专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2010263035A Method of manufacturing printed wiring board 审中-公开
标题翻译：制造印刷线路板的方法
公开(公告)号：JP2010263035A
公开(公告)日：2010-11-18
申请号：JP2009111791
申请日：2009-05-01
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ABE HAJIME , TAGUCHI TAKASHI
IPC分类号： H05K3/46 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To suppress inconsistency between positioning precision based on reference marks and positioning precision based on an in-product pattern. SOLUTION: A core substrate is prepared which includes an insulating base 1, an internal layer pattern formed on the insulating base 1, and reference marks 2 formed on the insulating base 1, and has a quadrangular plane shape. On the core substrate, an insulating resin layer and a surface layer pattern are formed. The step of preparing the core substrate includes the steps of: preparing the insulating base which contains first glass fiber and second glass fiber having higher tensile residual stress than the first glass fiber and has a first side 1a parallel with the direction of the second glass fiber; and forming two or more reference marks along the direction of the second glass fiber in a first region R1 including the first side 1a and a second region R2 opposed to the first region R1 among four regions R1 to R4 defined on a top surface of the insulating base with diagonals 3. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了抑制基于参考标记的定位精度和基于产品内图案的定位精度之间的不一致性。解决方案：制备核心基板，其包括绝缘基底1，形成在绝缘基底1上的内部图案以及形成在绝缘基底1上的参考标记2，并且具有四边形平面形状。在芯基板上形成绝缘树脂层和表层图案。准备核心基板的步骤包括以下步骤：制备包含第一玻璃纤维的绝缘基底和具有比第一玻璃纤维更高的拉伸残余应力的第二玻璃纤维，并且具有与第二玻璃纤维的方向平行的第一侧1a ; 并且在包括第一侧面1a的第一区域R1和与第一区域R1相对的第二区域R2上沿着第二玻璃纤维的方向形成两个或更多个参考标记，四个区域R1至R4限定在绝缘体的顶表面上基础与对角线3.版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2007287911A Semiconductor device manufacturing device and semiconductor device manufacturing method 审中-公开
标题翻译：半导体器件制造设备和半导体器件制造方法
公开(公告)号：JP2007287911A
公开(公告)日：2007-11-01
申请号：JP2006113383
申请日：2006-04-17
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ABE HAJIME , IINO TAKAHIRO
IPC分类号： H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing device that prevents the rear face of a wafer from being damaged when the wafer is separated from a workpiece in which the wafer is stuck to a support substrate with an adhesive, and a semiconductor device manufacturing method. SOLUTION: After supplying and arranging a porous sheet 8 on the suction face of a lower holding mechanism 14, the exposed rear-face side of the wafer 7 which is stuck to the support substrate 5 with the adhesive 6 is placed on the porous sheet 8 so that the whole rear face of the wafer 7 is sucked and held by a uniform suction force. The workpiece is sandwiched by an upper holding mechanism 13 and the lower holding mechanism 14. The adhesive 6 is heated and melted by a built-in heater so that the upper holding mechanism 13 is moved in a state of sucking the support substrate 5. The wafer 7 held via the porous sheet 8 is separated from the support substrate 5 and remains on the lower holding mechanism 14. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体器件制造装置，当晶片与粘合剂将晶片粘贴到支撑基板上的工件分离时，防止晶片的背面被损坏，并且半导体器件制造方法。解决方案：在下保持机构14的吸入面上供给并布置多孔片8之后，利用粘合剂6粘贴到支撑基板5上的晶片7的露出的背面侧被放置在多孔片8，以使得整个背面通过均匀的吸力被吸引和保持。工件被上部保持机构13和下部保持机构14夹持。粘合剂6通过内置加热器加热熔化，从而上部保持机构13在吸附支撑基板5的状态下移动。通过多孔片8保持的晶片7与支撑基板5分离并保留在下保持机构14上。（C）2008，JPO＆INPIT

