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1. 发明专利

JP2014097471A Cleaning mechanism and coater 审中-公开
标题翻译：清洁机械和涂料
公开(公告)号：JP2014097471A
公开(公告)日：2014-05-29
申请号：JP2012251224
申请日：2012-11-15
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： UEDA TETSUYA , ISHIDA KIYOSHI , KITAMURA YOICHI , KONDO YOSUKE
IPC分类号： B05C11/10 , B05C5/00 , H01L21/52 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a cleaning mechanism and a coater which can remove a liquid agent adhered to the bottom of a dispenser nozzle by dry cleaning and prevent re-adhesion of the removed liquid agent.SOLUTION: A cleaning mechanism includes a dispenser nozzle 10 and a wiping material 20. The dispenser nozzle 10 has a base part 11 and a tip part 12 and discharges a liquid agent 2 from a discharge outlet 12a arranged in the tip part 12. The wiping material 20 can remove the liquid agent 2 discharged from the discharge outlet 12a and adhered to the tip part 12 and the base part 11 by pressing toward the dispenser nozzle 10. The wiping material 20 is configured in such a way at to be brough into contact with the tip part 12 and the base part 11 when a pressure is applied to the wiping material 20 from both sides, i.e. the side of the dispenser nozzle 10 and the side opposite to the dispenser nozzle 10, with the wiping material 20 between both the sides.
摘要翻译：要解决的问题：提供一种清洁机构和涂布机，其可以通过干洗来去除附着在分配器喷嘴底部的液体剂，并且防止除去的液体试剂的再附着。溶液：清洁机构包括分配器喷嘴分配器喷嘴10具有基部11和顶端部12，并且从布置在顶端部12的排出口12a排出液体剂2.擦拭材料20可以除去排出的液体试剂2 从排出口12a通过朝向分配喷嘴10按压而粘附到前端部12和基部11.擦拭材料20被配置成与顶部部分12和基部部分接触如图11所示，当擦拭材料20从两侧施加压力时，即分配器喷嘴10的一侧和与分配器喷嘴10相对的一侧，擦拭材料20在两侧之间。

