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    • 1. 发明专利
    • Package
    • JP2013211368A
    • 2013-10-10
    • JP2012079833
    • 2012-03-30
    • Mitsubishi Electric Corp三菱電機株式会社
    • ENDO KUNIHIRO
    • H01L23/02H01L23/12
    • H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/15312H01L2924/16195H01L2924/00014H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a package made of ceramic with a terminal for wiring.SOLUTION: The package comprises: a ceramic multilayer substrate 33 having a surface layer conductor pattern 21 for a high frequency signal, a surface layer conductor pattern 14 for a ground, a rear face conductor pattern 26 for a high frequency signal, a rear face conductor pattern 15 for a ground, an interlayer connection via 27 for a high frequency signal connected between the surface layer conductor pattern for the high frequency signal and the rear face conductor pattern for the high frequency signal, and an interlayer connection via 16 connected between the surface layer conductor pattern for the ground and the rear face conductor pattern for the ground; and a conductive base 2 that has a dielectric glass 10 inserted in a through hole forming an outer conductor, and a coaxial terminal inner conductor 8 for a high frequency signal, which is inserted in the dielectric glass, whose one end projects outward, and whose other end is connected to the rear face conductor pattern for the high frequency signal by a conductive connection member 29, and whose surface is jointed to the rear face conductor pattern for the ground on a rear face of the ceramic multilayer substrate by the conductive connection member.
    • 要解决的问题:提供一种由陶瓷制成的封装,其具有用于布线的端子。解决方案:封装包括:具有用于高频信号的表面层导体图案21的陶瓷多层基板33,用于 接地,用于高频信号的背面导体图案26,用于接地的背面导体图案15,连接在用于高频信号的表层导体图案和后表面之间的高频信号的层间连接通孔27 用于高频信号的导体图案,以及连接在地面的表层导体图案和地面的背面导体图案之间的层间连接通孔16; 以及导电基体2,其具有插入形成外部导体的通孔中的电介质玻璃10和插入电介质玻璃中的高频信号的同轴端子内部导体8,其一端向外突出,并且其 另一端通过导电连接构件29连接到用于高频信号的背面导体图案,并且其表面通过导电连接构件连接到陶瓷多层基板的背面上的地面的背面导体图案 。
    • 2. 发明专利
    • Connection structure of circuit board
    • 电路板连接结构
    • JP2007258886A
    • 2007-10-04
    • JP2006078501
    • 2006-03-22
    • Mitsubishi Electric Corp三菱電機株式会社
    • ENDO KUNIHIRO
    • H01P5/103H01P5/02
    • PROBLEM TO BE SOLVED: To provide connection structure of a circuit board, in which when high frequency devices 5, 6 for transmitting a high frequency signal are connected by using microstrip lines, unnecessary radio wave radiation and a loss of a transmission signal caused at the connections can be suppressed.
      SOLUTION: The microstrip line connected to the high frequency device 5 and the microstrip line connected to the high frequency device 6 and apart from the microstrip line connected to the high frequency device 5 are inserted inside a waveguide through an open hole provided in an H plane of the waveguide 9 and, and both microstrip lines are arranged in parallel with an E plane of the waveguide 9.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了提供电路板的连接结构,其中当用于发送高频信号的高频装置5,6用微带线连接时,不必要的无线电波辐射和传输信号的丢失 造成连线可以抑制。

      解决方案:连接到高频器件5的微带线和连接到高频器件6的微带线和与连接到高频器件5的微带线分开的微带线通过设置在高频器件5中的开孔插入波导内 波导9的H平面和两条微带线布置成与波导9的E平面平行。版权所有(C)2008,JPO&INPIT

    • 3. 发明专利
    • High frequency switching circuit
    • 高频开关电路
    • JP2008263527A
    • 2008-10-30
    • JP2007106207
    • 2007-04-13
    • Mitsubishi Electric Corp三菱電機株式会社
    • ENDO KUNIHIRONAKAHARA KAZUHIKO
    • H03K17/687
    • PROBLEM TO BE SOLVED: To pursue further miniaturization by effectively utilizing a semiconductor switching element excellent in voltage resistance.
