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1. 发明授权

US5009735A Process for peeling protective film off a wafer 失效
标题翻译：将保护膜从晶片上剥离的工艺
公开(公告)号：US5009735A
公开(公告)日：1991-04-23
申请号：US276587
申请日：1988-11-28
申请人： Minoru Ametani , Keigo Funakoshi , Akihiko Kira , Takao Matsushita , Keizo Shirakura
发明人： Minoru Ametani , Keigo Funakoshi , Akihiko Kira , Takao Matsushita , Keizo Shirakura
IPC分类号： B28D5/00 , B29C63/00 , B65H29/54 , B65H41/00 , C09J5/00 , H01L21/00 , H01L21/304 , H01L21/683
CPC分类号： H01L21/67132 , B29C63/0013 , Y10S156/93 , Y10T156/1179
摘要： A process for peeling a protective film stuck to an upper-side of a wafer is disclosed. The protective film is peeled by adhering an adhesive tape to the upper side of the rear end of said protective film stuck on the wafer by means of a press roller, lifting the press roller and sliding said press roller forward, sliding a peeling unit forward to peel the adhesive tape together with the protective film by utilizing the adhesive force of the adhesive tape. The wafer is prevented from being damaged.

2. 发明授权

US4865677A Sticking and cutoff device for adhering adhesive tape on thin articles 失效
标题翻译：用于将粘合带粘附在薄制品上的粘合和切断装置
公开(公告)号：US4865677A
公开(公告)日：1989-09-12
申请号：US105775
申请日：1987-10-07
申请人： Takao Matsushita , Akihiko Kira , Minoru Ametani
发明人： Takao Matsushita , Akihiko Kira , Minoru Ametani
IPC分类号： B65H41/00 , B26D7/18 , B65H37/04 , H01L21/00
CPC分类号： H01L21/67132 , Y10T156/1343 , Y10T83/538
摘要： A device for sticking adhesive tape to thin articles, such as semiconductor wafers, and trimming excess portions of said tape from the thin articles. A plurality of sticking rollers apply adhesive tape from a roll to each thin article, the tape having an adhesive side oriented towards an upper surface of the article and a width greater than a width of the article. A suction stage receives and holds each of the thin articles with the adhesive tape stuck thereto by said sticking rollers while a tape cutter trims the excess portion of the tape from along peripheral edge portions of the article. A tape peeling device then peels off the trimmed excess portions of the tape from the thin article, whereupon the thin article is conveyed back to a cassette.

3. 发明授权

US4775438A Process for peeling protective film off a thin article 失效
标题翻译：从薄制品上剥离保护膜的工艺
公开(公告)号：US4775438A
公开(公告)日：1988-10-04
申请号：US917236
申请日：1986-10-07
申请人： Keigo Funakoshi , Kozo Nomura , Minoru Ametani , Kenji Ohnishi
发明人： Keigo Funakoshi , Kozo Nomura , Minoru Ametani , Kenji Ohnishi
IPC分类号： B29C65/00 , B29B17/00 , B29C63/00 , B44D3/16 , C09J5/00 , H01L21/304 , H01L21/67 , H01L21/683 , B44C1/17 , B32B31/00
CPC分类号： B29C63/0013 , B44D3/16 , Y10S156/93 , Y10T156/1179
摘要： A process for peeling a protective film off a thin article such as a silicon wafer is proposed. The film is peeled by sticking an adhesive tape to the protective film on the article and pulling it away from the article. The protective film is peeled only by the adhesive force of the adhesive tape.
摘要翻译：提出了将薄膜制品如硅晶片剥离保护膜的方法。将胶带粘贴在物品上的保护膜上并将其从物品上拉出来，将胶片剥离。保护膜仅通过胶带的粘合力剥离。

