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    • 1. 发明申请
    • Multi-stage flow control apparatus and method of use
    • 多级流量控制装置及其使用方法
    • US20070294870A1
    • 2007-12-27
    • US11475365
    • 2006-06-27
    • Ming-Kuei TsengKim Vellore
    • Ming-Kuei TsengKim Vellore
    • H01L21/67
    • H01L21/67225G05D7/0647H01L21/6715
    • A multi-stage flow control apparatus for use during the processing of a semiconductor substrate is provided. The multi-stage flow control apparatus includes a first inlet and a second inlet, an outlet, and a first throttle valve stage coupled to the first inlet. The first throttle valve stage includes a first throttle valve plug located within the first throttle valve stage. The first throttle valve plug is configured to control the amount of airflow through the first throttle valve stage by modulating the distance between the first throttle valve plug and faces of the first throttle valve stage. The multi-stage flow control apparatus further includes a second throttle valve stage coupled to the second inlet. The second throttle valve stage includes a second throttle valve plug located within the second throttle valve stage. The second throttle valve plug is configured to control the amount of airflow through the second throttle valve stage by modulating the distance between the second throttle valve plug and faces of the second throttle valve stage. In addition, the multi-stage flow control apparatus includes a floating plunger stage coupled to the throttle valve stage.
    • 提供了一种在半导体衬底的处理期间使用的多级流量控制装置。 多级流量控制装置包括第一入口和第二入口,出口以及联接到第一入口的第一节流阀级。 第一节流阀级包括位于第一节流阀级内的第一节流阀塞。 第一节流阀塞构造成通过调节第一节流阀塞与第一节流阀级的面之间的距离来控制通过第一节流阀级的气流量。 多级流量控制装置还包括联接到第二入口的第二节流阀级。 第二节流阀级包括位于第二节流阀级内的第二节流阀塞。 第二节流阀塞构造成通过调节第二节流阀塞与第二节流阀级的面之间的距离来控制通过第二节流阀级的气流量。 此外,多级流量控制装置包括联接到节流阀级的浮动柱塞级。
    • 3. 发明申请
    • Method and apparatus for planarizing a substrate with low fluid consumption
    • 用于以低流体消耗平坦化基板的方法和装置
    • US20070131562A1
    • 2007-06-14
    • US11298643
    • 2005-12-08
    • Zhihong WangMing-Kuei TsengYuan TianYongqi HuStan Tsai
    • Zhihong WangMing-Kuei TsengYuan TianYongqi HuStan Tsai
    • B23H3/00
    • B23H5/08B24B37/04B24B57/02C25D5/06C25D5/08C25D7/12C25D17/001
    • The embodiments of the invention generally relate to a method and apparatus for processing a substrate with reduced fluid consumption. Embodiments of the invention may be beneficially utilized in chemical mechanical and electrochemical mechanical polishing processes, among other processes where conservation of a processing fluid disposed on a rotating pad is desirable. In one embodiment, a processing fluid delivery arm assembly is provided that includes a nozzle assembly supported at a distal end of an arm. The nozzle assembly includes a nozzle that is adjustable to control the delivery of fluid exiting therefrom in two planes relative to the arm. In another embodiment, processing fluid in the form of electrolyte fills holes formed at least partially through the pad as they enter the wet zone, and a current is driven through the electrolyte, filling the holes between a substrate and an electrode disposed below the surface of the pad.
    • 本发明的实施例一般涉及用于处理具有减少的流体消耗的基板的方法和装置。 本发明的实施例可以有利地用于化学机械和电化学机械抛光工艺以及其它工艺中,其中设置在旋转焊盘上的处理流体的保护是期望的。 在一个实施例中,提供了一种处理流体输送臂组件,其包括支撑在臂的远端处的喷嘴组件。 喷嘴组件包括可调节的喷嘴,以控制从相对于臂的两个平面离开的流体的输送。 在另一个实施方案中,电解液形式的处理流体在其进入湿区时填充至少部分地通过焊盘形成的孔,并且电流驱动通过电解质,填充基板和设置在下表面之下的电极之间的孔 垫
    • 4. 发明授权
    • Carrier head with edge load retaining ring
    • 承载头带边缘负载保持环
    • US06890249B1
    • 2005-05-10
    • US10327236
    • 2002-12-20
    • Steven M. ZunigaMing-Kuei Tseng
    • Steven M. ZunigaMing-Kuei Tseng
    • B24B37/04B24B47/02
    • B24B37/32
    • A carrier head for chemical mechanical polishing of a substrate having a front surface, a back surface and an edge. The carrier head has a base, an inner retaining ring positioned beneath the base, and an outer retaining ring surrounding the inner retaining ring to retain the inner retaining ring. The inner retaining ring has a main portion with a first surface to apply a load to a perimeter portion of the back surface of the substrate and an annular lower projection protruding downwardly from the main portion with a second surface to circumferentially surround the edge of the substrate to retain the substrate.