      SOLUTION: The high frequency switching circuit includes: a capacitor 3; an input terminal 1 provided on one end side of the capacitor 3; an output terminal 2 provided on the other end side of the capacitor 3; a switching element 7a one end of which is connected to one end side of the capacitor 3 and the other end of which is grounded; a switching element 7b one end of which is connected on the other end side of a capacitor 7a and the other end is grounded; and a control terminal 6 which simultaneously controls the switching elements 7a, 7b.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:通过有效利用耐电压优良的半导体开关元件来进一步小型化。 解决方案:高频开关电路包括:电容器3; 设置在电容器3的一端侧的输入端子1; 设置在电容器3的另一端侧的输出端子2; 开关元件7a的一端与电容器3的一端侧连接,另一端接地; 开关元件7b的一端连接在电容器7a的另一端,另一端接地; 以及同时控制开关元件7a,7b的控制端子6。 版权所有(C)2009,JPO&INPIT
    • 4. 发明专利
    • High frequency switch circuit
    • 高频开关电路
    • JP2008193238A
    • 2008-08-21
    • JP2007023165
    • 2007-02-01
    • Mitsubishi Electric Corp三菱電機株式会社
    • NAKAHARA KAZUHIKOENDO KUNIHIRO
    • H01P1/15
    • PROBLEM TO BE SOLVED: To improve an electric power resistance in a high frequency switch circuit.
      SOLUTION: One of a circuit part by a plurality of serially connected switching elements 4a-4n is connected to a connection point A on a transmission line 3 connecting an input terminal 1 and an output terminal 2, and one end of a circuit part by a plurality of serially connected switching elements 5a-5n is connected to a connection point B separated from the connection point A on the transmission line 3 by the length of the odd number multiple of 1/4 wavelength. The respective control ends of the switching elements 4a-4n and 5a-5n are connected to a control terminal 6 in order to control the conduction. In the high frequency switch circuit configured in such a manner, high frequency signals from the input terminal 1 to the output terminal 2 are interrupted when the switching elements 4a-4n and 5a-5n are controlled to be off and are transmitted when the switching elements 4a-4n and 5a-5n are controlled to be on.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提高高频开关电路中的电力电阻。 解决方案:多个串联的开关元件4a-4n的电路部分之一连接到连接输入端子1和输出端子2的传输线3上的连接点A,电路的一端 多个串联的开关元件5a-5n的一部分被连接到与传输线3上的连接点A分开的1/4波长的奇数倍的长度的连接点B. 开关元件4a-4n和5a-5n的各个控制端连接到控制端子6,以便控制导通。 在以这种方式配置的高频开关电路中,当开关元件4a-4n和5a-5n被控制为截止时,从输入端子1到输出端子2的高频信号被中断,并且当开关元件 4a-4n和5a-5n被控制为接通。 版权所有(C)2008,JPO&INPIT
    • 5. 发明专利
    • Microwave amplifier
    • 微波放大器
    • JP2007158648A
    • 2007-06-21
    • JP2005350263
    • 2005-12-05
    • Mitsubishi Electric Corp三菱電機株式会社
    • OTSUKA HIROSHIYAMAUCHI KAZUHISAYUGAWA HIDENORINAKAYAMA MASATOSHIENDO KUNIHIROIKEMATSU HIROSHI
    • H03F3/60H03F3/68
    • PROBLEM TO BE SOLVED: To provide a microwave amplifier capable of allowing FETs to operate stably in parallel, even when unbalance arises among the FETs.
