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1. 发明专利

JP2013225714A Manufacturing method of printed wiring board 有权
标题翻译：印刷线路板的制造方法
公开(公告)号：JP2013225714A
公开(公告)日：2013-10-31
申请号：JP2013165311
申请日：2013-08-08
申请人： Mitsubishi Electric Corp , 三菱電機株式会社 , Nippon Avionics Co Ltd , 日本アビオニクス株式会社
发明人： OSUGA HIROYUKI , SAMEJIMA SOHEI , SAKURADA KAZUHITO , YAGASAKI AKIRA , HIUGA TATSUYA
IPC分类号： H05K3/46 , H05K1/02
CPC分类号： H05K3/42 , H05K1/0243 , H05K1/0366 , H05K1/0373 , H05K1/115 , H05K1/181 , H05K3/303 , H05K3/4611 , H05K2201/0187 , H05K2201/0323 , H05K2203/0228
摘要： PROBLEM TO BE SOLVED: To prevent a CFRP to be exposed on a side surface of a core even if an outer edge of the core is cut after a circuit is formed at the core.SOLUTION: A core including a carbon fiber reinforced plastic is prepared. A first through hole penetrating through the core is formed. A paste resin 24 including an inorganic filler fills the first through hole. A second through hole 4, which penetrates through the core and partially overlaps with the first through hole in a plane view thereby defining an outer edge 80 of a region that should be a printed wiring board with the first through hole 4, is formed. Another resin 70 including an inorganic filler fills the second through hole 4. The core is cut along the outer edge 80 defined by the first through hole and the second through hole 4.
摘要翻译：要解决的问题：为了防止CFRP暴露在芯的侧表面上，即使在芯线形成电路之后切割芯的外边缘。解决方案：制备包括碳纤维增强塑料的芯。形成贯穿芯的第一通孔。包含无机填料的糊状树脂24填充第一通孔。第二通孔4穿过芯部并且在平面图中部分地与第一通孔重叠，从而形成了应当是具有第一通孔4的印刷线路板的区域的外边缘80。包括无机填料的另一树脂70填充第二通孔4.芯沿着由第一通孔和第二通孔4限定的外边缘80切割。

2. 发明专利

JP2011044646A Method of manufacturing printed wiring board 有权
标题翻译：制造印刷线路板的方法
公开(公告)号：JP2011044646A
公开(公告)日：2011-03-03
申请号：JP2009193189
申请日：2009-08-24
申请人： Mitsubishi Electric Corp , Nippon Avionics Co Ltd , 三菱電機株式会社 , 日本アビオニクス株式会社
发明人： SAMEJIMA SOHEI , OZAKI TAKESHI , OSUGA HIROYUKI , SAKURADA KAZUHITO , HIUGA TATSUYA
IPC分类号： H05K3/44
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board improved in reliability.
SOLUTION: The method of manufacturing the printed wiring board 10 includes the processes of: forming a core including carbon fiber-reinforced plastic having a first through hole; forming a first film on a lower surface of the core to cover the first through hole and filling the first through hole with a first insulating member; removing the first film; forming a second through hole in the core; forming a second film on an upper surface of the core to cover the second through hole and filling the second through hole with a second insulating member; removing the second film; and forming a circuit at least on one of the first and second insulating members.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种提高可靠性的印刷线路板的制造方法。解决方案：制造印刷电路板10的方法包括以下工艺：形成包括具有第一通孔的碳纤维增强塑料的芯; 在所述芯的下表面上形成第一膜以覆盖所述第一通孔并用第一绝缘构件填充所述第一通孔; 去除第一个胶片; 在所述芯中形成第二通孔; 在所述芯的上表面上形成第二膜以覆盖所述第二通孔并用第二绝缘构件填充所述第二通孔; 去除第二片; 以及在所述第一和第二绝缘构件中的至少一个上形成电路。版权所有（C）2011，JPO＆INPIT