3. 发明专利

JP2011171491A Electronic circuit board and method of manufacturing the same 有权
标题翻译：电子电路板及其制造方法
公开(公告)号：JP2011171491A
公开(公告)日：2011-09-01
申请号：JP2010033533
申请日：2010-02-18
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ABE HAJIME , IDETA GORO , SATO KOHEI , TANABE TAKESHI , UCHIDA SACHIHISA
IPC分类号： H05K1/02 , H05K1/18
摘要： PROBLEM TO BE SOLVED: To provide an electronic circuit board which can more easily be designed by suppressing the thermal expansion of a board, and to provide a manufacturing method of the same.
SOLUTION: The electronic circuit board 1 comprises the substrate 2 having recesses 4 on surfaces thereof and composed of a material containing a resin, electrode pads 5 formed on the side walls 4a of the recesses 4 and the surfaces of the substrate 2 and composed of a material containing a metal, and an external terminal 3 having conductivity and soldered to the electrode pads 5 in such a manner that the external terminal sandwiches the substrate 2 from the front surface side and the opposing rear surface side of the substrate 2.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过抑制板的热膨胀更容易设计的电子电路板，并提供其制造方法。解决方案：电子电路板1包括在其表面上具有凹部4并由包含树脂的材料构成的基板2，形成在凹部4的侧壁4a上的电极焊盘5和基板2的表面以及由含有金属的材料构成，外部端子3具有导电性，并以这样的方式焊接到电极焊盘5，使得外部端子从基板2的表面侧和相对的后表面侧夹持基板2。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2013149654A Jet nozzle, soldering apparatus, and soldering method 审中-公开
标题翻译：喷嘴，焊接设备和焊接方法
公开(公告)号：JP2013149654A
公开(公告)日：2013-08-01
申请号：JP2012006952
申请日：2012-01-17
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： IWATA NORIYA , ARAI HITOSHI , ABE HAJIME , SATO KOHEI , TANABE TAKESHI
IPC分类号： H05K3/34 , B23K1/00 , B23K1/08 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide a jet nozzle, a soldering apparatus, and a soldering method which control a separation angle of molten solder for each electronic component mounted on a printed board.SOLUTION: A jet nozzle 1 jets molten solder 4 and places the molten solder 4 in contact with a soldered part 3a of a printed board 3. The jet nozzle 1 includes a nozzle part 11 having an opening 12 for jetting the molten solder 4 and opening shape change means that changes a shape of the opening 12 of the nozzle part 11. The opening shape change means changes the shape of the opening 12 of the nozzle part 11 thereby partially changing a height of a liquid surface of the molten solder 4 jetted from the opening 12 in a region A above the nozzle part 11 and separating the molten solder 4, jetted in a state that the printed board 3 does not move, from the soldered part 3a of the printed board 3.
摘要翻译：要解决的问题：提供一种喷射喷嘴，焊接装置和焊接方法，其控制安装在印刷电路板上的每个电子部件的熔融焊料的分离角度。解决方案：喷嘴1喷射熔融焊料4，并将熔融焊料4与印刷电路板3的焊接部分3a接触。喷嘴1包括具有用于喷射熔融焊料4的开口12的喷嘴部分11和改变熔融焊料4的开口12的形状的开口形状改变装置开口形状改变装置改变喷嘴部分11的开口12的形状，从而部分地改变在喷嘴部分11上方的区域A中从开口12喷射的熔融焊料4的液面的高度，以及将印刷基板3不移动的状态喷出的熔融焊料4从印刷基板3的焊接部分3a分离。