      SOLUTION: The microwave amplifier comprises an input matching circuit 5, an FET 1, an interstage matching circuit 6, an FET 2, an output matching circuit 7, and short stub circuits 31 and 32. The short stub circuit 31 includes a distribution constant line 10a of which the other end is grounded through a capacitor 11a, a distribution constant line 10b of which the other end is grounded through a capacitor 11b, and a distribution constant line 18 for connecting the other end of the distribution constant lines 10a and 10b each other. The short stub circuit 32 includes a distribution constant line 14a of which the other end is grounded through a capacitor 15a, a distribution constant line 14b of which the other end is grounded through a capacitor 15b, and a distribution constant line 19 for connecting the other end of the distribution constant lines 14a and 14b each other.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:即使在FET之间出现不平衡的情况下,也可以提供能够使FET稳定并联运行的微波放大器。

      解决方案:微波放大器包括输入匹配电路5,FET 1,级间匹配电路6,FET 2,输出匹配电路7和短截线电路31和32.短截线电路31包括 分配常数线10a的另一端通过电容器11a接地,另一端通过电容器11b接地的分布常数线10b和用于连接分布常数线10a的另一端的分布常数线路18 和10b彼此。 短截线电路32包括分配常数线14a,其另一端通过电容器15a接地,另一端通过电容器15b接地的分布常数线14b和用于连接另一端的分布常数线路19 分配常数线14a和14b彼此的端部。 版权所有(C)2007,JPO&INPIT

    • 6. 发明专利
    • Conversion circuit
    • 转换电路
    • JP2006148206A
    • 2006-06-08
    • JP2004331698
    • 2004-11-16
    • Mitsubishi Electric Corp三菱電機株式会社
    • ONO YOSHIKIENDO KUNIHIROOHASHI HIDEMASA
    • H01P5/107H01P1/02
    • PROBLEM TO BE SOLVED: To provide a conversion circuit with a configuration wherein a waveguide is connected to a microstrip line in its extension direction, the microstrip line being located on a dielectric board supported by a metallic carrier.
      SOLUTION: The conversion circuit for converting the microstrip line into the ridge waveguide is configured to include: the microstrip line 2 formed on the dielectric board 1 supported by the metallic carrier 3; the ridge waveguide 4 the part of the guide wall of which uses a side face of the metallic carrier 3 and having a bent part at a bottom side of the metallic carrier 3; a back short 6 connected to the ridge waveguide 4, having a length of about 1/4 wavelength, and extended in a direction orthogonal to the microstrip line 2; and a projection 7 shaped by truncating one side of a triangular prism in a circular-arc shape at an end of the back short 6 of the ridge waveguide 4 and connected to a ridge part 5, and the conversion circuit is also configured such that the projection 7 and the microstrip line 2 are connected by a metallic ribbon 8.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了提供具有波导在其延伸方向上连接到微带线的配置的转换电路,微带线位于由金属载体支撑的电介质板上。 解决方案:将微带线转换成脊波导的转换电路被配置为包括:形成在由金属载体3支撑的电介质板1上的微带线2; 脊导波导4,其引导壁的一部分使用金属载体3的侧面并且在金属载体3的底侧具有弯曲部分; 连接到脊波导4的后短6,其长度为约1/4波长,并且在与微带线2正交的方向上延伸; 以及突起7,其通过在脊状波导4的后短路6的端部截取圆弧状的三角棱镜的一侧并与脊部5连接而成形,并且转换电路还构造成 突起7和微带线2通过金属带8连接。版权所有(C)2006,JPO&NCIPI
    • 7. 发明专利
    • Multilayered substrate with built-in nonreciprocal circuit
    • 具有内置非绝缘电路的多层基板
    • JP2010283774A
    • 2010-12-16
    • JP2009137577
    • 2009-06-08
    • Mitsubishi Electric Corp三菱電機株式会社
    • ENDO KUNIHIROSUGAYA KAZUNORIINAMI KAZUYOSHI
    • H01P1/387H01P1/36
    • PROBLEM TO BE SOLVED: To provide a multilayered substrate with a built-in nonreciprocal circuit, in which isolation can be improved without enlarging the multilayered substrate in size when incorporating the nonreciprocal circuit in the multilayered substrate.
