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1. 发明授权

US07700193B2 Core-shell structure with magnetic, thermal, and optical characteristics and manufacturing method thereof 有权
标题翻译：具有磁，热和光学特性的核 - 壳结构及其制造方法
公开(公告)号：US07700193B2
公开(公告)日：2010-04-20
申请号：US11237681
申请日：2005-09-29
申请人： Ming-Yao Chen , Wen-Hsiang Chang , Chin-I Lin , Shian-Jy Jassy Wang , Yuh-Jiuan Lin
发明人： Ming-Yao Chen , Wen-Hsiang Chang , Chin-I Lin , Shian-Jy Jassy Wang , Yuh-Jiuan Lin
IPC分类号： B32B5/16
CPC分类号： B22F1/025 , B22F1/0018 , B22F2998/10 , B82Y25/00 , B82Y30/00 , H01F1/0054 , Y10S428/90 , Y10S977/779 , Y10T428/12181 , Y10T428/2982 , Y10T428/2991 , Y10T428/32 , Y10T428/325 , B22F1/0022 , B22F1/0088
摘要： A core-shell structure with magnetic, thermal, and optical characteristics. The optical absorption band is tailorable by choice of the mixing ratio of the core/shell component to give the desired shell thickness. The core-shell structure is particularly suitable for biomedical applications such as MRI (magnetic resonance imaging) developer, specific tissue identification developer, and magnetic thermal therapy.
摘要翻译：具有磁，热和光学特性的核 - 壳结构。通过选择芯/壳组分的混合比来获得所需的壳厚度，可以限制光吸收带。核 - 壳结构特别适用于生物医学应用，如MRI（磁共振成像）显影剂，特定组织鉴定显影剂和磁热疗法。

2. 发明申请

US20060141149A1 Method for forming superparamagnetic nanoparticles 审中-公开
标题翻译：形成超顺磁性纳米粒子的方法
公开(公告)号：US20060141149A1
公开(公告)日：2006-06-29
申请号：US11101561
申请日：2005-04-08
申请人： Ming-Yao Chen , Wen-Hsiang Chang , Chin-I Lin , Shian-Jy Wang , Yuh-Jiuan Lin
发明人： Ming-Yao Chen , Wen-Hsiang Chang , Chin-I Lin , Shian-Jy Wang , Yuh-Jiuan Lin
IPC分类号： C01G49/02 , B05D7/00
CPC分类号： C01G49/08 , B82Y25/00 , B82Y30/00 , C01P2002/72 , C01P2004/03 , C01P2004/04 , C01P2004/64 , C01P2006/42 , H01F1/0054
摘要： A method for forming a superparamagnetic nanoparticle. The method includes providing an aqueous solution comprising Fe2+ and Fe3+ ions and adding alkali to the aqueous solution. An iron oxide nanoparticle is formed by subjecting the aqueous solution to ultrasonic vibration and collected.
摘要翻译：一种形成超顺磁性纳米粒子的方法。该方法包括提供包含Fe 2+ 2+和Fe 3+ +离子的水溶液并向该水溶液中加入碱。通过使水溶液进行超声波振动并收集来形成氧化铁纳米颗粒。

3. 发明申请

US20060228551A1 Core-shell structure with magnetic, thermal, and optical characteristics and manufacturing method thereof 有权
标题翻译：具有磁，热和光学特性的核 - 壳结构及其制造方法
公开(公告)号：US20060228551A1
公开(公告)日：2006-10-12
申请号：US11237681
申请日：2005-09-29
申请人： Ming-Yao Chen , Wen-Hsiang Chang , Chin-I Lin , Shian-Jy Wang , Yuh-Jiuan Lin
发明人： Ming-Yao Chen , Wen-Hsiang Chang , Chin-I Lin , Shian-Jy Wang , Yuh-Jiuan Lin
IPC分类号： B05D7/00 , B32B5/16 , B32B15/02
CPC分类号： B22F1/025 , B22F1/0018 , B22F2998/10 , B82Y25/00 , B82Y30/00 , H01F1/0054 , Y10S428/90 , Y10S977/779 , Y10T428/12181 , Y10T428/2982 , Y10T428/2991 , Y10T428/32 , Y10T428/325 , B22F1/0022 , B22F1/0088
摘要： A core-shell structure with magnetic, thermal, and optical characteristics. The optical absorption band is tailorable by choice of the mixing ratio of the core/shell component to give the desired shell thickness. The core-shell structure is particularly suitable for biomedical applications such as MRI (magnetic resonance imaging) developer, specific tissue identification developer, and magnetic thermal therapy.
摘要翻译：具有磁，热和光学特性的核 - 壳结构。通过选择芯/壳组分的混合比来获得所需的壳厚度，可以限制光吸收带。核 - 壳结构特别适用于生物医学应用，如MRI（磁共振成像）显影剂，特定组织鉴定显影剂和磁热疗法。