3. 发明公开

EP2542041A4 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD 有权
标题翻译： VERFAHREN ZUR HERSTELLUNG EINERBESTÜCKTENLEITERPLATTE UNDBESTÜCKTELEITERPLATTE
公开(公告)号：EP2542041A4
公开(公告)日：2013-10-02
申请号：EP11747400
申请日：2011-02-23
申请人： MITSUBISHI ELECTRIC CORP , NIPPON AVIONICS CO LTD
发明人： OSUGA HIROYUKI , SAMEJIMA SOHEI , SAKURADA KAZUHITO , YAGASAKI AKIRA , HINATA TATSUYA
IPC分类号： H05K3/46
CPC分类号： H05K3/42 , H05K1/0243 , H05K1/0366 , H05K1/0373 , H05K1/115 , H05K1/181 , H05K3/303 , H05K3/4611 , H05K2201/0187 , H05K2201/0323 , H05K2203/0228
摘要： On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component (90) is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes the steps of preparing a CFRP core (10), forming a through hole (1) so as to penetrate the CFRP core (10) from the front surface side to the back surface side and include a region in which the component (90) is to be mounted when viewed in a plan view, and embedding a GFRP core (30) having insulating properties within the through hole (1) by filling the through hole (1) with a resin (24) having insulating properties and curing the resin (24). According to the manufacturing method, the component (90) mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit.
摘要翻译：在通过制造印刷电路板的方法获得的印刷电路板上，预定部件（90）将被安装在前表面侧和后表面侧中的至少一个上。该制造方法包括以下步骤：制备CFRP芯（10），形成贯通孔（1）以从前表面侧到后表面侧穿过CFRP芯（10）的步骤，并且包括其中部件（90）在平面图中观察时被安装，并且通过用具有绝缘性的树脂（24）填充所述通孔（1），将具有绝缘性能的GFRP芯（30）嵌入所述通孔（1）内，以及固化树脂（24）。根据制造方法，安装在印刷电路板上的部件（90）不受由CFRP引起的杂散电容的影响，并且不难形成电路。

4. 发明专利

JP2010147107A Photoelectromotive force device and its manufacturing method 审中-公开
标题翻译：光电装置及其制造方法
公开(公告)号：JP2010147107A
公开(公告)日：2010-07-01
申请号：JP2008320165
申请日：2008-12-16
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： UCHIUMI SHIGERU , KUMADA TERUHIKO , KUBO KAZUKI , SAMEJIMA SOHEI
IPC分类号： H01L31/04
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a photoelectromotive force device having an electrode structure where a light reception area on a light receiving face side of the photoelectromotive force device is reduced as compared to a conventional case. SOLUTION: The device is provided with a P-type silicon substrate 12 where an N-type diffusion layer is formed on a first main face side, a plurality of grid electrodes 21 which are extended in a first direction and formed in parallel on a first main face to collect current caused in the silicon substrate 12, a bus bar electrode 22 which is formed in a second direction on the first main face and takes current collected by the grid electrodes 21 outside and a back electrode which is formed on a second main face side of the silicon substrate 12, collects current caused in the silicon substrate 12 and takes it outside. In the grid electrode 21, a cross section perpendicular to the first direction of the grid electrode 21 at a tip part is smaller than that in a connection part with the bus bar electrode 22. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有电极结构的光电动势装置，其中与常规情况相比，光电动势装置的光接收面侧的光接收面积减小。解决方案：该器件设置有P型硅衬底12，其中在第一主面侧上形成N型扩散层，多个栅电极21在第一方向上延伸并且平行地形成在第一主面上收集在硅基板12中产生的电流;汇流条电极22，其形成在第一主面上的第二方向上，并且由外部的栅格电极21收集的电流和形成在硅衬底12的第二主面侧收集在硅衬底12中引起的电流并将其带到外部。在栅电极21中，与顶栅部分的栅电极21的第一方向垂直的截面小于与母线电极22的连接部分的横截面。（C）2010，JPO＆INPIT

