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1. 发明授权

US08440040B2 Tape adhering method and tape adhering device 有权
标题翻译：胶带粘合方法和胶带粘合装置
公开(公告)号：US08440040B2
公开(公告)日：2013-05-14
申请号：US12898568
申请日：2010-10-05
申请人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
发明人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
IPC分类号： B44C1/165 , B29C65/50
CPC分类号： B29C63/02 , B29C63/0004 , B29L2031/3425 , B65H37/002 , Y10T156/10 , Y10T156/1705 , Y10T156/1712 , Y10T156/1734
摘要： A tape adhering device including: a drawing roller for drawing out a tape; a tape fixing means for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered under the condition that fixing operation of the tape by the tape fixing means is released.
摘要翻译：一种胶带粘附装置，包括：用于拉出胶带的拉丝辊; 用于固定从拉丝辊拉出的带的一部分的胶带固定装置; 用于从带固定装置和牵引辊之间的拉丝辊中抽出预定量的由胶带固定装置固定的胶带的胶带牵引装置; 以及用于将位于带固定装置的下游的带粘合到胶带粘合装置上的条带粘合装置，在被胶带固定装置的胶带的固定操作被释放的条件下粘附到待粘合的物体上。

2. 发明授权

US08182632B2 Wafer table, surface protective film peeling apparatus and surface protective film peeling method 有权
标题翻译：晶圆台，表面保护膜剥离装置和表面保护膜剥离方法
公开(公告)号：US08182632B2
公开(公告)日：2012-05-22
申请号：US12664870
申请日：2008-06-17
申请人： Hideo Kino , Minoru Amatani
发明人： Hideo Kino , Minoru Amatani
IPC分类号： B32B38/10 , B32B11/00
CPC分类号： H01L21/67132 , Y10T156/1132 , Y10T156/1168 , Y10T156/1174 , Y10T156/16 , Y10T156/1944 , Y10T156/195 , Y10T156/1978
摘要： The wafer table (31) for holding a wafer (20) having the back surface thereof supported by a mount frame (36) via a dicing film (3) and the front surface thereof with a surface protective film (11) attached thereon is described. A groove (60) is formed in the area of the table corresponding to at least a part of the outer periphery of the wafer. Further, the table includes a holding means (33) for holding the wafer to the front surface of the table and a suction means for suction of the air in the groove. Thus, the dicing film can be positively collapsed in the groove while at the same time being restored to the original position.
摘要翻译：描述了通过切割膜（3）保持其后表面由安装框架（36）支撑的晶片（20）的晶片台（31）和其表面上附着有表面保护膜（11）的晶片台（31）。在桌子的与晶片的外周的至少一部分相对应的区域中形成有槽（60）。此外，台子还包括用于将晶片保持在工作台的前表面的保持装置（33）和用于吸入槽中的空气的抽吸装置。因此，切割膜可以在凹槽中被正确地折叠，同时恢复到初始位置。

3. 发明授权

US07490650B2 Workpiece processing device 有权
标题翻译：工件加工装置
公开(公告)号：US07490650B2
公开(公告)日：2009-02-17
申请号：US11752146
申请日：2007-05-22
申请人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
发明人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
IPC分类号： H01L21/67 , H01L21/673 , H01L21/677 , H01L21/68
CPC分类号： H01L21/67132 , H01L21/67294 , Y10S414/135 , Y10S438/976 , Y10T156/1105 , Y10T156/17 , Y10T156/1906 , Y10T156/1978
摘要： A workpiece processing device (10) for processing a workpiece (60; 20, 36) comprises: a surface protection film peeling means (50) for peeling a surface protection film (110), which is adhered to a front surface (21) of a workpiece, with a peeling tape (4); a bar code adhering means (11) for adhering a bar code (65) corresponding to the workpiece to the workpiece; and a movable support table (72) for supporting the workpiece. A peeling operation for peeling the surface protection film conducted by the surface protection film peeling means and a adhering operation for adhering a bar code conducted by the bar code adhering means are given to the workpiece while the workpiece is being supported by the support table. Due to the foregoing, it is possible to avoid failures when adhering the bar code to the workpiece, such as a wafer. The bar code adhering means may adhere the bar code, which corresponds to character information of the workpiece read out by an optical reading means, to the workpiece.
摘要翻译：一种用于加工工件（60; 20,36）的工件加工装置（10）包括：表面保护膜剥离装置（50），其用于剥离表面保护膜（110），所述表面保护膜剥离装置具有剥离胶带（4）的工件; 用于将对应于工件的条形码（65）粘附到工件上的条形码粘合装置（11）和用于支撑工件的活动支撑台（72）。当工件被支撑台支撑时，用于剥离由表面保护膜剥离装置传导的表面保护膜的剥离操作和用于粘附由条形码粘附装置传导的条形码的粘合操作。由于上述原因，可以避免在将条形码粘贴到诸如晶片的工件时发生故障。条形码粘贴装置可以将对应于由光学读取装置读出的工件的字符信息的条形码粘附到工件。