5. 发明专利

JP2012233790A Device and method for inspecting photo-curable resin 审中-公开
标题翻译：用于检查光固化树脂的装置和方法
公开(公告)号：JP2012233790A
公开(公告)日：2012-11-29
申请号：JP2011102736
申请日：2011-05-02
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ABE HAJIME , SUDO SHUNEI
IPC分类号： G01N21/88
摘要： PROBLEM TO BE SOLVED: To provide a device and method for inspecting photo-curable resin which simply detect a minute amount of the photo-curable resin with high sensitivity.SOLUTION: The device for inspecting photo-curable resin is used to inspect the photo-curable resin in an inspection object, and includes a pulse light source 1, and a streak camera 7. The pulse light source 1 radiates UV pulsed light to a printed circuit board 5. The streak camera 7 detects fluorescent light generated from a residual of a solder resist 53 at a UV radiated portion of the printed circuit board 5, at a time point delayed more than the pulse width of the UV light radiated by the pulse light source 1.
摘要翻译：要解决的问题：提供一种检测光敏固化树脂的装置和方法，其以高灵敏度简单地检测微量的光固化树脂。
解决方案：用于检查光固化树脂的装置用于检查检查对象中的光固化树脂，并且包括脉冲光源1和条纹照相机7.脉冲光源1辐射UV脉冲光条纹照相机7在比UV光辐射的脉冲宽度延迟的时间点上检测在印刷电路板5的UV辐射部分由阻焊剂53的残留物产生的荧光通过脉冲光源1.版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2011253951A Electronic component package, and method of manufacturing the same 有权
标题翻译：电子元件包装及其制造方法
公开(公告)号：JP2011253951A
公开(公告)日：2011-12-15
申请号：JP2010127038
申请日：2010-06-02
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KITAMURA YOICHI , HASHIMOTO MINORU , KONDO YOSUKE , ABE HAJIME
IPC分类号： H01L23/02
CPC分类号： H01L2224/48091 , H01L2924/16152 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an electronic component package in which quality of soldering between a substrate pad and a lid can easily be determined by observation from the outside, and the method of manufacturing the same.SOLUTION: The flange part 16a of the lid 8a is formed so that a distance p from a carrier substrate 2a till the face 18 opposite to the face 17 of the flange part 16a which faces the carrier substrate 2a becomes shorter than a distance q from the carrier substrate 2a till the crown 21a of a body part 13, the face 17 of the flange part 16a which faces the carrier substrate 2a or the portion 23 of the side wall 22 of the body part 13 which faces the carrier substrate 2a has a protrusion 26 protruding toward the carrier substrate 2a side, a further outside portion 28 than the protrusion 26 in the face 17 of the flange part 16a which faces the carrier base 2a is soldered to the substrate pad 7, and a quantity of solder 11 existing in the outside portion 28 is more in comparison with a quantity of solder 11 existing in the further inside portion 31 than the protrusion 26.
摘要翻译：要解决的问题：提供一种电子部件封装，其中可以通过从外部观察来容易地确定衬底焊盘和盖子之间的焊接质量及其制造方法。解决方案：盖8a的凸缘部分16a形成为使得从承载基板2a到与凸缘部分16a的面对载体基板2a的面17相对的面18的距离p变得比距离 q从载体基板2a直到主体部分13的冠部21a，凸缘部分16a的面向载体基板2a的表面17或主体部分13的面向载体基板2a的侧壁22的部分23 具有朝向载体基板2a侧突出的突起26，与凸缘部16a的面向载体基部2a的面17中的突起26相比，将更多的外侧部分28焊接到基板焊盘7，并且将一定量的焊料11 存在于外部部分28中的焊料11比在突起26中存在于另外的内部部分31中的焊料量更多。（C）2012年，JPO和INPIT