5. 发明专利

JP2006196606A Printed wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2006196606A
公开(公告)日：2006-07-27
申请号：JP2005005482
申请日：2005-01-12
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YANAGIURA SATOSHI , SAMEJIMA SOHEI , TOYOSHIMA TOSHIYUKI , OZAKI TAKESHI , MORINAGA HIROTSUGU
IPC分类号： H05K1/11 , H05K1/02 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To obtain a printed wiring board which is high in heat dissipating efficiency and capable of coping with high-density mounting. SOLUTION: The printed wiring board contains, at least one element selected from fiber, textile, and powder, and is equipped with a core of laminated structure composed of a resin composite board 1, a metal foil 3, and a resin composite board 1 which are laminated in this sequence. Holes are bored in the core so as to come into contact with the center metal foil 3 through the resin composite board 1. Thereafter, electrolytic copper plating is carried out using the center metal foil 3 as a power feeding layer, and the bored holes are filled up with copper for the formation of copper via posts 6. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：获得散热效率高并能够应对高密度安装的印刷电路板。解决方案：印刷电路板包含至少一种选自纤维，织物和粉末的元素，并且配备有由树脂复合板1，金属箔3和树脂复合材料构成的层叠结构的芯板1以这个顺序层压。孔通过树脂复合板1与中心金属箔3接触而在芯体中钻孔。之后，使用中心金属箔3作为供电层进行电解镀铜，并且钻孔为填补了铜通过帖子6形成铜。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2013067138A Nonflammable composite material, nonflammable fiber-reinforced composite material, method for manufacturing them, and elevator car member 有权
标题翻译：非易燃复合材料，不可熔化纤维增强复合材料，其制造方法和电梯座椅
公开(公告)号：JP2013067138A
公开(公告)日：2013-04-18
申请号：JP2011208912
申请日：2011-09-26
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KUBO KAZUKI , AWANO YUHEI , MABUCHI TAKAHIRO , SAMEJIMA SOHEI , MATSUMOTO MICHIHITO , OKAWA TATSUYA
IPC分类号： B32B5/28 , B32B27/18 , C08J5/24
摘要： PROBLEM TO BE SOLVED: To provide a lightweight and high-durable nonflammable composite material having high flame retardance, a nonflammable fiber-reinforced composite material to be used for the nonflammable composite material, a method for manufacturing them, and to provide an elevator car material using the nonflammable composite material or the nonflammable fiber-reinforced composite material.SOLUTION: The nonflammable fiber-reinforced composite is formed by impregnating fiber with resin. The resin includes at least one of brominated unsaturated polyester resin and brominated epoxy acrylate resin. At least one of aluminum hydroxide and magnesium hydroxide is dispersed.
摘要翻译：要解决的问题：提供一种具有高阻燃性的轻量且高耐久性的不可燃复合材料，用于不可燃复合材料的不燃性纤维增强复合材料，其制造方法，并提供一种使用不燃性复合材料或不可燃纤维增强复合材料的电梯轿厢材料。
解决方案：不可燃纤维增强复合材料是用树脂浸渍纤维形成的。树脂包括溴化不饱和聚酯树脂和溴化环氧丙烯酸酯树脂中的至少一种。氢氧化铝和氢氧化镁中的至少一种分散。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2012214651A Flame-retardant fiber-reinforced composite material, sandwich panel, method of producing them, and elevator car 审中-公开
标题翻译：阻燃纤维增强复合材料，三面板，生产它们的方法和电梯车
公开(公告)号：JP2012214651A
公开(公告)日：2012-11-08
申请号：JP2011081710
申请日：2011-04-01
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： AWANO YUHEI , KUBO KAZUKI , MABUCHI TAKAHIRO , SAMEJIMA SOHEI , MATSUMOTO MICHIHITO
IPC分类号： C08J5/10 , B29C39/10 , B29C39/42 , C08K5/51 , C08K7/02 , C08L63/10 , C08L67/06 , C08L83/04