4. 发明申请

US20070148095A1 Fluorescent magnetic nanoparticles with specific targeting functions 审中-公开
标题翻译：具有特定靶向功能的荧光磁性纳米颗粒
公开(公告)号：US20070148095A1
公开(公告)日：2007-06-28
申请号：US11430894
申请日：2006-05-10
申请人： Ming-Yao Chen , Chi-Min Chau , Hsiang Huang , Cheng-Yi Chen , Pei-Shin Jiang , Chin-I Lin
发明人： Ming-Yao Chen , Chi-Min Chau , Hsiang Huang , Cheng-Yi Chen , Pei-Shin Jiang , Chin-I Lin
IPC分类号： A61K49/10 , C07K16/46
CPC分类号： A61K49/0002 , A61K41/00 , A61K49/0032 , A61K49/0052 , A61K49/0054 , A61K49/0093
摘要： Magnetic nanoparticles with fluorescent properties and specific targeting functions. The fluorescent magnetic nanoparticle includes a magnetic nanoparticle, a biocompatible polymer chemically modifying the magnetic nanoparticle, a fluorescent dye coupled to the biocompatible polymer, and a specific targeting agent coupled to the biocompatible polymer. The fluorescent and magnetic properties of the nanoparticles provide different types of signal sources and therefore, prompt imaging using different types of imaging techniques to reconfirm foci is feasible.
摘要翻译：具有荧光性质和特异性靶向功能的磁性纳米颗粒。荧光磁性纳米颗粒包括磁性纳米颗粒，化学修饰磁性纳米颗粒的生物相容性聚合物，与生物相容性聚合物偶联的荧光染料和与生物相容性聚合物偶联的特异性靶向剂。纳米颗粒的荧光和磁性能提供不同类型的信号源，因此，使用不同类型的成像技术进行即时成像，以重新确认病灶是可行的。

5. 发明申请

US20080197352A1 BUMP STRUCTURE ON SUBSTRATE 有权
标题翻译：衬底上的BUMP结构
公开(公告)号：US20080197352A1
公开(公告)日：2008-08-21
申请号：US11758013
申请日：2007-06-05
申请人： Ming-Yao Chen , Sheng-Shu Yang , Shyh-Ming Chang , Ngai Tsang
发明人： Ming-Yao Chen , Sheng-Shu Yang , Shyh-Ming Chang , Ngai Tsang
IPC分类号： H01L23/58
CPC分类号： H01L23/49816 , H01L22/12 , H01L24/13 , H01L24/14 , H01L24/81 , H01L2223/54426 , H01L2224/0401 , H01L2224/0603 , H01L2224/06505 , H01L2224/10135 , H01L2224/13012 , H01L2224/13016 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/1403 , H01L2224/14051 , H01L2224/14505 , H01L2224/16 , H01L2224/81136 , H01L2224/81139 , H01L2224/81191 , H01L2224/81801 , H01L2924/01033 , H01L2924/01082 , H01L2924/15787 , H01L2924/00014 , H01L2924/00
摘要： A bump structure on a substrate including at least one first electrode, at least one first bump, at least one second bump is provided. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate. The height of the second bump is greater than that of the first bump. The elastic bump of the present invention can be used for measuring the bonding process quality.
摘要翻译：提供了包括至少一个第一电极，至少一个第一凸块，至少一个第二凸块的衬底上的凸块结构。第一电极设置在基板上。第一凸块设置在第一电极上。第二凸块设置在基板上。第二凸块的高度大于第一凸块的高度。本发明的弹性凸块可用于测量接合工艺质量。

6. 发明申请

US20130099238A1 LIQUID CRYSTAL DISPLAY HAVING A HIGH APERTURE RATIO 审中-公开
标题翻译：具有高孔径比的液晶显示
公开(公告)号：US20130099238A1
公开(公告)日：2013-04-25
申请号：US13467047
申请日：2012-05-09
申请人： Ming-Yao Chen , Pei-Ming Chen
发明人： Ming-Yao Chen , Pei-Ming Chen
IPC分类号： H01L29/786
CPC分类号： G02F1/13471 , G02F1/1362 , H01L27/1225
摘要： A (liquid crystal display) LCD includes a pixel array and a gate driving circuit. The pixel array includes a plurality of first oxide thin film transistors, a first oxide thin film transistor of the first oxide thin film transistors with a shortest channel length having a first channel length. The gate driving circuit is coupled to the pixel array for driving the pixel array, and includes a plurality of second oxide thin film transistors. The second oxide thin film of the second oxide thin film transistors with a longest channel length has a second channel length. A ratio of the second channel length and the first channel length is greater than 1.5. By limiting the ratio of the second channel length and the first channel length, the aperture ratio of the display panel can be improved without deteriorating the operation stability of the LCD.
摘要翻译： A（液晶显示器）LCD包括像素阵列和栅极驱动电路。像素阵列包括多个第一氧化物薄膜晶体管，具有第一沟道长度的具有最短沟道长度的第一氧化物薄膜晶体管的第一氧化物薄膜晶体管。栅极驱动电路耦合到像素阵列以驱动像素阵列，并且包括多个第二氧化物薄膜晶体管。具有最长沟道长度的第二氧化物薄膜晶体管的第二氧化物薄膜具有第二沟道长度。第二通道长度与第一通道长度之比大于1.5。通过限制第二通道长度和第一通道长度的比例，可以提高显示面板的开口率，而不会降低LCD的操作稳定性。