4. 发明授权

US4522679A Apparatus for sticking adhesive film on a ring and a thin article 失效
标题翻译：用于将粘合剂膜粘附在环和薄制品上的装置
公开(公告)号：US4522679A
公开(公告)日：1985-06-11
申请号：US629877
申请日：1984-07-11
申请人： Keigo Funakoshi , Minoru Ametani
发明人： Keigo Funakoshi , Minoru Ametani
IPC分类号： B65B15/04 , B28D5/00 , B29C63/02 , B65B15/00 , B65H35/07 , H01L21/301 , H01L21/67 , H01L21/683 , B26D1/26 , B32B31/18
CPC分类号： B29C63/02 , B28D5/0082 , B65B15/00 , B29C2793/00 , Y10T156/108 , Y10T156/12 , Y10T156/1348 , Y10T156/1793 , Y10T156/1795 , Y10T156/18 , Y10T83/7507 , Y10T83/7788 , Y10T83/8749
摘要： An apparatus for semiautomatically sticking an adhesive film on a silicon wafer and on a ring used as a carrier. After the ring and the silicon wafer have been manually positioned on tables, an adhesive film is automatically stuck on the ring and the silicon wafer. The excess portion of the film is then cut by hand along the ring and transversely. The apparatus greatly facilitates these works.
摘要翻译：一种在硅晶片和用作载体的环上半粘贴粘合膜的装置。在环和硅晶片已经手动定位在桌子上之后，粘合剂膜自动地粘附在环和硅晶片上。然后用手沿着环切割薄膜的多余部分并横向切割。该装置大大方便了这些作品。

5. 发明申请

US20070262276A1 CASSETTE CONVEYANCE METHOD AND CASSETTE CONVEYANCE APPARATUS 审中-公开
标题翻译： CASSETTE输送方法和CASSETTE输送装置
公开(公告)号：US20070262276A1
公开(公告)日：2007-11-15
申请号：US11740249
申请日：2007-04-25
申请人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
发明人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
IPC分类号： B65H5/00
CPC分类号： H01L21/67769
摘要： A cassette conveyance apparatus (10) includes: a first conveyance means (20) for conveying a first cassette (40) in a horizontal and vertical direction; and a second conveyance means (30) for conveying a second cassette (50) in a horizontal and vertical direction. In the cassette conveyance apparatus (10), the first and second cassettes are circulated between a predetermined wafer accommodation position (P1), at which a wafer (2) is accommodated in the cassette, and a predetermined cassette replacement position (P0) at which a cassette accommodating a plurality of wafers is replaced with an empty cassette. Due to the foregoing, the wafers are continuously accommodated in the cassette without stopping an operation of a pretreatment step.
摘要翻译：盒输送装置（10）包括：用于在水平和垂直方向上输送第一盒（40）的第一输送装置（20）以及用于在水平和垂直方向上输送第二盒（50）的第二传送装置（30）。在盒输送装置（10）中，第一和第二盒子在晶片（2）容纳在盒中的预定晶片容纳位置（P 1）和预定的盒更换位置（P 0）之间循环，其中容纳多个晶片的盒被空盒替换。由于上述原因，晶片被连续地容纳在盒中，而不停止预处理步骤的操作。

6. 发明授权

US08440040B2 Tape adhering method and tape adhering device 有权
标题翻译：胶带粘合方法和胶带粘合装置
公开(公告)号：US08440040B2
公开(公告)日：2013-05-14
申请号：US12898568
申请日：2010-10-05
申请人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
发明人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
IPC分类号： B44C1/165 , B29C65/50
CPC分类号： B29C63/02 , B29C63/0004 , B29L2031/3425 , B65H37/002 , Y10T156/10 , Y10T156/1705 , Y10T156/1712 , Y10T156/1734
摘要： A tape adhering device including: a drawing roller for drawing out a tape; a tape fixing means for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered under the condition that fixing operation of the tape by the tape fixing means is released.
摘要翻译：一种胶带粘附装置，包括：用于拉出胶带的拉丝辊; 用于固定从拉丝辊拉出的带的一部分的胶带固定装置; 用于从带固定装置和牵引辊之间的拉丝辊中抽出预定量的由胶带固定装置固定的胶带的胶带牵引装置; 以及用于将位于带固定装置的下游的带粘合到胶带粘合装置上的条带粘合装置，在被胶带固定装置的胶带的固定操作被释放的条件下粘附到待粘合的物体上。

