the outside of the auxiliary material all over the surface. The conductor layer is pressurized, heated, and laminated as a whole from the outside thereof, a copper wiring layer is formed in the conductor layer, an outer-most adhesive layer is then cut in a gap between the opening and the mold removable auxiliary material, and the cut adhesive layer and mold removable auxiliary material are taken out and removed together.
摘要翻译：要解决的问题：提供一种柔性刚性印刷线路板的制造方法，其具有促进作业和提高可靠性的可能性。解决方案：制造具有形成在其上的尺寸相等的开口的粘合片和刚性布线板。粘合片和刚性布线板从挠性布线板的两侧依次重叠并固定，从而进行初级层压。一种可自由移除并且其外径小于开口的内径的模具可移除辅助材料填充开口，并且粘合片和导体层依次从辅助材料的外部依次固定表面。导体层从其外部整体加压，加热和层叠，在导体层中形成铜布线层，然后在开口和可移除模具的辅助材料之间的间隙中切割最外层粘合剂层，并将切割的粘合剂层和模具可移除辅助材料一起取出并取出。

5. 发明专利

JP2007067276A Printed wiring board and method of manufacturing the same 审中-公开
标题翻译：印刷线路板及其制造方法
公开(公告)号：JP2007067276A
公开(公告)日：2007-03-15
申请号：JP2005253570
申请日：2005-09-01
申请人： Nippon Avionics Co Ltd , 日本アビオニクス株式会社
发明人： HIUGA TATSUYA
IPC分类号： H05K3/20 , H05K1/11 , H05K3/42
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board having a through-hole with a high aspect ratio in which the plating thickness of the inner wall of the through-hole is increased sufficiently, and having a fine circuit pattern in the outer layer. SOLUTION: The board includes a fine circuit pattern 14 and a through-hole 12. The fine circuit pattern 14 is formed by a plating 62 on a copper foil 20 which is held on a temporary substrate 50 to allow delamination, and is exposed on the surface after being transferred to a main substrate 16 with the copper foil. In the through-hole 12, a pad 22 is formed on the copper foil 20. The pad 22 of the through-hole 12 is formed on the copper foil 20 that has been transferred to the main substrate 16 from the temporary substrate 50. The fine circuit pattern 14 is the one that has been formed on the copper foil 20 of the temporary substrate 50 by plating and transferred to the main substrate 16. Therefore, the fine circuit pattern 14 can be made sufficiently thin. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决问题的方案为了提供一种印刷电路板，其具有通孔的高纵横比，通孔的内壁的电镀厚度充分增加，并且具有精细的电路图案外层。解决方案：电路板包括精细电路图案14和通孔12.精细电路图案14由铜箔20上的镀层62形成，铜箔20被保持在临时衬底50上以允许分层，并且是在用铜箔转印到主基板16之后，在表面露出。在通孔12中，在铜箔20上形成有焊盘22.通孔12的焊盘22形成在从临时基板50转移到主基板16的铜箔20上。精细电路图案14是通过电镀形成在临时基板50的铜箔20上的电路图案14，并转印到主基板16上。因此，可以使精细电路图案14变得足够薄。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2010192792A Method of selectively filling holes of printed circuit board with resin 有权
标题翻译：用树脂选择印刷电路板孔的方法
公开(公告)号：JP2010192792A
公开(公告)日：2010-09-02
申请号：JP2009037539
申请日：2009-02-20
申请人： Nippon Avionics Co Ltd , 日本アビオニクス株式会社
发明人： HIUGA TATSUYA , TOKISAWA TOYONARI
IPC分类号： H05K3/42
摘要： PROBLEM TO BE SOLVED: To provide a method of selectively filling holes of a printed circuit board with resin. SOLUTION: The method includes the following steps of: (a) boring first small holes in a first sheet-like member made of a magnetic material at the positions of holes to be filled with resin; (b) boring second small holes in a detachable second sheet-like member with adhesive properties at the positions of holes not to be filled with resin; (c) adhering the second sheet-like member obtained at step (b) onto the printed circuit board while adjusting the hole positions; (d) placing the printed circuit board obtained at step (c) on a placement table capable of changing a magnetic force while the surface on which the second sheet-like member is adhered is facing downward and sticking the first sheet-like member obtained at step (a) on the printed circuit board while adjusting the hole positions and applying the magnetic force, in a vacuum atmosphere; (e) applying the liquefied resin on the first sheet-like member; and (f) peeling off the first sheet-like member after releasing it from the vacuum state. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用树脂选择性地填充印刷电路板的孔的方法。解决方案：该方法包括以下步骤：（a）在要填充树脂的孔的位置上将由磁性材料制成的第一片状构件中的第一小孔镗孔; （b）在具有粘合性的可拆卸的第二片状构件中，在未填充树脂的孔的位置上钻孔第二小孔; （c）在调整孔位置的同时将在步骤（b）获得的第二片状构件粘附到印刷电路板上; （d）将在步骤（c）中获得的印刷电路板放置在能够改变磁力的放置台上，同时第二片状部件粘附在其上的表面朝下并粘附在第一片状部件上获得的第一片状部件步骤（a）在真空气氛中调整孔位置并施加磁力; （e）将液化的树脂施加在第一片状构件上; 和（f）从真空状态下剥离第一片状部件后，剥离第一片状部件。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2003168868A METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开
公开(公告)号：JP2003168868A
公开(公告)日：2003-06-13
申请号：JP2001368204
申请日：2001-12-03
申请人： NIPPON AVIONICS CO LTD
发明人： HIUGA TATSUYA
IPC分类号： H05K1/11 , H05K3/40 , H05K3/42 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed circuit board capable of obtaining a minute pattern in a high density by reducing a thickness of a surface conductor layer. SOLUTION: The method for manufacturing the printed circuit board comprises the step of laminating the sides of copper foils 22 of a copper foil 24 with a carrier on both surfaces of an inner layer circuit board 20, thereby obtaining a laminate 25. The method further comprises the steps of perforating a hole 26 for an IVH at a predetermined position of the laminate 25, and forming a copper plating layer 27 on the entire surface of the laminate 25 including the hole 26. The method also comprises the steps of filling a conductive paste 29 in the IVH 28, removing the carriers 23 on the front and rear of the laminate 25, and polishing the surfaces of the foils 22, thereby obtaining the smooth surfaces. The method also comprises the steps of thereafter electrolytic copper plating the entire surface of the laminate 25 thinner than the plating layer 27 to form a copper plating layer 41, forming a required conductor pattern 42, thereby obtaining the printed circuit board 40. COPYRIGHT: (C)2003,JPO