7. 发明授权

US07838967B2 Semiconductor chip having TSV (through silicon via) and stacked assembly including the chips 有权
标题翻译：具有TSV（通过硅通孔）和包括芯片的堆叠组件的半导体芯片
公开(公告)号：US07838967B2
公开(公告)日：2010-11-23
申请号：US12108903
申请日：2008-04-24
申请人： Ming-Yao Chen
发明人： Ming-Yao Chen
IPC分类号： H01L23/488
CPC分类号： H01L23/481 , H01L21/76898 , H01L24/05 , H01L24/80 , H01L24/92 , H01L25/0657 , H01L2224/06181 , H01L2224/08146 , H01L2224/08235 , H01L2224/08245 , H01L2224/80141 , H01L2224/9202 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06562 , H01L2225/06565 , H01L2924/00013 , H01L2924/01029 , H01L2924/15787 , H01L2924/351 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A semiconductor chip having through silicon vias (TSV) and a stacked assembly including the chip are revealed. The chip has a plurality of first and second bonding pads disposed on two opposing surfaces of a semiconductor substrate respectively. Through hole vertically penetrate through the semiconductor substrate and the first and second bonding pads. By forming first extruded ring, the first bonding pad has a first contact surface located between the first extruded ring and the through hole. By forming second extruded ring, the second bonding pad has a second contact surface located outside and adjacent to the second extruded rings to encircle the second extruded ring. The second extruded ring has a proper dimension to fit in the first extruded ring. Accordingly, a plurality of semiconductor chip can be stacked each other with accurate alignment without shifting to effectively reduce the stacked assembly height, moreover, chip stacking processes are accomplished by vertically stacking a plurality of chips first then filling conductive material into the through holes without electrical short between the adjacent bonding pads due to overflow of conductive material to meet the fine-pitch requirements of TSV. The process flow for the stacked assembly is simplified with higher production yields.
摘要翻译：揭示了通过硅通孔（TSV）的半导体芯片和包括芯片的堆叠组件。芯片具有分别设置在半导体衬底的两个相对表面上的多个第一和第二接合焊盘。通孔垂直地穿过半导体衬底和第一和第二焊盘。通过形成第一挤压环，第一接合焊盘具有位于第一挤压环和通孔之间的第一接触表面。通过形成第二挤压环，第二接合焊盘具有位于第二挤压环的外侧并与第二挤压环相邻的第二接触表面，以环绕第二挤压环。第二挤压环具有适合尺寸以适合第一挤出环。因此，可以精确地对准多个半导体芯片，而不需要移位，从而有效地降低堆叠的组装高度，此外，首先通过垂直堆叠多个芯片，然后将导电材料填充到通孔中而不用电由于导电材料溢出而导致相邻焊盘之间短路，以满足TSV的精细间距要求。叠层组件的工艺流程可以通过更高的生产率得到简化。

8. 发明授权

US07449716B2 Bond quality indication by bump structure on substrate 有权
标题翻译：通过基底上的凸块结构的焊接质量指示
公开(公告)号：US07449716B2
公开(公告)日：2008-11-11
申请号：US11758013
申请日：2007-06-05
申请人： Ming-Yao Chen , Sheng-Shu Yang , Shyh-Ming Chang , Ngai Tsang
发明人： Ming-Yao Chen , Sheng-Shu Yang , Shyh-Ming Chang , Ngai Tsang
IPC分类号： H01L23/58 , H01L23/544
CPC分类号： H01L23/49816 , H01L22/12 , H01L24/13 , H01L24/14 , H01L24/81 , H01L2223/54426 , H01L2224/0401 , H01L2224/0603 , H01L2224/06505 , H01L2224/10135 , H01L2224/13012 , H01L2224/13016 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/1403 , H01L2224/14051 , H01L2224/14505 , H01L2224/16 , H01L2224/81136 , H01L2224/81139 , H01L2224/81191 , H01L2224/81801 , H01L2924/01033 , H01L2924/01082 , H01L2924/15787 , H01L2924/00014 , H01L2924/00
摘要： A bump structure on a substrate including at least one first electrode, at least one first bump, at least one second bump is provided. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate. The height of the second bump is greater than that of the first bump. The elastic bump of the present invention can be used for measuring the bonding process quality.
摘要翻译：提供了包括至少一个第一电极，至少一个第一凸块，至少一个第二凸块的衬底上的凸块结构。第一电极设置在基板上。第一凸块设置在第一电极上。第二凸块设置在基板上。第二凸块的高度大于第一凸块的高度。本发明的弹性凸块可用于测量接合工艺质量。

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