4. 发明申请

US20070277934A1 WORKPIECE PROCESSING DEVICE 有权
标题翻译：工件加工设备
公开(公告)号：US20070277934A1
公开(公告)日：2007-12-06
申请号：US11752146
申请日：2007-05-22
申请人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
发明人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
IPC分类号： B32B37/00
CPC分类号： H01L21/67132 , H01L21/67294 , Y10S414/135 , Y10S438/976 , Y10T156/1105 , Y10T156/17 , Y10T156/1906 , Y10T156/1978
摘要： A workpiece processing device (10) for processing a workpiece (60; 20, 36) comprises: a surface protection film peeling means (50) for peeling a surface protection film (110), which is adhered to a front surface (21) of a workpiece, with a peeling tape (4); a bar code adhering means (11) for adhering a bar code (65) corresponding to the workpiece to the workpiece; and a movable support table (72) for supporting the workpiece. A peeling operation for peeling the surface protection film conducted by the surface protection film peeling means and a adhering operation for adhering a bar code conducted by the bar code adhering means are given to the workpiece while the workpiece is being supported by the support table. Due to the foregoing, it is possible to avoid failures when adhering the bar code to the workpiece, such as a wafer. The bar code adhering means may adhere the bar code, which corresponds to character information of the workpiece read out by an optical reading means, to the workpiece.
摘要翻译：一种用于加工工件（60; 20,36）的工件加工装置（10）包括：表面保护膜剥离装置（50），其用于剥离表面保护膜（110），所述表面保护膜剥离装置具有剥离胶带（4）的工件; 用于将对应于工件的条形码（65）粘附到工件上的条形码粘合装置（11）和用于支撑工件的活动支撑台（72）。当工件被支撑台支撑时，用于剥离由表面保护膜剥离装置传导的表面保护膜的剥离操作和用于粘附由条形码粘附装置传导的条形码的粘合操作。由于上述原因，可以避免在将条形码粘贴到诸如晶片的工件时发生故障。条形码粘贴装置可以将对应于由光学读取装置读出的工件的字符信息的条形码粘附到工件。

5. 发明申请

US20070269962A1 SURFACE PROTECTION FILM PEELING METHOD AND SURFACE PROTECTION FILM PEELING DEVICE 有权
标题翻译：表面保护膜剥离方法和表面保护膜剥离装置
公开(公告)号：US20070269962A1
公开(公告)日：2007-11-22
申请号：US11750302
申请日：2007-05-17
申请人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
发明人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , B29C63/0013 , Y10T156/1168 , Y10T156/1978
摘要： A film peeling device for peeling a film (11) adhered to a front surface of a wafer (20), on the back surface of which a dicing tape (3) is adhered, the wafer is integrated with a mount frame (36) into one body, comprises: a movable table (31), which can be moved horizontally to support the wafer and the mount frame while the surface protection film is being directed upward; a covering means (80) for covering an adhesive face (3a) of the dicing tape, which is exposed between the mount frame and the wafer at one end (28) of the wafer; and a adhering means (46) for adhering a peeling tape (4) to the film at the end of the wafer. The film is peeled from the front surface of the wafer by moving the movable table from the other end (29) of the wafer to one end after the peeling tape has adhered. Due to the foregoing, while the peeling tape is being prevented from adhering to the dicing tape, the film can be peeled from the front surface of the wafer in a shorter period of time.
摘要翻译：一种膜剥离装置，用于剥离附着在晶片（20）前表面上的膜（11），在其背面上粘附有切割胶带（3），所述晶片与安装框架（36）集成成一个主体包括：可移动台（31），其可以在表面保护膜向上指向的同时水平移动以支撑晶片和安装框架; 覆盖装置（80），用于覆盖在晶片的一端（28）处露出在安装框架和晶片之间的切割带的粘合面（3a）; 以及用于将剥离带（4）粘附到晶片末端的膜的粘合装置（46）。在剥离带粘附之后，通过将可移动台从晶片的另一端（29）移动到一端，从而从晶片的前表面剥离膜。由于上述原因，当剥离胶带被防止粘附到切割胶带上时，可以在更短的时间内从胶片的前表面剥离胶片。