8. 发明专利

JP2003110228A DEWATERING DEVICE FOR PRINTED WIRING BOARD 有权
公开(公告)号：JP2003110228A
公开(公告)日：2003-04-11
申请号：JP2001299675
申请日：2001-09-28
申请人： NIPPON AVIONICS CO LTD
发明人： HIUGA TATSUYA
IPC分类号： B08B5/02 , H05K3/26
摘要： PROBLEM TO BE SOLVED: To provide a highly efficient dewatering device in a process for removing liquid sticking to a printed wiring board. SOLUTION: A cylindrical jetting device 3 having multiple holes arranged spirally at least in a line on a side is disposed. The jetting devices 3 are extended in a direction at a right angle to the transfer direction of the printed wiring board 101. The jetting device 3 is rotated with a shaft center as a center. Compressed air is supplied to the jetting device 3 during rotation from a compressed air supply means connected to one end of the jetting device 3 by a freely rotatable air joint 4. Thus, compressed air which is jetted from a jet nozzle 6 becomes a rotating spiral air curtain 7. Liquid 105 bonded to the printed wiring board 101 is discharged in a direction crossing the transfer direction of the printed wiring board 101.

9. 发明专利

JP2003092461A METHOD FOR MANUFACTURING PRINTED WIRING BOARD 审中-公开
公开(公告)号：JP2003092461A
公开(公告)日：2003-03-28
申请号：JP2001281721
申请日：2001-09-17
申请人： NIPPON AVIONICS CO LTD
发明人： HIUGA TATSUYA
IPC分类号： H05K3/20 , H05K3/22 , H05K3/26 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To slash a production cost due to decreasing a fraction defective and slashing a manpower in a method for manufacturing a printed wiring board formed, so that a surface of an external layer circuit pattern is flush with a surface of an insulating base material. SOLUTION: In a method for transferring a circuit pattern, a copper-clad lamination plate 4 with a copper foil carrier 5 as a tentative substrate is used, and a copper sulfate plating layer 7 is formed thereon. Next, a circuit pattern is formed, and an insulating basic plate 14 is laminated on this plane via a prepreg 13 to transfer the circuit pattern. Thereafter, the copper foil carrier 5 is left behind, and the copper-clad lamination plate 4 is released and the still left copper foil carrier 5 and the copper sulfate plating layer 7 are removed by etching.

10. 发明专利

JP2002094217A METHOD OF MANUFACTURING PRINTED WIRING BOARD 失效
公开(公告)号：JP2002094217A
公开(公告)日：2002-03-29
申请号：JP2000281430
申请日：2000-09-18
申请人： NIPPON AVIONICS CO LTD
发明人： HIUGA TATSUYA
IPC分类号： C23C22/63 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To provide a method of forming an organic resist film high enough in strength to stand an etchant spray in an etching process. SOLUTION: An organic film 9 is selectively formed on the surface of a copper plating by the use of an alkyl benzimidazole solution, and the exposed part of the copper plating is etched, using the organic film 9 as an etching resist in a process of manufacturing a copper through-hole printed wiring board. All the surface of the copper plating 4 including the inner wall of a through-hole is subjected to a blacking treatment 5 before an organic film is formed.

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