7. 发明授权

US07757741B2 Apparatus for attaching a peeling tape 有权
标题翻译：用于附着剥离胶带的装置
公开(公告)号：US07757741B2
公开(公告)日：2010-07-20
申请号：US11601047
申请日：2006-11-17
申请人： Minoru Ametani
发明人： Minoru Ametani
IPC分类号： B29C63/00 , B29C65/00
CPC分类号： H01L21/67132 , Y10T156/1105 , Y10T156/1168 , Y10T156/1179 , Y10T156/17 , Y10T156/1734 , Y10T156/1788 , Y10T156/1906 , Y10T156/1978
摘要： In a peeling tape attaching apparatus for attaching a peeling tape (4) on a surface protective film (11) attached on the surface of a wafer (20), the wafer is supported on a movable table (31) with the surface protective film up and the peeling tape is supplied on the surface protective film of the wafer. The movable table is moved in such a manner that an end (28) of the wafer is located under a peeling tape attaching unit (46), and pressure is exerted by pressing the peeling tape attaching unit against the surface protective film of the wafer via the peeling tape. After that, the movable table is moved toward the other end (29) of the wafer, and upon movement of the movable table, by a predetermined distance, from the peeling tape attaching unit, the pressure is canceled.
摘要翻译：在将剥离带（4）附着在安装在晶片（20）的表面上的表面保护膜（11）上的剥离胶带安装装置中，将晶片支撑在可移动工作台（31）上，表面保护膜向上并且剥离带被提供在晶片的表面保护膜上。移动台以使得晶片的端部（28）位于剥离带附着单元（46）下方的方式移动，并且通过将剥离带附着单元压靠在晶片的表面保护膜上而施加压力剥皮胶带。之后，可移动台朝向晶片的另一端（29）移动，并且当可移动台移动距离剥离带附着单元预定距离时，该压力被取消。

8. 发明授权

US07060154B2 Method and apparatus for removing unwanted substance from semiconductor wafer 失效
标题翻译：从半导体晶片去除不需要的物质的方法和装置
公开(公告)号：US07060154B2
公开(公告)日：2006-06-13
申请号：US10258792
申请日：2001-07-30
申请人： Masayuki Yamamoto , Minoru Ametani
发明人： Masayuki Yamamoto , Minoru Ametani
IPC分类号： B32B31/00
CPC分类号： H01L21/67132 , H01L21/67092 , H01L2221/6839 , Y10T29/41 , Y10T156/108 , Y10T156/12
摘要： An apparatus for removing an unwanted substance from a semiconductor wafer, according to this invention, applies a peeling tape T to a protective tape P on the surface of the semiconductor wafer W. An edge member 28 is placed in contact with the surface of the peeling tape T and run along the protective tape P. The peeling tape T is peeled as being folded back by a large angle of 90 degrees or more at the tip of edge member 28. The protective tape P is peeled and removed along with the peeling tape T from the surface of the wafer. As a result, the unwanted substance is removed with high precision without breaking the wafer W.
摘要翻译：根据本发明的用于从半导体晶片去除不想要的物质的装置将剥离带T施加到半导体晶片W的表面上的保护带P.将边缘构件28放置成与剥离的表面接触带T沿着保护带P延伸。剥离带T在边缘部件28的前端以90度以上的大角度被折回。保护带P与剥离带T一起从晶片的表面剥离除去。结果，不会使晶片W断裂，高精度地除去不需要的物质。