6. 发明申请

US20100181019A1 WAFER TABLE, SURFACE PROTECTIVE FILM PEELING APPARATUS AND SURFACE PROTECTIVE FILM PEELING METHOD 有权
标题翻译：表面保护膜剥离装置和表面保护膜剥离方法
公开(公告)号：US20100181019A1
公开(公告)日：2010-07-22
申请号：US12664870
申请日：2008-06-17
申请人： Hideo Kino , Minoru Amatani
发明人： Hideo Kino , Minoru Amatani
IPC分类号： B32B38/10
CPC分类号： H01L21/67132 , Y10T156/1132 , Y10T156/1168 , Y10T156/1174 , Y10T156/16 , Y10T156/1944 , Y10T156/195 , Y10T156/1978
摘要： The wafer table (31) for holding a wafer (20) having the back surface thereof supported by a mount frame (36) via a dicing film (3) and the front surface thereof with a surface protective film (11) attached thereon is described. A groove (60) is formed in the area of the table corresponding to at least a part of the outer periphery of the wafer. Further, the table includes a holding means (33) for holding the wafer to the front surface of the table and a suction means for suction of the air in the groove. Thus, the dicing film can be positively collapsed in the groove while at the same time being restored to the original position.
摘要翻译：描述了通过切割膜（3）保持其后表面由安装框架（36）支撑的晶片（20）的晶片台（31）和其表面上附着有表面保护膜（11）的晶片台（31）。在桌子的与晶片的外周的至少一部分相对应的区域中形成有槽（60）。此外，台子还包括用于将晶片保持在工作台的前表面的保持装置（33）和用于吸入槽中的空气的抽吸装置。因此，切割膜可以在凹槽中被正确地折叠，同时恢复到初始位置。

7. 发明申请

US20070262276A1 CASSETTE CONVEYANCE METHOD AND CASSETTE CONVEYANCE APPARATUS 审中-公开
标题翻译： CASSETTE输送方法和CASSETTE输送装置
公开(公告)号：US20070262276A1
公开(公告)日：2007-11-15
申请号：US11740249
申请日：2007-04-25
申请人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
发明人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
IPC分类号： B65H5/00
CPC分类号： H01L21/67769
摘要： A cassette conveyance apparatus (10) includes: a first conveyance means (20) for conveying a first cassette (40) in a horizontal and vertical direction; and a second conveyance means (30) for conveying a second cassette (50) in a horizontal and vertical direction. In the cassette conveyance apparatus (10), the first and second cassettes are circulated between a predetermined wafer accommodation position (P1), at which a wafer (2) is accommodated in the cassette, and a predetermined cassette replacement position (P0) at which a cassette accommodating a plurality of wafers is replaced with an empty cassette. Due to the foregoing, the wafers are continuously accommodated in the cassette without stopping an operation of a pretreatment step.
摘要翻译：盒输送装置（10）包括：用于在水平和垂直方向上输送第一盒（40）的第一输送装置（20）以及用于在水平和垂直方向上输送第二盒（50）的第二传送装置（30）。在盒输送装置（10）中，第一和第二盒子在晶片（2）容纳在盒中的预定晶片容纳位置（P 1）和预定的盒更换位置（P 0）之间循环，其中容纳多个晶片的盒被空盒替换。由于上述原因，晶片被连续地容纳在盒中，而不停止预处理步骤的操作。

8. 发明授权

US08151856B2 Surface protection film peeling method and surface protection film peeling device 有权
标题翻译：表面保护膜剥离方法和表面保护膜剥离装置
公开(公告)号：US08151856B2
公开(公告)日：2012-04-10
申请号：US11750302
申请日：2007-05-17
申请人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
发明人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
IPC分类号： B32B38/10
CPC分类号： H01L21/67132 , B29C63/0013 , Y10T156/1168 , Y10T156/1978
摘要： A film peeling device for peeling a film (11) adhered to a front surface of a wafer (20), on the back surface of which a dicing tape (3) is adhered, the wafer is integrated with a mount frame (36) into one body, comprises: a movable table (31), which can be moved horizontally to support the wafer and the mount frame while the surface protection film is being directed upward; a covering means (80) for covering an adhesive face (3a) of the dicing tape, which is exposed between the mount frame and the wafer at one end (28) of the wafer; and a adhering means (46) for adhering a peeling tape (4) to the film at the end of the wafer. The film is peeled from the front surface of the wafer by moving the movable table from the other end (29) of the wafer to one end after the peeling tape has adhered. Due to the foregoing, while the peeling tape is being prevented from adhering to the dicing tape, the film can be peeled from the front surface of the wafer in a shorter period of time.
摘要翻译：一种膜剥离装置，用于剥离附着在晶片（20）前表面上的膜（11），在其背面上粘附有切割胶带（3），所述晶片与安装框架（36）集成成一个主体包括：可移动台（31），其可以在表面保护膜向上指向的同时水平移动以支撑晶片和安装框架; 覆盖装置（80），用于覆盖在晶片的一端（28）处露出在安装框架和晶片之间的切割带的粘合面（3a）; 以及用于将剥离带（4）粘附到晶片末端的膜的粘合装置（46）。在剥离带粘附之后，通过将可移动台从晶片的另一端（29）移动到一端，从而从晶片的前表面剥离膜。由于上述原因，当剥离胶带被防止粘附到切割胶带上时，可以在更短的时间内从胶片的前表面剥离胶片。