      SOLUTION: A multilayered substrate 1 includes: a ferrite layer 14 disposed inside the multilayered substrate 1; conductive members (triplate upper-layer ground surface 16, triplate lower-layer ground surface 16', ferrite intermediate layer conductor pattern 17 or the like) which are formed on a surface of or between layers of the ferrite layer 14, and constitute a high frequency signal line; a magnet 13 which is disposed inside the multilayered substrate 1 and is a magnetic field generation source for generating a magnetic field, inside the ferrite layer 14, in a direction vertical to the high frequency signal line; and a cover member 4 which is disposed in an upper part of the multilayered substrate 1 so as to cover the magnet 13, and constitutes a closed magnetic circuit.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供具有内置非互易电路的多层基板,其中当在多层基板中并入不可逆电路时,可以在不扩大多层基板的情况下改善隔离。 解决方案:多层基板1包括:设置在多层基板1内的铁氧体层14; 形成在铁氧体层14的表面或层之间的导体(三板上层接地面16,三板下层接地面16',铁氧体中间层导体图案17等),构成高 频率信号线 设置在多层基板1的内侧的磁铁13,是在铁氧体层14的内部沿与高频信号线垂直的方向产生磁场的磁场产生源; 以及盖构件4,其设置在多层基板1的上部以覆盖磁体13,并构成闭合磁路。 版权所有(C)2011,JPO&INPIT
    • 8. 发明专利
    • Phase shifter
    • 相变器
    • JP2007258763A
    • 2007-10-04
    • JP2006076525
    • 2006-03-20
    • Mitsubishi Electric Corp三菱電機株式会社
    • ENDO KUNIHIROHATAKEYAMA HIDEKI
    • H01P1/185
    • PROBLEM TO BE SOLVED: To provide a phase shifter of a reflection type for obtaining a desired phase shift amount of a microwave signal in which the number of connection stages of FETs and the occupied area of the FETs are reduced while ensuring withstanding power and which enables a module using the phase shifter to be compact as a result.
      SOLUTION: Terminals 3, 4 are controlled to a short-circuited or open state with the FETs in an OFF state by changing a control voltage of the FETs 6, 9 being components of reflective termination circuits 14, 15. The occupied area of the FETs is not increased and high withstanding power of the phase shifter is attained by employing WBG (Wide Band Gap) elements with a high breakdown voltage in the OFF state for the FET elements in this case.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种用于获得微波信号的期望相移量的反射型移相器,其中FET的连接级数和FET的占用面积减小,同时确保承受功率 并且使得能够使用移相器的模块结果是紧凑的。 解决方案:通过改变FET6,9的控制电压作为反射端接电路14,15的组成部分,FET3处于OFF状态,将端子3,4控制为短路或断开状态。占用面积 在这种情况下,通过在FET元件的OFF状态下使用具有高击穿电压的WBG(宽带隙)元件来实现移相器的高耐受功率。 版权所有(C)2008,JPO&INPIT
    • 10. 发明专利
    • Harmonic suppression circuit
    • 谐波抑制电路
    • JP2012248931A
    • 2012-12-13
    • JP2011116865
    • 2011-05-25
    • Mitsubishi Electric Corp三菱電機株式会社
    • ITABA AKIHIROENDO KUNIHIRO
    • H03F3/60
    • PROBLEM TO BE SOLVED: To provide a harmonic suppression circuit that reconciles a high frequency operation with an inexpensive and compact design.SOLUTION: The harmonic suppression circuit comprises: a main line 10 having a length that is one eighth of the wavelength of a fundamental, and having one end forming an input end 16a and the other end forming an output end 16b; a first line 11a having a length that is a quarter of the wavelength of the fundamental which has one end connected to the input end 16a of the main line 10; a resistor 14 and a first open stub 12a having a length that is a quarter of the wavelength of the fundamental which each have one end connected to the other end of the first line 11a; a second open stub 13a having a length that is one eighth of the wavelength of the fundamental which is connected to the other end of the resistor 14; a second line 11b having a length that is a quarter of the wavelength of the fundamental which has one end connected to the output end 16b of the main line 10; and a third open stub 12b having a length that is a quarter of the wavelength of the fundamental and a fourth open stub 13b having a length that is one eighth of the wavelength of the fundamental which are connected to the other end of the second line 11b.
    • 要解决的问题:提供一种谐波抑制电路,其将高频操作与廉价且紧凑的设计相协调。 解决方案:谐波抑制电路包括:主线10,其长度为基波的八分之一,并且一端形成输入端16a,另一端形成输出端16b; 第一线11a的长度是基本波长的四分之一,其一端连接到主线10的输入端16a; 电阻器14和第一开路短截线12a,其长度是基波长的四分之一,它们各自具有连接到第一线路11a的另一端的一端; 具有连接到电阻器14的另一端的基底的波长的八分之一的长度的第二开路短管13a; 第二线11b的长度是基本波长的四分之一,其一端连接到主线10的输出端16b; 以及第三开口短截线12b,其长度为基波长的四分之一,第四开路短截线13b的长度为连接到第二线11b的另一端的基波波长的八分之一 。 版权所有(C)2013,JPO&INPIT