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1. 发明授权

US5923553A Method for controlling a semiconductor manufacturing process by failure analysis feedback 失效
标题翻译：通过故障分析反馈控制半导体制造工艺的方法
公开(公告)号：US5923553A
公开(公告)日：1999-07-13
申请号：US759424
申请日：1996-10-05
申请人： Min-Ho Yi
发明人： Min-Ho Yi
IPC分类号： H01L21/66 , G05B15/02 , G05B19/418 , H01L21/02 , G06F19/00
CPC分类号： G05B19/41875 , G05B2219/31426 , G05B2219/32209 , G05B2219/32221 , Y02P90/14 , Y02P90/22
摘要： A method for controlling a semiconductor manufacturing process by failure analysis feedback compares a previous failure analysis result with current real-time process conditions. The method uses the steps of: a) establishing a monitoring data base with abnormal process condition data, the abnormal process condition data being obtained by a correlation between a yield for each manufactured lot and corresponding process conditions for semiconductor equipment when the yield is lowered or semiconductor equipment malfunctions have occurred; b) establishing an equipment data base by obtaining real-time process conditions for on-line semiconductor equipment; c) comparing the real-time process conditions for the on-line semiconductor equipment with the abnormal process conditions of the monitoring data base; and d) stopping the operation of the on-line semiconductor equipment when differences between the real-time and abnormal process conditions fall below a predetermined level.
摘要翻译：通过故障分析反馈来控制半导体制造过程的方法将先前的故障分析结果与当前实时处理条件进行比较。该方法采用以下步骤：a）建立具有异常处理条件数据的监测数据库，异常过程条件数据通过每个制造批次的产量与半导体设备的相应工艺条件之间的相关性获得，当产量降低时，发生半导体设备故障; b）通过获得在线半导体设备的实时处理条件建立设备数据库; c）将在线半导体设备的实时处理条件与监控数据库的异常处理条件进行比较; 以及d）当实时和异常处理条件之间的差异低于预定水平时，停止在线半导体设备的操作。

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