2. 发明专利

JP2006278943A High frequency circuit board 有权
标题翻译：高频电路板
公开(公告)号：JP2006278943A
公开(公告)日：2006-10-12
申请号：JP2005099080
申请日：2005-03-30
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： HASHIMOTO MINORU , KANEKO TATSUYA , KONDO YOSUKE , KANEZUKA NORIHIKO , ISHIDA KIYOSHI
IPC分类号： H01L23/12 , H01L25/04 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To reliably join a ceramic board to a carrier with a solder even when a curve or swell occurs in the ceramic board or carrier, thereby preventing a leakage of radio waves from a waveguide.
SOLUTION: This high frequency circuit board comprises a multilayered ceramic board 1 on which a plurality of pads 8 are formed on a joining face to a carrier board 2 and semiconductor electronic parts 5 are mounted for propagating radio waves, and the carrier board 2 which has waveguide holes 7 for passing the radio waves propagated by the semiconductor electronic parts 5 and retains the multilayered ceramic board 1. Bumps 10a, 10b are formed in the plurality of pads 8 of the multilayered ceramic board 1 by a high temperature solder, respectively, and the plurality of bumps 10a, 10b are joined to the carrier board 2 by a low temperature solder 11 with a lower melting temperature than the bumps 10a, 10b, whereby the multilayered ceramic board 1 is joined to the carrier board 2. The bumps 10a, 10b are formed so that the heights are different so as to follow a face shape of the carrier board 2.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使陶瓷板或载体发生弯曲或膨胀，即使陶瓷板也可以使用焊料可靠地接合到载体上，从而防止来自波导的无线电波的泄漏。解决方案：该高频电路板包括多层陶瓷板1，多个焊盘8形成在载体板2的接合面上，半导体电子部件5安装用于传播无线电波，载体板 2，其具有用于使由半导体电子部件5传播的无线电波通过的波导孔7并保持多层陶瓷板1.通过高温焊料在多层陶瓷板1的多个焊盘8中形成凸起10a，10b，并且多个凸起10a，10b通过具有比凸起10a，10b低的熔化温度的低温焊料11接合到载体板2，由此多层陶瓷板1接合到载体板2上。凸起10a，10b形成为使得高度不同，以便遵循载体板2的面部形状。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2010267792A Semiconductor device and manufacturing method therefor 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2010267792A
公开(公告)日：2010-11-25
申请号：JP2009117728
申请日：2009-05-14
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KONDO YOSUKE , YAMAGUCHI KAZUHIRO , TAKANO JIHEI , MITANI JUN , NAKANO SEISHI , ISHIDA KAZUNORI
IPC分类号： H05K3/34 , H01L21/60
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/15184 , H01L2924/15311 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing crack formation caused by heat stress, and a manufacturing method for the semiconductor device. SOLUTION: According to the semiconductor device 1, a subject to be mounted 2 is mounted on a mounted subject 3 via a plurality of arrayed or randomly arranged connection terminals 41. The semiconductor device 1 includes a means that forms a plurality of electrode pads 43a and 43b on the mounted subject 3, and a means that melts and solidifies the connection terminals 41 on the electrode pads 43a and 43b to join the connection terminals 41 to the mounted subject 3. Some electrode pads 43a each have a body 431 that regulates the solidified shape of the connection terminal 41, and a guide portion 432 that guides part of the connection terminal 41 to the outer periphery of the body 431 when the connection terminal 41 melts. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供能够抑制由热应力引起的裂纹形成的半导体器件及其制造方法。解决方案：根据半导体器件1，通过多个排列或随机排列的连接端子41将待安装对象2安装在被安装对象3上。半导体器件1包括形成多个电极的装置安装对象3上的焊盘43a和43b，以及熔接和固化电极焊盘43a和43b上的连接端子41以将连接端子41连接到安装的对象3的装置。一些电极焊盘43a各自具有主体431，主体431 调节连接端子41的固化形状，以及当连接端子41熔化时将连接端子41的一部分引导到主体431的外周的引导部432。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2008235531A Package for hermetic sealing, and connection structure 审中-公开
标题翻译：封装密封和连接结构
公开(公告)号：JP2008235531A
公开(公告)日：2008-10-02
申请号：JP2007072315
申请日：2007-03-20
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KONDO YOSUKE
IPC分类号： H01L23/02 , H01L23/08
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a package for hermetic sealing having high airtightness, which can easily be manufactured at low cost. SOLUTION: The package for hermetic sealing 30 includes: a ceramic substrate 10 for electronic component packaging, which has a metallization layer; a seal ring 20 soldered on the ceramic substrate; and a lid 25 fixed on the seal ring, wherein the package is configured in that the lid is fixed to the seal ring after an electronic component is mounted on the cavity. The surface on the ceramic substrate side in the seal ring is made into a convex-curved surface to the ceramic substrate side; or the edges of the surface and side surface on the ceramic substrate side in the seal ring is made in a round chamfer shape. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有高密封性的气密密封包装，其可以容易地以低成本制造。解决方案：用于气密密封的包装件30包括：用于电子部件包装的陶瓷基板10，其具有金属化层; 焊接在陶瓷基板上的密封环20; 以及固定在所述密封环上的盖25，其中所述包装被构造成在将电子部件安装在所述空腔上之后将所述盖固定到所述密封环。密封环的陶瓷基板侧的表面形成为陶瓷基板侧的凸曲面，或者密封环中的陶瓷基板侧的表面和侧面的边缘被制成圆形倒角形状。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2013149918A Wiring board and semiconductor module using the same 审中-公开
标题翻译：使用相同的接线板和半导体模块
公开(公告)号：JP2013149918A
公开(公告)日：2013-08-01
申请号：JP2012011224
申请日：2012-01-23
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： UEDA TETSUYA , KITAMURA YOICHI , KONDO YOSUKE
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To obtain a wiring board for flip-chip mounting which does not include bubbles in an underfill resin hardened material and which achieves high reliability without necessitating a large-scale device.SOLUTION: A wiring board comprises: a wiring board 100a on which a semiconductor chip 1 is to be flip-chip mounted; and a heat transfer structure 50 for heat supply which is provided on the wiring board 100a such that one end contacts an underfill resin hardened material 9 sandwiched in a gap between the semiconductor chip 1 to be flip-chip mounted and the wiring board 100a and the other end contacts an ambient atmosphere.
摘要翻译：要解决的问题：为了获得在底部填充树脂硬化材料中不包含气泡的倒装芯片安装用布线基板，能够实现高可靠性而不需要大型装置。布线基板包括：布线基板100a 半导体芯片1将被倒装安装在其上; 以及设置在配线基板100a上的供热用传热结构50，使得一端接触被夹在要倒装芯片的半导体芯片1和布线板100a之间的间隙中的底部填充树脂硬化材料9和另一端接触环境气氛。

6. 发明专利

JP2011253951A Electronic component package, and method of manufacturing the same 有权
标题翻译：电子元件包装及其制造方法
公开(公告)号：JP2011253951A
公开(公告)日：2011-12-15
申请号：JP2010127038
申请日：2010-06-02
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KITAMURA YOICHI , HASHIMOTO MINORU , KONDO YOSUKE , ABE HAJIME
IPC分类号： H01L23/02
CPC分类号： H01L2224/48091 , H01L2924/16152 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an electronic component package in which quality of soldering between a substrate pad and a lid can easily be determined by observation from the outside, and the method of manufacturing the same.SOLUTION: The flange part 16a of the lid 8a is formed so that a distance p from a carrier substrate 2a till the face 18 opposite to the face 17 of the flange part 16a which faces the carrier substrate 2a becomes shorter than a distance q from the carrier substrate 2a till the crown 21a of a body part 13, the face 17 of the flange part 16a which faces the carrier substrate 2a or the portion 23 of the side wall 22 of the body part 13 which faces the carrier substrate 2a has a protrusion 26 protruding toward the carrier substrate 2a side, a further outside portion 28 than the protrusion 26 in the face 17 of the flange part 16a which faces the carrier base 2a is soldered to the substrate pad 7, and a quantity of solder 11 existing in the outside portion 28 is more in comparison with a quantity of solder 11 existing in the further inside portion 31 than the protrusion 26.
摘要翻译：要解决的问题：提供一种电子部件封装，其中可以通过从外部观察来容易地确定衬底焊盘和盖子之间的焊接质量及其制造方法。解决方案：盖8a的凸缘部分16a形成为使得从承载基板2a到与凸缘部分16a的面对载体基板2a的面17相对的面18的距离p变得比距离 q从载体基板2a直到主体部分13的冠部21a，凸缘部分16a的面向载体基板2a的表面17或主体部分13的面向载体基板2a的侧壁22的部分23 具有朝向载体基板2a侧突出的突起26，与凸缘部16a的面向载体基部2a的面17中的突起26相比，将更多的外侧部分28焊接到基板焊盘7，并且将一定量的焊料11 存在于外部部分28中的焊料11比在突起26中存在于另外的内部部分31中的焊料量更多。（C）2012年，JPO和INPIT