摘要： PROBLEM TO BE SOLVED: To provide a flame-retardant fiber-reinforced composite material that shows good handleability in a resin when molded, has excellent flame retardance after molded, does not generate a halogen-containing gas even if burned, is lightweight, and has high rigidity.SOLUTION: A matrix resin is obtained by adding 10 to 17 pts.mass of organic phosphoric acid metallic salt particles having a 50% particle diameter Dof 10 μm or lower and 95% particle diameter Dof 30 μm or lower, to 100 pts.mass of at least one selected from a group comprising a vinyl ester resin, an unsaturated polyester resin and a silicone resin. The flame-retardant fiber-reinforced composite material is obtained by: impregnating a fiber base material with the matrix resin; and then curing the resultant base material.
摘要翻译：要解决的问题：为了提供一种阻燃纤维增强复合材料，其在模制时在树脂中显示良好的可操作性，在模制后具有优异的阻燃性，即使燃烧也不产生含卤素的气体，重量轻，刚性好。解决方案：通过将10至17质量％的具有50％粒径D 50 的有机磷酸金属盐颗粒加入10μm或更低和30μm以下的95％粒径D 95 至100质量份选自乙烯基酯树脂，不饱和聚酯树脂和硅树脂。阻燃纤维增强复合材料通过以下方式获得：用基体树脂浸渍纤维基材; 然后固化所得的基材。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2012136334A Sandwich panel, method of manufacturing the same and elevator car using the same 有权
标题翻译：三面板及其制造方法及使用其的电梯车
公开(公告)号：JP2012136334A
公开(公告)日：2012-07-19
申请号：JP2010289924
申请日：2010-12-27
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KUBO KAZUKI , AWANO YUHEI , MABUCHI TAKAHIRO , SAMEJIMA SOHEI , MATSUMOTO MICHIHITO , OKAWA TATSUYA
IPC分类号： B66B11/02
摘要： PROBLEM TO BE SOLVED: To provide a sandwich panel which is excellent in flame retardance while being reduced in weight, to provide a method of manufacturing the sandwich panel, and to provide an elevator car using the sandwich panel.SOLUTION: In the sandwich panel SP, a carbon fiber composite material layer 3a is attached to one side surface of a first foamed material layer 1 as a core material, and metal foil or a metal plate 4a is attached to the surface of the carbon fiber composite material layer 3a. A carbon fiber composite material layer is attached to the other side surface of the first foamed material layer 1, and metal foil or a metal plate 4b is attached to the surface of the carbon fiber composite material layer. A coating layer 5a is applied on the surface of the metal foil or the metal plate 4b, and a coating layer 5b is applied on the surface of the metal foil or the metal plate 4b.
摘要翻译：要解决的问题：提供一种减轻重量的阻燃性优异的夹层板，提供一种制造夹层板的方法，并提供使用夹层板的电梯轿厢。解决方案：在夹层板SP中，将碳纤维复合材料层3a作为芯材附着在第一发泡体层1的一个侧面上，将金属箔或金属板4a附着在碳纤维复合材料层3a。碳纤维复合材料层附着在第一发泡体层1的另一侧面，金属箔或金属板4b附着在碳纤维复合材料层的表面。在金属箔或金属板4b的表面上涂敷涂层5a，在金属箔或金属板4b的表面涂布涂层5b。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2009188895A Antenna device 审中-公开
标题翻译：天线设备
公开(公告)号：JP2009188895A
公开(公告)日：2009-08-20
申请号：JP2008028861
申请日：2008-02-08
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NISHIOKA YASUHIRO , SAMEJIMA SOHEI , OHASHI HIDEMASA , SASAKI TAKUO , YOSHIDA KOJI
IPC分类号： H01Q19/185 , H01Q13/08
摘要： PROBLEM TO BE SOLVED: To obtain an antenna device which can maximize an impedance ratio bandwidth in a microstrip patch antenna constitution wherein two parasitic elements are disposed above a feed element.