9. 发明申请

US20060068566A1 Film sticking method and film sticking device 审中-公开
标题翻译：胶片贴膜方法及贴膜装置
公开(公告)号：US20060068566A1
公开(公告)日：2006-03-30
申请号：US11185578
申请日：2005-07-19
申请人： Minoru Ametani
发明人： Minoru Ametani
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H01L21/67132
摘要： There is provided a film sticking method for sticking a film on a pattern forming face of a wafer, on the pattern forming face (21) of which a circuit pattern (C) is formed, comprising the steps of: positioning the wafer (20) so that a sticking direction of a film sticking means (46) for sticking the film on the pattern forming face when the film sticking means is moved in a predetermined sticking direction (X1) on the pattern forming face of the wafer can be substantially parallel with the bisector of a corner portion of the circuit pattern; and sticking the film on the pattern forming face of the wafer when the film sticking means is moved in the sticking direction on the pattern forming face of the wafer. There is also provided a film sticking device for executing this method. Due to the foregoing, when the surface protective film is stuck, it is possible to prevent the orientation flat from being damaged and it is also possible to prevent air bubbles from being formed. When the film is peeled off after the back surface has been ground, it is preferable that the wafer is arranged in a second orientation which is rotated from the first orientation by 90°.
摘要翻译：提供了一种用于在形成有电路图案（C）的图案形成面（21）上将薄膜粘贴在晶片的图案形成面上的薄膜粘贴方法，包括以下步骤：定位晶片（20）使得当胶片粘贴装置在晶片的图案形成面上沿预定的粘着方向（X 1）移动时，用于将胶片粘贴在图案形成面上的胶片粘贴装置（46）的粘附方向可以基本上平行电路图形的角部分的平分线; 并且当胶片粘贴装置沿着粘贴方向移动到晶片的图案形成面上时，将胶片粘贴在晶片的图案形成面上。还提供了一种用于执行该方法的胶片粘贴装置。由于上述原因，当表面保护膜被卡住时，可以防止定向平面受损，并且还可以防止形成气泡。当在背面被研磨之后剥离膜时，优选的是，晶片被布置成从第一取向旋转90°的第二取向。

10. 发明申请

US20060011284A1 Film peeling method and film peeling device 失效
标题翻译：薄膜剥离方法和薄膜剥离装置
公开(公告)号：US20060011284A1
公开(公告)日：2006-01-19
申请号：US11177031
申请日：2005-07-08
申请人： Minoru Ametani
发明人： Minoru Ametani
IPC分类号： B32B37/00 , B41J11/66
CPC分类号： H01L21/67132 , H01L2221/6839 , Y10S156/93 , Y10T156/1179
摘要： There is provided a film peeling device (100) for peeling a film (3) which has been stuck onto a film sticking face of a wafer (120), comprising: a wafer sucking means (31) for sucking the wafer so that the film sticking face of the wafer can become an upper face; a peeling tape feeding means (42) for feeding a peeling tape onto the film of the film sticking face; a pushing means (60) for pushing only one portion of the peeling tape against the film of the wafer at an edge portion of the wafer so that the adhesive strength between the peeling tape and the film can be enhanced in the one portion of the peeling tape; and a peeling means (44) for peeling the film from the film sticking face of the wafer by the peeling tape while the one portion of the peeling tape, the adhesive strength of which has been enhanced, is used as a peeling start portion. Therefore, it is possible to avoid damage to the wafer and an increase in size of the entire film peeling device.
摘要翻译：提供了一种用于剥离已经粘贴在晶片（120）的胶片粘贴面上的膜（3）的膜剥离装置（100），其包括：用于吸取晶片的晶片吸取装置（31），使得膜晶片的粘贴面可以成为上表面; 用于将剥离带供给到胶片贴膜的胶片上的剥离胶带进给装置（42）用于在晶片的边缘部分仅将剥离带的一部分推向晶片的膜的推动装置（60），使得在剥离的一部分中可以提高剥离带和膜之间的粘合强度胶带; 以及剥离装置（44），用于通过剥离带从薄膜的粘贴面剥离薄膜，同时剥离胶带的粘合强度增加的部分被用作剥离开始部分。因此，可以避免对晶片的损坏和整个膜剥离装置的尺寸的增加。

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