7. 发明专利

JP2009241525A Cream solder printing device 审中-公开
标题翻译： CREAM焊接印刷设备
公开(公告)号：JP2009241525A
公开(公告)日：2009-10-22
申请号：JP2008093766
申请日：2008-03-31
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KONDO YOSUKE
IPC分类号： B41F15/20 , B41F15/08 , B41F15/26 , B41F15/40 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To obtain a reasonable priced cream solder printing device which can cream solder print even on a bad work piece of having an uneven adsorbing surface and therefore inferior in adhesion with an adsorbing surface.
SOLUTION: The device is equipped with a work holding table 12 which has; a printing mask installation surface 12h, a work piece accommodation casing part 12a which is formed as a concave form in a place one step lower from the printing mask installation surface 12h and a bottom surface of which becomes as a work piece adsorbing surface 12f, a negative pressure chamber 12b which is formed as a concave form in a place one step lower from the work piece adsorbing surface 12f and is blocked by a work piece 11, a suction hole 12c which connects the negative pressure chamber 12b to a vacuum generator, a ventilator 12e which connects the work piece accommodation casing part 12a on which the printing mask 13 is installed and blocked out to open air; and a squeegee 15 which performs cream solder printing 14 on the work piece 11 sliding over the printing mask 13 and through the opening pattern 13a of the printing mask 13.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了获得即使在具有不均匀吸附表面的不良工件上也能够焊接印刷，并且因此与吸附表面的粘附性差而获得价格合理的膏状焊料印刷装置。
解决方案：设备配有工作台12，工作台12具有：印刷掩模安装表面12h，工件容纳壳体部分12a，其形成为从印刷掩模安装表面12h下一个位置并且其底表面成为工件吸附表面12f的凹形的负压室12b在工件吸附面12f的下一个位置处形成为凹形，被工件11阻挡;将负压室12b与真空发生器连接的吸入孔12c，通气机12e，其连接安装有打印面罩13的工件住宿外壳部分12a并被封闭以露出空气; 以及在打印面罩13上滑动并通过打印面罩13的开口图案13a的工件11上执行膏状焊料印刷14的刮板15.版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2012164934A Circuit module, electronic component mounting board and circuit module manufacturing method 审中-公开
标题翻译：电路模块，电子元件安装板和电路模块制造方法
公开(公告)号：JP2012164934A
公开(公告)日：2012-08-30
申请号：JP2011026154
申请日：2011-02-09
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KITAMURA YOICHI , HASHIMOTO MINORU , KONDO YOSUKE , UEDA TETSUYA
IPC分类号： H01L23/12 , H05K3/34
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To utilize existing materials and processes to improve the reliability of solder joints in a circuit module manufacturing method.SOLUTION: The circuit module comprises a semiconductor element mounting board which has a semiconductor element mounted on one side thereof and a plurality of electrode pads connected to the semiconductor element formed on the opposite side, a circuit board which has a solder resist layer having openings formed on one side thereof via a ground layer, and solder balls which join the electrode pads on the semiconductor element mounting board and the ground layer of the circuit board together. The ground layer consists of a first electrode part covered in the solder resist layer and having a first film thickness and a second electrode part which is contiguous to the first electrode part and provided inside the opening of the solder resist layer, and having a film thickness greater than that of the first electrode part. The solder ball joins the second electrode part and the electrode pads of the semiconductor element mounting board together.
摘要翻译：要解决的问题：利用现有材料和工艺在电路模块制造方法中提高焊点的可靠性。解决方案：电路模块包括半导体元件安装板，其半导体元件安装在其一侧，并且多个电极焊盘连接到形成在相对侧上的半导体元件，电路板具有阻焊层具有通过接地层形成在其一侧的开口，以及将半导体元件安装板上的电极焊盘和电路板的接地层连接在一起的焊球。接地层由覆盖在阻焊层中的第一电极部分和具有第一膜厚度的第一电极部分和与第一电极部分邻接并设置在阻焊剂层的开口内部的第二电极部分，并且具有膜厚度大于第一电极部分的尺寸。焊球将半导体元件安装板的第二电极部分和电极焊盘连接在一起。版权所有（C）2012，JPO＆INPIT

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