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    • 7. 发明授权
    • Transfer apparatus for transferring body side of automotive vehicle and transfer method thereof
    • 用于转移机动车体侧的转移装置及其转移方法
    • US07225914B2
    • 2007-06-05
    • US11001094
    • 2004-12-02
    • Setsuo NakamuraKimihiro Nishimura
    • Setsuo NakamuraKimihiro Nishimura
    • B65G37/00B65G17/12
    • B62D65/18
    • A transfer apparatus for transferring a body side of an automotive vehicle which is supported so that a front-to-rear direction of the body side coincides with a transfer direction, includes a hanger having a plurality of support members for supporting a side sill lower portion, a rear pillar or its adjacent portion and an arch portion front side of a rear wheel house of the body side, respectively. The hanger is configured to support the body side in a posture inclining inboard of the automotive vehicle and declining toward a rear end of the body side hanger is further configured so that the body side is urged only by its own weight against the support members so as to be positioned and supported thereby. A transfer method for the body side is also provided.
    • 一种传送装置,用于传送机体的身体侧,其被支撑为使得身体侧的前后方向与传送方向一致,所述传送装置包括具有多个支撑部件的吊架,所述支撑部件用于支撑下纵梁 ,后支柱或其相邻部分和主体侧后轮室的拱形部分前侧。 所述衣架被构造成将所述车体侧支撑在所述机动车辆内侧倾斜的姿势,并且朝向所述车身侧衣架的后端朝下倾斜的方式进一步构造,使得所述车身侧仅通过其自身的重量被推靠在所述支撑构件上, 被定位和支撑。 还提供了身体侧的转移方法。
    • 9. 发明授权
    • Binder system for use in the injection molding of sinterable powders and
molding compound containing the binder system
    • 用于可烧结粉末的注射成型的粘合剂体系和含有粘合剂体系的模塑料
    • US5380179A
    • 1995-01-10
    • US33094
    • 1993-03-16
    • Kimihiro NishimuraKenji Yoshino
    • Kimihiro NishimuraKenji Yoshino
    • B22F1/00B22F3/22C04B35/634
    • B22F3/225B22F1/0059C04B35/63404C04B35/6346B22F2001/0066B22F2998/00
    • The improved binder system for use in the injection molding of sinterable powders such as metal powders, ceramic powders and cermet powders comprises a (co)polymer that has a molecular weight in excess of 2000 and which contains at least one epoxy group in the molecule. Preferably, the binder system comprises said (co)polymer, a (co)polymer other than said (co)polymer, and an organic compound having a molecular weight up to 2000. Using a binder system comprising (a) 3-80 wt % of a (co)polymer that has a molecular weight in excess of 2000 and which has at least one epoxy group in the molecule, (b) up to 70 wt % of a (co)polymer other than component (a), and (c) 20-80 wt % of an organic compound having a molecular weight of not more than 2000, there is provided a composition for the injection molding of sinterable powders. The compound has excellent moldability and strength properties. The powders to be mixed with the binder system for use in injection molding have preferably average particle sizes in the range of 0.01-1000 .mu.m.
    • 用于注射成型可烧结粉末如金属粉末,陶瓷粉末和金属陶瓷粉末的改进的粘合剂体系包括分子量超过2000并且在分子中含有至少一个环氧基的(共)聚合物。 优选地,粘合剂体系包含所述(共)聚合物,除所述(共)聚合物以外的(共)聚合物和分子量高达2000的有机化合物。使用包含(a)3-80重量% (共)聚合物,其分子量超过2000,并且在分子中具有至少一个环氧基,(b)至多70重量%的除(a)组分之外的(共)聚合物和( c)20-80重量%的分子量不大于2000的有机化合物,提供了可烧结粉末的注射成型用组合物。 该化合物具有优异的成型性和强度性能。 与用于注射成型的粘合剂体系混合的粉末优选具有在0.01-1000μm范围内的平均粒度。