会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明专利
    • Heterojunction field effect transistor and manufacturing thereof
    • 异相场效应晶体管及其制造
    • JP2014099523A
    • 2014-05-29
    • JP2012250894
    • 2012-11-15
    • Mitsubishi Electric Corp三菱電機株式会社
    • SUITA MUNEYOSHINANJO TAKUMASUZUKI YOSUKEIMAI AKIFUMIOKAZAKI HIROYUKI
    • H01L29/812H01L21/205H01L21/338H01L29/778
    • PROBLEM TO BE SOLVED: To provide a heterojunction field effect transistor and a manufacturing method thereof capable of maintaining a two-dimensional electron gas concentration immediately beneath a gate electrode and also capable of improving breakdown voltage.SOLUTION: The heterojunction field effect transistor comprises: a second nitride semiconductor layer 3 formed on a semi-insulating substrate 1 by penetrating a first nitride semiconductor layer 2; a gate electrode 8 formed in a prescribed region on a fourth nitride semiconductor layer 5; and a source electrode 6 and a drain electrode 7 formed on one side and the other side of the gate electrode 8, respectively. The second nitride semiconductor layer 3 is formed beneath a region between the gate electrode 8 and the drain electrode 7 plus a prescribed region including at least a portion beneath a region of an edge 12 on the drain electrode 7 side of the gate electrode 8, its band-gap energy being larger than the band-gap energy of the first nitride semiconductor layer 2 and of the third nitride semiconductor layer 4.
    • 要解决的问题:提供一种异质结场效应晶体管及其制造方法,其能够将二维电子气体浓度保持在栅电极正下方,并且还能够提高击穿电压。解决方案:异质结场效应晶体管包括: 通过穿透第一氮化物半导体层2在半绝缘基板1上形成的第二氮化物半导体层3; 形成在第四氮化物半导体层5上的规定区域中的栅电极8; 以及分别形成在栅电极8的一侧和另一侧的源电极6和漏电极7。 第二氮化物半导体层3形成在栅电极8和漏极电极7之间的区域的下方,加上在栅电极8的漏电极7侧的边缘12的至少一部分以下的规定区域, 带隙能量大于第一氮化物半导体层2和第三氮化物半导体层4的带隙能量。
    • 2. 发明专利
    • Semiconductor device and manufacturing method of the same
    • 半导体器件及其制造方法
    • JP2013225621A
    • 2013-10-31
    • JP2012097892
    • 2012-04-23
    • Mitsubishi Electric Corp三菱電機株式会社
    • SUZUKI YOSUKEABE YUJISUITA MUNEYOSHINANJO TAKUMAIMAI AKIFUMIYAGYU EIJI
    • H01L21/338H01L21/336H01L29/778H01L29/78H01L29/786H01L29/812
    • PROBLEM TO BE SOLVED: To obtain a semiconductor device having hetero junction of excellent characteristics, which supports high breakdown voltage and high current at the same time.SOLUTION: A semiconductor device comprises: an electron transit layer 3 which has a 2DEG (two dimensional electron gas) and composed of GaN; an electron supply layer 4 which is provided on the electron transit layer 3 and composed of AlGaN for supplying electrons to the 2DEG; a first cap layer 5 composed of an undoped semiconductor, which has an opening provided on the electron supply layer 4 and opening so as to surround a gate electrode 11; and a second cap layer 6 composed on an n-type semiconductor, which is provided only on the first cap layer 5 and which has an opening opening at least on a downstream side than the gate electrode in an electron transition direction of the 2DEG and having an opening width wider than that of the opening of the first cap layer 5.
