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    • 1. 发明专利
    • Real time delay line
    • 实时延时线
    • JP2010273048A
    • 2010-12-02
    • JP2009122443
    • 2009-05-20
    • Mitsubishi Electric Corp三菱電機株式会社
    • EGUCHI SHINICHIHATAKEYAMA HIDEKITOMIYAMA KENICHIOGURA MEGUMI
    • H01P9/00
    • PROBLEM TO BE SOLVED: To provide a real time delay line that can be made compact.
      SOLUTION: The real time delay line 3 includes: GND layers 31 and 32; dielectric layers 11 to 16 sequentially arranged between the GND layers 31 and 32; a first strip conductor 41 formed between a dielectric layer 12 and a dielectric layer 13; a second strip conductor 42 formed between a dielectric layer 14 and a dielectric layer 15; and a connecting via hole for connecting the first strip conductor 41 to the second strip conductor 42, wherein the first strip conductor 41 forms a triplate line with the GND layers 31 and 32, and the second strip conductor 42 also forms a triplate line with the GND layers 31 and 32.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供可以紧凑的实时延迟线。 实时延迟线3包括:GND层31和32; 依次配置在GND层31,32之间的电介质层11〜16; 形成在电介质层12和电介质层13之间的第一带状导体41; 形成在电介质层14和电介质层15之间的第二带状导体42; 以及用于将第一带状导体41连接到第二带状导体42的连接通孔,其中第一带状导体41与GND层31和32形成三板线,并且第二带状导体42也形成带有 GND层31和32.版权所有(C)2011,JPO&INPIT
    • 2. 发明专利
    • Filter bank structure
    • 过滤器银行结构
    • JP2010187291A
    • 2010-08-26
    • JP2009031239
    • 2009-02-13
    • Mitsubishi Electric Corp三菱電機株式会社
    • HATAKEYAMA HIDEKIKOIDE HIDEYUKIEGUCHI SHINICHIOGURA MEGUMI
    • H01P1/205H01P1/203
    • PROBLEM TO BE SOLVED: To obtain a filter bank structure which is capable of flexibly dealing with increase in the number of channels using a multilayer dielectric substrate and can be small-sized.
      SOLUTION: A filter circuit 2 is configured on an inner layer of a multilayer dielectric substrate 1, and switches 3a, 3b are mounted on a top layer. Furthermore, a bias circuit 4 is configured on e.g., the inner layer. In the filter circuit 2, a plurality of filters are configured on inner layers and for each of the plurality of filters on the inner layers, ground conductor layers are disposed above and under the filter, and walls constituted of a plurality of vias connecting the upper and lower ground conductor layers are disposed at front and back sides and at right and left sides in a lateral direction.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了获得能够灵活地处理使用多层电介质基板的通道数量增加的滤波器组结构,并且可以小型化。 解决方案:滤波电路2配置在多层电介质基板1的内层上,开关3a,3b安装在顶层上。 此外,偏置电路4配置在例如内层上。 在滤波电路2中,在内层上配置多个滤波器,对于内层的多个滤波器中的每一个配置有多个滤波器,接地导体层设置在滤波器的上方和下方,并且由连接上部的多个通孔构成的壁 并且下侧的接地导体层设置在前侧和后侧以及在左右方向上的左右两侧。 版权所有(C)2010,JPO&INPIT
    • 3. 发明专利
    • Temperature-variable attenuation circuit
    • 温度可变衰减电路
    • JP2012191441A
    • 2012-10-04
    • JP2011053387
    • 2011-03-10
    • Mitsubishi Electric Corp三菱電機株式会社
    • HATAKEYAMA HIDEKI
    • H03H7/24H01C13/00H03F1/30
    • PROBLEM TO BE SOLVED: To provide a temperature-variable attenuation circuit that can implement high precision temperature compensation without causing a cost increase.SOLUTION: The temperature-variable attenuation circuit includes: a temperature-variable attenuator whose attenuation varies with temperature; a first variable resistor disposed in parallel with the temperature-variable attenuator; a second variable resistor having one end connected to one input/output end of the temperature-variable attenuator and the other end constituting one signal input/output end; and a third variable resistor having one end connected to the other input/output end of the temperature-variable attenuator and the other end constituting the other signal input/output end.