7. 发明专利

JP2011222625A Printed wiring board, printed circuit device and manufacturing method of printed circuit device 审中-公开
标题翻译：印刷线路板，印刷电路装置及印刷电路装置的制造方法
公开(公告)号：JP2011222625A
公开(公告)日：2011-11-04
申请号：JP2010087851
申请日：2010-04-06
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： UCHIDA YOSHIHISA , IDETA GORO , ABE HAJIME , ARAI HITOSHI , TANABE TAKESHI
IPC分类号： H05K3/34 , H05K1/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board where peeling of a surface electrode layer and the like is suppressed, a printed circuit device on which an electronic component is mounted, and a manufacturing method of the printed circuit device.SOLUTION: In a base material 1 of a printed wiring board 51, a surface electrode layer 2 is formed on the main surface and a through hole 5 is formed at a prescribed position. A through hole electrode 6 is formed on the sidewall of the through hole 5. An inner electrode layer 3 is formed inside the base material 1. The inner electrode layer 3 has an area larger than that of a circle whose radius is the same as the diameter of the through hole 5. The thickness of the inner electrode layer 3 is made thicker than that of the surface electrode layer 2.
摘要翻译：要解决的问题：为了提供抑制表面电极层等的剥离的印刷电路板，其上安装有电子部件的印刷电路器件和印刷电路器件的制造方法。解决方案：在印刷电路板51的基材1中，在主表面上形成表面电极层2，并且在规定位置形成通孔5。通孔电极6形成在通孔5的侧壁上。内部电极层3形成在基材1的内部。内部电极层3的面积大于圆形的半径与内电极层3的厚度比表面电极层2厚。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2006156761A Semiconductor laser and manufacturing method thereof 审中-公开
标题翻译：半导体激光器及其制造方法
公开(公告)号：JP2006156761A
公开(公告)日：2006-06-15
申请号：JP2004346068
申请日：2004-11-30
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TANIMURA JUNJI , KUNITSUGU YASUHIRO , HIRAMATSU KENJI , ABE HAJIME , NAKAMURA HITOSHI
IPC分类号： H01S5/042 , H01S5/22
摘要： PROBLEM TO BE SOLVED: To obtain a ridged semiconductor laser which is manufactured with good reproduction property and stability by minimizing stress fluctuation applied to the periphery of a ridge part, and reducing the fluctuation of a refractive index of an optical wave guide so as to reduce the variation range of the expansion angle of a lateral mode. SOLUTION: In the case of forming a p electrode 11 consisting of a group of metal films containing a Ti film 12, a prescribed amount of oxygen is introduced to a vacuum tank, depositing is carried out by an electronic beam vacuum evaporation method, and oxygen concentration contained in the Ti film 12 contacting with a group of semiconductor layers 9 is set to be 10 to 40 at% after thermal treatment. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了通过使施加到脊部周围的应力波动最小化并且减小光波导的折射率的波动来获得制造具有良好再现性和稳定性的脊状半导体激光器以减少横向模式的扩张角的变化范围。解决方案：在形成由含有Ti膜12的一组金属膜组成的电极11的情况下，将规定量的氧气引入真空槽中，通过电子束真空蒸发法进行沉积，并且与热处理后的一组半导体层9接触的Ti膜12中含有的氧浓度设定为10〜40at％。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2014146847A Soldering apparatus and soldering method 有权
标题翻译：焊接设备和焊接方法
公开(公告)号：JP2014146847A
公开(公告)日：2014-08-14
申请号：JP2014106009
申请日：2014-05-22
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： IWATA NORIYA , ABE HAJIME , IDETA GORO , ARAI HITOSHI , YAMASHITA HIROYOSHI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering apparatus and a soldering method which effectively remove an air layer near a connection part between a printed circuit board and an electronic component and make solder oxide and the like less likely to adhere to a jetting port.SOLUTION: A soldering apparatus 1 places melting solder 2 jetted from a jetting port 3 in contact with a printed circuit board 15 to thereby soldering, and has a solder tank 4 and a spiral flow generation member 20. The solder tank 4 has the jetting port 3 and is used for accumulating the melting solder 2. The spiral flow generation member 20 is formed so as to generate spiral flow in the melting solder 2 jetted from the jetting port 3 of the solder tank 4.
摘要翻译：要解决的问题：提供一种有效地去除印刷电路板和电子部件之间的连接部分附近的空气层的焊接装置和焊接方法，并且使焊料氧化物等不太可能粘附到喷射口。：焊接装置1将从喷射口3喷射的熔融焊料2与印刷电路板15接触，从而进行焊接，并且具有焊料槽4和螺旋流产生部件20.焊料槽4具有喷射口3 并且用于积聚熔化焊料2.螺旋流产生件20形成为在从焊料槽4的喷射口3喷射的熔化焊料2中产生螺旋流。

10. 发明专利

JP2013038156A Manufacturing method of printed wiring board 有权
标题翻译：印刷线路板的制造方法
公开(公告)号：JP2013038156A
公开(公告)日：2013-02-21
申请号：JP2011171733
申请日：2011-08-05
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIGETA KOJI , IDETA GORO , ABE HAJIME
IPC分类号： H05K3/28
摘要： PROBLEM TO BE SOLVED: To obtain a printed wiring board which prevents a solder resist pattern from becoming an under cut shape and peeling and also prevents bridge failures and short circuits which are caused by soldering.SOLUTION: A manufacturing method of a printed wiring board includes the steps of: forming a resin film 5 for repelling a liquid solder resist 6 on a mounting pad 2 formed on an insulation substrate 1; applying and drying the liquid solder resist 6 on the insulation substrate 1 on which the resin film 5 is formed to form an uncured solder resist film 7; forming a photo-cured solder resist pattern 10 by conducting development after exposing the uncured solder resist film 7 through a photo mask 8; and removing the resin film 5.
摘要翻译：要解决的问题：为了获得防止阻焊图案变成欠切割形状和剥离的印刷线路板，并且还防止由焊接引起的桥接故障和短路。解决方案：印刷电路板的制造方法包括以下步骤：在形成在绝缘基板1上的安装焊盘2上形成用于排斥液体阻焊剂6的树脂膜5; 在其上形成有树脂膜5的绝缘基板1上涂布和干燥液体阻焊剂6以形成未固化的阻焊膜7; 在通过光掩模8暴露未固化的阻焊膜7之后，通过显影来形成光固化的阻焊剂图案10; 并去除树脂薄膜5.版权所有（C）2013，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式