SOLUTION: The device has a patch conductor 1 which is disposed via a dielectric 5 to a grounding conductor 4, a patch conductor 2 which is disposed via a dielectric 6 on the other side of the patch conductor 4 to the patch conductor 1, a patch conductor 3 which is disposed via a dielectric 7 on the other side of the patch conductor 1 to the patch conductor 2 and a feed line which supplies high frequency power between the grounding conductor 4 and the patch conductor 1. A size W2 of the patch conductor 2, the W3 of the patch conductor 3, an electrical equivalent size W3e of the patch conductor 3, a distance t3 between the patch conductors 2, 3 and the relative permittivity εr3 of the dielectric 7 are selected to satisfy W3≤W2≤W3e(t3, εr3).
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了获得能够使微带贴片天线的阻抗比带宽最大化的天线装置，其中两个寄生元件设置在馈电元件上方。解决方案：该装置具有通过电介质5设置到接地导体4的贴片导体1，贴片导体2，其经由敷片导体4的另一侧上的电介质6设置到贴片导体1 配线导体3，其经由敷片导体1的另一侧的电介质7配置到贴片导体2，以及在接地导体4和贴片导体1之间提供高频电力的馈电线。尺寸W2为贴片导体2，贴片导体3的W3，贴片导体3的电当量尺寸W3e，贴片导体2,3之间的距离t3和电介质7的相对介电常数εr3被选择为满足W3≤W2 ≤W3e（t3，εr3）。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2005123397A Method for manufacturing multilayer printed wiring board 审中-公开
标题翻译：制造多层印刷线路板的方法
公开(公告)号：JP2005123397A
公开(公告)日：2005-05-12
申请号：JP2003356609
申请日：2003-10-16
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SAMEJIMA SOHEI , UCHIUMI SHIGERU , YANAGIURA SATOSHI , OKA SEIJI
IPC分类号： B23K26/00 , B23K26/38 , B23K101/42 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method capable of obtaining a multilayer printed wiring board, wherein even if lands provided between vias and between the via and a signal line are eliminated, or even if the land is made small, the connection reliability between respective layers can be ensured and a stable transmission characteristic is excellent. SOLUTION: The manufacturing method comprises a step of filling a conductive paste containing a metal filler in a through hole provided at a specific location of a base material between insulating layers to form the vias a step of forming a wiring layer on a surface of the base material between the insulating layers, when a multilayer printed wiring board 10 is manufactured, a step of laminating the base material between the insulating layers on a face on which the wiring layer is provided; and a step of irradiating a laser at a specific location of the base material between the insulating layers laminated, to provide the through hole; and a step of filling the conductive paste in the through hole to form the vias. The metal filler of 70% or more of the metal fillers included in the conductive paste has a mean particle size of 5 μm, and has a size of 1/10 or less of a mean hole diameter on a laser irradiation side of the through hole. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种能够获得多层印刷线路板的制造方法，其中即使在通孔之间和通孔和信号线之间设置的焊盘被消除，或者即使焊盘变小，可以确保各层之间的连接可靠性，并且稳定的传输特性优异。解决方案：制造方法包括在绝缘层之间的基材的特定位置的通孔中填充含有金属填料的导电膏的步骤，以形成通孔，该步骤在表面上形成布线层绝缘层之间的基材的制造方法，在制造多层印刷电路板10时，在设置有布线层的面上的绝缘层之间层叠基材的工序; 以及在层叠的绝缘层之间的基材的特定位置照射激光的步骤，以提供通孔; 以及将导电膏填充在通孔中以形成通孔的步骤。包含在导电浆料中的70％以上的金属填充剂的金属填料的平均粒径为5μm，并且具有通孔的激光照射侧的平均孔径的1/10以下的尺寸。版权所有（C）2005，JPO＆NCIPI

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