    • 要解决的问题:提供可以实现高精度温度补偿而不引起成本增加的温度可变衰减电路。 解决方案:温度可变衰减电路包括:衰减随温度变化的温度可变衰减器; 与所述温度可变衰减器并联设置的第一可变电阻器; 第二可变电阻器,其一端连接到温度可变衰减器的一个输入/输出端,另一端构成一个信号输入/输出端; 以及第三可变电阻器,其一端连接到温度可变衰减器的另一个输入/输出端,另一端构成另一个信号输入/输出端。 版权所有(C)2013,JPO&INPIT
    • 4. 发明专利
    • Multilayer substrate and electric characteristic adjustment method of multilayer substrate
    • 多层基板的多层基板和电特性调整方法
    • JP2013162002A
    • 2013-08-19
    • JP2012023792
    • 2012-02-07
    • Mitsubishi Electric Corp三菱電機株式会社
    • HATAKEYAMA HIDEKI
    • H05K3/46H01L23/12
    • PROBLEM TO BE SOLVED: To provide an electrode composing a capacitive element in an inner layer of a multilayer substrate and cause a capacitance value to be variable by adjustment of the inner layer electrode.SOLUTION: In a high-frequency circuit to which a parallel flat capacitor 55 is connected in parallel, a part of an electrode plate on the GND side among parallel flat electrode plates 51, 52 is disconnected and the part of the disconnected electrode plate is connected to a surface layer conductor pattern formed in a surface layer of a multilayer substrate 1. A capacitance value of the parallel flat capacitor 55 incorporated in the multilayer substrate 1 is varied by selection of either a state where the surface conductor pattern is connected to GND or a state where the surface conductor pattern is unconnected.
    • 要解决的问题:为了提供在多层基板的内层中构成电容元件的电极,并且通过内层电极的调节使电容值可变。解决方案:在平行平面的高频电路中 电容器55并联连接,并联平面电极板51,52中的GND侧的电极板的一部分断开,断开的电极板的一部分与形成在表面层的表面层导体图案连接 通过选择表面导体图案连接到GND的状态或表面导体图案未连接的状态来改变并入多层基板1中的平行扁平电容器55的电容值。
    • 5. 发明专利
    • Power divider/combiner
    • POWER DIVIDER / COMBINER
    • JP2013141124A
    • 2013-07-18
    • JP2012000183
    • 2012-01-04
    • Mitsubishi Electric Corp三菱電機株式会社
    • ABE MOTOMIOSHIMA TAKESHITAWARA YUKIHIROHATAKEYAMA HIDEKIOWADA SATORU
    • H01P5/22H01P5/02
    • PROBLEM TO BE SOLVED: To provide a power divider/combiner that is easy to manufacture and compact by dispensing with two shunt capacitances.SOLUTION: The power divider/combiner includes: a branch line circuit 1 in which four transmission lines 2a, 2b having an electrical length formed to less than a quarter wavelength about an operating center frequency are opposed and interconnected symmetrically with respect to two axes, and terminals are formed at respective connection points; series capacitances 3 formed between the respective connection points of the branch line circuit 1 and the corresponding terminals; and short circuit stubs 4 connected between the respective series capacitances 3 and the corresponding terminals, and having an electrical length formed to less than the quarter wavelength about the operating central frequency. Such a simple circuit configuration as is implemented with not two shunt capacitances but only the series capacitances 3 and the short circuit stubs 4 can implement ease of manufacture and compactness.