9. 发明申请

US20110024020A1 TAPE ADHERING METHOD AND TAPE ADHERING DEVICE 有权
标题翻译：胶带粘贴方法和胶带粘合装置
公开(公告)号：US20110024020A1
公开(公告)日：2011-02-03
申请号：US12898568
申请日：2010-10-05
申请人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
发明人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
IPC分类号： B29C65/50
CPC分类号： B29C63/02 , B29C63/0004 , B29L2031/3425 , B65H37/002 , Y10T156/10 , Y10T156/1705 , Y10T156/1712 , Y10T156/1734
摘要： A tape adhering device (10) comprises: a drawing roller (42) for drawing out a tape (3); a tape fixing means (47) for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means (62) for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means (49, 31, 37) for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered (20, 36) under the condition that fixing operation of the tape by the tape fixing means is released. It is preferable that the length of the tape drawn out by the tape drawing means is not less than the diameter of the object to be adhered. Due to the foregoing, it is possible to prevent wrinkles from being form on the tape at the time of adhering the tape.
摘要翻译：胶带粘接装置（10）包括：用于拉出带（3）的拉丝辊（42）; 用于固定从牵引辊引出的一部分带的胶带固定装置（47）; 用于从带固定装置和牵引辊之间的拉丝辊中抽出预定量的由带固定装置固定的胶带的胶带拉伸装置（62）; 以及用于将位于带固定装置的下游的胶带粘附到待粘合物体（20,36）上的带粘合装置（49,31,37），条带是通过磁带固定装置被释放。由带拉伸装置引出的带的长度最好不小于被粘物的直径。由于上述原因，可以防止在胶带粘附时在带上形成褶皱。

10. 发明申请

US20070284028A1 PEELING TAPE ADHERING METHOD AND PEELING TAPE ADHERING DEVICE 审中-公开
标题翻译：胶带粘贴方法和胶带粘贴装置
公开(公告)号：US20070284028A1
公开(公告)日：2007-12-13
申请号：US11753486
申请日：2007-05-24
申请人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
发明人： Isamu Kawashima , Hideshi Sato , Hideo Kino , Minoru Ametani
IPC分类号： B32B41/00 , B32B37/12
CPC分类号： H01L21/67132
摘要： A peeling tap adhering method for adhering a peeling tape (4) to a surface protection film (11) adhered to the front surface of a wafer (20), comprises the steps of: supporting the wafer on a table (31) under the condition that the surface protection film is directed upward; adhering the peeling tape onto the surface protection film by pressing the peeling tape onto the surface protection film when a peeling tape adhering means (46) is lowered; detecting the pressure between the surface protection film of the wafer and the peeling tape adhering means; and stopping the peeling tape adhering means from lowering in the case where a pressure detection value (P) is not less than a predetermined value (P0). Due to the foregoing, it is possible to prevent the wafer from being cracked. Further, it is possible to prevent the peeling tape and the dicing tape from adhering to each other. When the distance (L) between the surface protection film of the wafer and the peeling tape adhering means becomes a value not more than a predetermined value (L0), the peeling tape sticking means may be stopped from lowering.
摘要翻译：一种用于将剥离带（4）粘附到粘附到晶片（20）的前表面上的表面保护膜（11）的剥离剥离粘合方法包括以下步骤：在条件下将晶片支撑在工作台（31）上表面保护膜被向上引导; 当剥离带粘合装置（46）降低时，通过将剥离带压到表面保护膜上将剥离胶带粘附到表面保护膜上; 检测晶片的表面保护膜和剥离带粘附装置之间的压力; 并且在压力检测值（P）不小于预定值（P 0）的情况下，使剥离胶带粘合装置停止下降。由于上述原因，可以防止晶片破裂。此外，可以防止剥离带和切割带彼此粘附。当晶片的表面保护膜和剥离带粘合装置之间的距离（L）成为不大于预定值（L 0）的值时，可以停止剥离胶带粘附装置的降低。

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