    • 用于具有前表面,后表面和边缘的基底的化学机械抛光的载体头。 承载头具有基座,位于基座下方的内部保持环和围绕内部保持环以保持内部保持环的外部保持环。 内保持环具有主要部分,其具有第一表面,以将负载施加到基板的后表面的周边部分;以及环形下突出部,其从主体部分向下突出并具有第二表面以周向地围绕基板的边缘 以保持基底。
    • 8. 发明申请
    • Multi-stage flow control apparatus with flexible membrane and method of use
    • 具有柔性膜的多级流量控制装置及其使用方法
    • US20070295269A1
    • 2007-12-27
    • US11475688
    • 2006-06-27
    • Ming-Kuei Tseng
    • Ming-Kuei Tseng
    • C23C14/00B05C13/02
    • G05D7/0647
    • A method and apparatus for maintaining constant exhaust flow during processing of a semiconductor substrate is provided. For example, the apparatus may include an inlet and an outlet. Furthermore, the apparatus may include a throttle valve stage coupled to the inlet. The throttle valve stage includes a throttle valve plug located within the throttle valve stage. The throttle valve plug is configured to control the amount of airflow through the throttle valve stage by modulating the distance between the throttle valve plug and faces of the throttle valve stage. The apparatus further includes a floating plunger stage coupled to the throttle valve stage. The floating plunger stage includes a floating plunger coupled to a flexible attachment. The flexible attachment allows the floating plunger to move in a controlled manner to vary an opening between the floating plunger and the outlet.
    • 提供一种用于在半导体衬底的处理期间保持恒定排气流的方法和装置。 例如,该装置可以包括入口和出口。 此外,该装置可以包括联接到入口的节气门台。 节流阀级包括位于节流阀级内的节流阀塞。 节气门塞被构造成通过调节节流阀塞与节流阀级面之间的距离来控制通过节流阀级的气流量。 该装置还包括联接到节流阀级的浮动柱塞级。 浮动柱塞台包括联接到柔性附件的浮动柱塞。 柔性附件允许浮动柱塞以受控的方式移动以改变浮动柱塞和出口之间的开口。
    • 9. 发明授权
    • Carrier head with gimbal mechanism
    • 承载头与万向架机构
    • US07101273B2
    • 2006-09-05
    • US11237062
    • 2005-09-28
    • Ming-Kuei TsengSteven M. Zuniga
    • Ming-Kuei TsengSteven M. Zuniga
    • B24B5/00
    • B24B37/30
    • A carrier head includes a housing connectable to a drive shaft to rotate therewith, a lower assembly having a substrate mounting surface, and a gimbal mechanism that connects the housing to the lower assembly to permit the lower assembly to pivot with respect to the housing about an axis substantially parallel to the polishing surface. The gimbal mechanism includes a shaft having an upper end slidably disposed in a vertical passage in a vertical passage in the housing, and a lower member that connects a lower end of the shaft to the lower assembly. The lower member bends to permit the base to pivot with respect to the housing. The shaft and the lower member are a unitary body.
    • 载体头包括可连接到驱动轴以与其一起旋转的壳体,具有基板安装表面的下部组件和将壳体连接到下部组件的万向节机构,以允许下部组件相对于壳体绕枢轴转动 基本上平行于抛光表面。 万向架机构包括:轴,其上端部可滑动地设置在壳体中的垂直通道中的垂直通道中;以及下部构件,其将轴的下端连接到下部组件。 下部构件弯曲以允许基部相对于壳体枢转。 轴和下部构件是一体的。