    • 要解决的问题:提供通过分配两个并联电容容易制造和紧凑的功率分配器/组合器。解决方案:功率分配器/组合器包括:分支线路电路1,其中四条传输线2a,2b具有 形成为围绕操作中心频率小于四分之一波长的电长度相对于两个轴对称和互连,并且端子形成在相应的连接点处; 形成在分支线路电路1的各个连接点和对应的端子之间的串联电容3; 以及连接在各个串联电容3和相应端子之间的短路短截线4,并且具有形成为围绕操作中心频率小于四分之一波长的电长度。 这样一种简单的电路结构即可实现不具有两个并联电容,而只有串联电容3和短路短截线4可以实现制造的便利性和紧凑性。
    • 6. 发明专利
    • Equalizer
    • 均衡器
    • JP2014192530A
    • 2014-10-06
    • JP2013063245
    • 2013-03-26
    • Mitsubishi Electric Corp三菱電機株式会社
    • HATAKEYAMA HIDEKI
    • H01P1/00H01P5/02
    • PROBLEM TO BE SOLVED: To solve such a problem that when an equalizer is formed on the inner layer of a dielectric multilayer substrate, the adjustment part for changing the frequency characteristics of the equalizer enters the inner layer of the substrate to disable the adjustment itself, and thereby it is difficult to form a functional circuit like an equalizer on the inner layer of a dielectric multilayer substrate, and miniaturization is disturbed.SOLUTION: On the inner layer of a dielectric multilayer substrate, a quarter-wavelength transmission line, an inner layer tip open stub, and a tip short circuit stub are provided. On the surface layer of the dielectric multilayer substrate, a surface layer tip open stub connected with the inner layer tip open stub via a through hole and a conductor pattern for capacity adjustment are provided. The frequency characteristics are changed by selecting whether or not the conductor pattern for capacity adjustment and the surface layer tip open stub are connected.
    • 要解决的问题为了解决这样一个问题,当在电介质多层基板的内层上形成均衡器时,用于改变均衡器的频率特性的调节部件进入基板的内层以使其自身不能调整, 因此难以在电介质多层基板的内层上形成均衡器等功能电路,并且小型化受到干扰。解决方案:在电介质多层基板的内层,四分之一波长的传输线,内层 尖端开路短管,并提供尖端短路短截线。 在电介质多层基板的表面层上,设置有通过通孔与内层末端开口短截线连接的表面层末端开口短管和用于容量调整的导体图案。 通过选择容量调整用导体图案和表面层末端开放短截线是否连接来改变频率特性。
    • 7. 发明专利
    • Phase shifter
    • 相变器
    • JP2007258763A
    • 2007-10-04
    • JP2006076525
    • 2006-03-20
    • Mitsubishi Electric Corp三菱電機株式会社
    • ENDO KUNIHIROHATAKEYAMA HIDEKI
    • H01P1/185
    • PROBLEM TO BE SOLVED: To provide a phase shifter of a reflection type for obtaining a desired phase shift amount of a microwave signal in which the number of connection stages of FETs and the occupied area of the FETs are reduced while ensuring withstanding power and which enables a module using the phase shifter to be compact as a result.
      SOLUTION: Terminals 3, 4 are controlled to a short-circuited or open state with the FETs in an OFF state by changing a control voltage of the FETs 6, 9 being components of reflective termination circuits 14, 15. The occupied area of the FETs is not increased and high withstanding power of the phase shifter is attained by employing WBG (Wide Band Gap) elements with a high breakdown voltage in the OFF state for the FET elements in this case.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种用于获得微波信号的期望相移量的反射型移相器,其中FET的连接级数和FET的占用面积减小,同时确保承受功率 并且使得能够使用移相器的模块结果是紧凑的。 解决方案:通过改变FET6,9的控制电压作为反射端接电路14,15的组成部分,FET3处于OFF状态,将端子3,4控制为短路或断开状态。占用面积 在这种情况下,通过在FET元件的OFF状态下使用具有高击穿电压的WBG(宽带隙)元件来实现移相器的高耐受功率。 版权所有(C)2008,JPO&INPIT
    • 8. 发明专利
    • Connection structure of high frequency multilayer circuit board
    • 高频多层电路板的连接结构
    • JP2011187575A
    • 2011-09-22
    • JP2010049702
    • 2010-03-05
    • Mitsubishi Electric Corp三菱電機株式会社
    • HATAKEYAMA HIDEKI
    • H05K3/46H05K1/02H05K3/44
    • PROBLEM TO BE SOLVED: To obtain a connection structure of high-frequency multilayer circuit boards, capable of preventing impedance mismatching and radiation of high frequency signals, thereby achieving broad band characteristics. SOLUTION: In the connection structure of the high frequency multilayer circuit boards, on a connection for connecting the high-frequency multilayer circuit boards with each other, a signal connection conductor connecting between conductor transmission lines formed in inner layers of both the high frequency multilayer circuit boards, and a ground connection conductor connecting between ground surfaces formed on surface layers of both the high frequency multilayer circuit boards are provided. Thus, the impedance mismatching and the radiation of the high frequency signals can be prevented and the broad band characteristics can be achieved. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:为了获得能够防止高频信号的阻抗失配和辐射的高频多层电路板的连接结构,从而实现宽带特性。 解决方案:在高频多层电路板的连接结构中,在用于连接高频多层电路板的连接处,连接导体传输线的信号连接导体形成在两个高频层 提供了连接在两个高频多层电路板的表面层上的接地面之间的接地连接导体。 因此,可以防止阻抗失配和高频信号的辐射,并且可以实现宽带特性。 版权所有(C)2011,JPO&INPIT
    • 9. 发明专利
    • High frequency variable filter
    • 高频变频滤波器
    • JP2010045478A
    • 2010-02-25
    • JP2008206654
    • 2008-08-11
    • Mitsubishi Electric Corp三菱電機株式会社
    • UCHIDA HIROMITSUYONEDA HISAFUMIOGURA MEGUMIHATAKEYAMA HIDEKI
    • H03H7/12H01P1/205
    • PROBLEM TO BE SOLVED: To obtain a high frequency variable filter for maintaining pass bandwidth almost constant when a frequency varies.