    • 要解决的问题:获得具有优异特性的异质结的半导体器件,其同时支持高击穿电压和高电流。解决方案:一种半导体器件包括:电子转移层3,其具有2DEG(二维电子 气体)并由GaN组成; 电子供给层4,设置在电子输送层3上,由用于向2DEG供给电子的AlGaN构成; 由未掺杂半导体构成的第一盖层5,其具有设置在电子供给层4上并且围绕栅电极11开口的开口; 以及第二盖层6,其构造在仅在第一盖层5上并且在2DEG的电子转移方向上至少在栅电极的下游侧具有开口的n型半导体上,并且具有在 开口宽度比第一盖层5的开口宽。
    • 4. 发明专利
    • Nitride semiconductor device, and method of manufacturing the same
    • 氮化物半导体器件及其制造方法
    • JP2011054809A
    • 2011-03-17
    • JP2009203227
    • 2009-09-03
    • Mitsubishi Electric Corp三菱電機株式会社
    • SHIOZAWA KATSUOMIABE YUJIFUKITA MUNEYOSHINANJO TAKUMAIMAI AKIFUMIYAGYU EIJI
    • H01L29/812H01L21/225H01L21/338H01L29/778
    • PROBLEM TO BE SOLVED: To provide a nitride semiconductor device capable of high-speed operation by reducing access resistance while keeping breakdown-voltage characteristics, and to provide a method of manufacturing the same.
      SOLUTION: The heterojunction field-effect semiconductor device using a nitride semiconductor includes: a channel layer 3 and a barrier layer 4 formed by being sequentially laminated on a substrate 1; and a source electrode 5 and a drain electrode 6 formed separately from each other on the barrier layer 4, wherein impurity diffusion regions 22 are formed by performing impurity diffusion to a region below each of the source electrode 5 and the drain electrode 6 and from the front surface of the barrier layer 4 to at least a portion of the channel layer 3, and a bandgap is changed.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种能够通过在保持击穿电压特性的同时降低访问电阻而能够进行高速操作的氮化物半导体器件,并提供其制造方法。 解决方案:使用氮化物半导体的异质结场效应半导体器件包括:沟道层3和通过依次层压在衬底1上形成的势垒层4; 以及在阻挡层4上彼此分开形成的源极电极5和漏极电极6,其中通过对源极电极5和漏电极6之下的区域进行杂质扩散,从而形成杂质扩散区域22 阻挡层4的前表面到沟道层3的至少一部分,并且带隙改变。 版权所有(C)2011,JPO&INPIT
    • 5. 发明专利
    • Nitride semiconductor device and manufacturing method thereof
    • 氮化物半导体器件及其制造方法
    • JP2010123785A
    • 2010-06-03
    • JP2008296619
    • 2008-11-20
    • Mitsubishi Electric Corp三菱電機株式会社
    • KANEMOTO KYOZOSHIOZAWA KATSUOMIOISHI TOSHIYUKINANJO TAKUMATOKUDA YASUKI
    • H01S5/323
    • PROBLEM TO BE SOLVED: To provide a nitride semiconductor device that suppresses complicated processes and a drop of yield and has adhesion strength enough to prevent the peeling of electrodes, and to provide the manufacturing method thereof. SOLUTION: The nitride semiconductor device includes: a first conductive type semiconductor layer 1 having a ridge 2 on its surface; an insulation film 3 that is stacked on the semiconductor layer 1 to cover at least digging bottoms on both sides of the ridge 2; and an electrode 5 that is continuously formed on the upper surface of the ridge 2 and the surface of the insulation film 3. The insulation film includes a roughened surface 4 wherein a concave and convex section is formed by roughening. The manufacturing method thereof includes; (a) a step to form the ridge 2 on the surface of the semiconductor layer 1; (b) a step to cover at least digging bottoms on both side of the ridge 2 with the insulation film 3; (c) a step to form the roughened surface 4 on the surface of the insulation film 3; and (d) a step to continuously form the electrode 5 on the upper surface of the ridge 2 and the surface of the insulation film 3. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供抑制复杂工艺和产量下降的氮化物半导体器件,并具有足以防止电极剥离的粘合强度,并提供其制造方法。 解决方案:氮化物半导体器件包括:在其表面上具有脊2的第一导电类型半导体层1; 堆叠在半导体层1上的绝缘膜3,以至少覆盖脊2的两侧的挖坑底部; 以及连续地形成在脊2的上表面和绝缘膜3的表面上的电极5.绝缘膜包括粗糙表面4,其中通过粗糙化形成凹凸部分。 其制造方法包括: (a)在半导体层1的表面上形成隆起2的工序; (b)至少用绝缘膜3覆盖脊2的两侧的底部的步骤; (c)在绝缘膜3的表面上形成粗糙表面4的步骤; 和(d)在脊2的上表面和绝缘膜3的表面上连续地形成电极5的步骤。版权所有(C)2010,JPO&INPIT
    • 6. 发明专利
    • Semiconductor device and its manufacturing method
    • 半导体器件及其制造方法
    • JP2008053426A
    • 2008-03-06
    • JP2006227735
    • 2006-08-24
    • Mitsubishi Electric Corp三菱電機株式会社
    • NANJO TAKUMAFUKITA MUNEYOSHIKANEMOTO KYOZOOISHI TOSHIYUKI
    • H01L21/28H01L33/32H01L33/36
    • PROBLEM TO BE SOLVED: To provide a semiconductor device having a nitride semiconductor layer in which a contact resistance between an electrode formed on an n-type nitride semiconductor layer and the n-type nitride semiconductor layer is lowered, and to provide the semiconductor device such as a high electronic mobility field-effect transistor or the like which is operated by a high voltage and high-frequency wave. SOLUTION: The n-type nitride semiconductor layer, a first metal layer, and a second metal layer are provided in the sequence from a side contacted with the n-type nitride semiconductor layer while impurities in the n-type nitride semiconductor layer are specified so as to be not less than 1×10 19 cm -3 , and the work function of the second metal layer is specified so as to be not more than 4.2 eV. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种具有氮化物半导体层的半导体器件,其中形成在n型氮化物半导体层上的电极与n型氮化物半导体层之间的接触电阻降低,并且提供 半导体装置,例如通过高电压和高频波操作的高电子迁移率场效应晶体管等。 解决方案:n型氮化物半导体层,第一金属层和第二金属层以与n型氮化物半导体层接触的一侧的顺序提供,而n型氮化物半导体层中的杂质 被指定为不小于1×10 19 cm -3 ,并且将第二金属层的功函数规定为不大于4.2 电子伏特。 版权所有(C)2008,JPO&INPIT
    • 10. 发明专利
    • ヘテロ接合電界効果型トランジスタおよびその製造方法
    • 异相场效应晶体管及其制造方法
    • JP2015008244A
    • 2015-01-15
    • JP2013133361
    • 2013-06-26
    • 三菱電機株式会社Mitsubishi Electric Corp
    • IMAI AKIFUMINANJO TAKUMASUZUKI YOSUKESUITA MUNEYOSHIOKAZAKI HIROYUKIYAGYU EIJI
    • H01L21/338H01L21/336H01L29/778H01L29/78H01L29/812
    • 【課題】本発明は、電気特性の変動を抑制するとともにアクセス領域の抵抗を低減することが可能なヘテロ接合電界効果型トランジスタおよびその製造方法を提供することを目的とする。【解決手段】本発明によるヘテロ接合電界効果型トランジスタは、窒化物半導体からなるヘテロ接合電界効果型トランジスタであって、半絶縁性SiC基板1上に形成されたチャネル層3と、チャネル層3上に形成された第1の電子供給層4と、第1の電子供給層4上の予め定められた領域に形成されたゲート電極10と、第1の電子供給層4上であって、ゲート電極10の一方側と他方側とに各々形成されたソース電極8およびドレイン電極9と、第1の電子供給層4上であって、ゲート電極10、ソース電極8、およびドレイン電極9が形成された領域以外の領域に、ソース電極8およびドレイン電極9と接さず、かつ第1の電子供給層4と接するように形成された第2の電子供給層5とを備える。【選択図】図1
    • 要解决的问题:提供能够抑制电特性的变化和降低接入区的电阻的异质结场效应晶体管,并提供其制造方法。解决方案:一种异质结场效应晶体管,其由 氮化物半导体,包括:形成在半绝缘SiC衬底1上的沟道层3; 形成在沟道层3上的第一电子供给层4; 形成在第一电子供给层4上的预定区域中的栅极电极10; 分别形成在第一电子供给层4上的栅电极10的一侧和另一侧的源电极8和漏电极9; 以及第二电子供给层5,形成在除了形成栅电极10,源电极8和漏电极9的区域以外的区域中,以便不与源电极8和漏电极9接触,以及 以在第一电子供给层4上与第一电子供给层4接触。