      SOLUTION: The high frequency variable filter is provided with varactors 2a to 2c whose one ends are grounded, meander line inductors 4a to 4c having a fixed value, transmission lines 5a to 5c having a fixed length, transmission lines 6a and 6b having almost the same length as the transmission lines 5a to 5c, and an input-output terminal 8. The fixed length of the transmission lines 5a to 5c is set to be almost 1/4 wavelength in the center frequency in the variable frequency range of a pass frequency. The varactors 2a to 2c, the inductors 4a to 4c, and the transmission lines 5a to 5c are connected in series to constitute a single unit of variable resonance circuit. The transmission lines 6a and 6b connect plural units of variable resonance circuits in parallel to input and output a high frequency signal from/to each variable resonance circuit from the input-output terminal 8.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了获得用于在频率变化时保持通带宽度几乎恒定的高频可变滤波器。 解决方案:高频可变滤波器设置有一端接地的变容二极管2a至2c,具有固定值的曲折线电感器4a至4c,具有固定长度的传输线5a至5c,传输线6a和6b具有 与传输线路5a至5c几乎相同的长度以及输入 - 输出端子8.传输线路5a至5c的固定长度被设置为在a的可变频率范围内的中心频率的几乎1/4波长 通过频率。 变容二极管2a至2c,电感器4a至4c和传输线5a至5c串联连接以构成单个可变谐振电路单元。 传输线6a和6b并联连接多个单元的可变谐振电路,从输入输出端子8向每个可变谐振电路输入和输出高频信号。(C)2010,JPO&INPIT
    • 10. 发明专利
    • Bandpass filter
    • BANDPASS过滤器
    • JP2009278347A
    • 2009-11-26
    • JP2008127230
    • 2008-05-14
    • Mitsubishi Electric Corp三菱電機株式会社
    • YONEDA SATOSHIHATAKEYAMA HIDEKIUCHIDA HIROMITSUOWADA SATORUYONEDA HISAFUMI
    • H01P1/203H01P1/212H01P7/08
    • PROBLEM TO BE SOLVED: To obtain a bandpass filter which relieves a spurious response resulting from serial resonance of a transmission line and has broadband low spurious characteristics when the bandpass filter is constituted by connecting a resonant circuit by the transmission line in order to obtain a broadband pass band. SOLUTION: The bandpass filter is provided with: a plurality of parallel resonant circuits (3, 4) which resonate in a use frequency; and a plurality of transmission lines (2) for coupling, and is constituted by alternatively performing cascade connection between the parallel resonant circuits and the transmission lines for coupling, wherein electric length of the plurality of transmission lines for coupling becomes two or more kinds of different values. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了获得带宽滤波器,其消除由传输线的串行谐振引起的寄生响应,并且当通过传输线连接谐振电路来构成带通滤波器时具有宽带低的寄生特性,以便 获得宽带通带。 带通滤波器设置有以使用频率谐振的多个并联谐振电路(3,4); 和多个用于耦合的传输线(2),并且通过交替地在并联谐振电路和用于耦合的传输线之间进行级联连接而构成,其中用于耦合的多条传输线的电长度为两种或更多种不同 价值观。 版权所有(C)2010,JPO&INPIT