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1. 发明申请

US20110061906A1 Printed circuit board and fabrication method thereof 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20110061906A1
公开(公告)日：2011-03-17
申请号：US12654433
申请日：2009-12-18
申请人： Min Jung Cho , Mi Sun Hwang , Jae Joon Lee , Myung Sam Kang
发明人： Min Jung Cho , Mi Sun Hwang , Jae Joon Lee , Myung Sam Kang
IPC分类号： H05K1/09 , B05D5/12
CPC分类号： H05K1/0271 , H05K1/09 , H05K3/007 , H05K3/4644 , H05K3/4682 , H05K2201/0338 , H05K2201/068 , H05K2201/09136 , H05K2201/10674
摘要： A printed circuit board (PCB) and a fabrication method thereof are disclosed. The PCB includes: a dual-layered circuit pattern formed with a desired pattern on at least one of upper and lower surfaces of an insulation base member (i.e., an insulation substrate) and having metal layers each having a different thermal expansion coefficient; and an insulating layer formed on the insulation base member to cover the circuit pattern. Because the PCB includes an anti-warping unit, a processing rate and productivity can be improved.
摘要翻译：公开了印刷电路板（PCB）及其制造方法。 PCB包括：在绝缘基底（即绝缘基板）的上表面和下表面的至少一个表面上形成具有期望图案并且具有各自具有不同热膨胀系数的金属层的双层电路图案; 以及形成在所述绝缘基底构件上以覆盖所述电路图案的绝缘层。由于PCB包括抗翘曲单元，因此可以提高加工速度和生产率。

2. 发明授权

US08881381B2 Method of manufacturing printed circuit board 有权
标题翻译：制造印刷电路板的方法
公开(公告)号：US08881381B2
公开(公告)日：2014-11-11
申请号：US12631594
申请日：2009-12-04
申请人： Mi Sun Hwang , Myung Sam Kang , Ok Tae Kim , Seon Ha Kang , Gil Yong Shin , Kil Yong Yun , Min Jung Cho
发明人： Mi Sun Hwang , Myung Sam Kang , Ok Tae Kim , Seon Ha Kang , Gil Yong Shin , Kil Yong Yun , Min Jung Cho
IPC分类号： H05K3/36 , H05K3/10 , H05K3/20 , H05K3/46 , H05K3/00 , H05K3/42
CPC分类号： H05K3/4685 , H05K3/0097 , H05K3/205 , H05K3/421 , H05K2201/0376 , H05K2203/0152 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.
摘要翻译：本文公开了一种制造印刷电路板的方法，包括：制备第一载体，其包括在其一侧上形成的第一图案; 制备包括在其一侧上顺序形成的第一阻焊层和第二图案的第二载体; 按压第一载体和第二载体，使得第一图案嵌入绝缘层的一侧，并且将第二图案嵌入绝缘层的另一侧，然后移除第一载体和第二载体以制造两个基板 ; 使用粘合层将两个基板彼此连接，使得第一阻焊层彼此面对; 以及形成用于在绝缘层中连接第一图案与第二图案的通孔，在设置有第一图案的绝缘层上形成第二阻焊剂，然后除去粘合层。

3. 发明申请

US20110067233A1 Method of fabricating printed circuit board 审中-公开
标题翻译：制造印刷电路板的方法
公开(公告)号：US20110067233A1
公开(公告)日：2011-03-24
申请号：US12654669
申请日：2009-12-29
申请人： Seon Ha Kang , Myung Sam Kang , Mi Sun Hwang , Kil Yong Yun , Min Jung Cho , Gil Yong Shin , Ok Tae Kim
发明人： Seon Ha Kang , Myung Sam Kang , Mi Sun Hwang , Kil Yong Yun , Min Jung Cho , Gil Yong Shin , Ok Tae Kim
IPC分类号： H05K3/10
CPC分类号： H05K3/465 , H05K3/0041 , H05K3/045 , H05K3/064 , H05K3/107 , H05K3/108 , H05K3/4602 , H05K3/4611 , H05K2201/09036 , Y10T29/49155
摘要： A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity.
摘要翻译：一种制造印刷电路板的方法，所述方法包括：提供具有形成有第一电路图案的第一表面的绝缘基体和与所述第一表面相对的第二表面; 将绝缘基体的第一表面压在绝缘层的至少一个表面上，使得第一电路图案嵌入绝缘层中; 在绝缘基体的第二表面上形成具有所需图案的抗蚀剂; 通过在其上形成有抗蚀剂的绝缘基体的第二表面上进行等离子体处理来形成沟槽; 以及通过用导电材料填充所述沟槽来形成第二电路图案。因此，可以使用简单的工艺形成导电图案，从而提高处理速度和生产率。

4. 发明申请

US20110061912A1 Printed circuit board and manufacturing method thereof 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20110061912A1
公开(公告)日：2011-03-17
申请号：US12654668
申请日：2009-12-29
申请人： Myung Sam Kang , Mi Sun Hwang , Ok Tae Kim , Seon Ha Kang , Gil Yong Shin , Kil Yong Yun , Min Jung Cho
发明人： Myung Sam Kang , Mi Sun Hwang , Ok Tae Kim , Seon Ha Kang , Gil Yong Shin , Kil Yong Yun , Min Jung Cho
IPC分类号： H05K1/00 , H05K1/11 , B32B38/10 , B29C65/00
CPC分类号： H05K3/4611 , H05K3/045 , H05K3/4069 , H05K3/421 , H05K3/4652 , H05K2201/0355 , H05K2201/0394 , H05K2201/09509 , H05K2201/09518 , H05K2201/096 , H05K2203/1461 , H05K2203/1536 , Y10T156/10
摘要： Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.
摘要翻译：提供了一种印刷电路板（PCB）及其制造方法。 PCB包括堆叠结构，其包括其间插入有第一绝缘层的第二绝缘层和第三绝缘层，以及具有第一至第四导电通孔的导电通孔。在第一绝缘层中埋设第二层电路图形和第三层电路图案，在第二绝缘层上形成第一层电路图案，在第三绝缘层上形成第四层电路图形。第一导电通孔连接第一层电路图案和第二层电路图案，第二导电通孔连接第一层电路图案和第三层电路图案，第三导电通孔连接第二层电路图案和第四层电路图案和第四导电通孔连接第三层电路图案和第四层电路图案。

5. 发明申请

US20110061905A1 Printed circuit board and method of manufacturing the same 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20110061905A1
公开(公告)日：2011-03-17
申请号：US12654446
申请日：2009-12-18
申请人： Mi Sun Hwang , Jae Joon Lee , Myung Sam Kang
发明人： Mi Sun Hwang , Jae Joon Lee , Myung Sam Kang
IPC分类号： H05K1/03 , H05K3/36
CPC分类号： H05K3/10 , H05K1/0271 , H05K1/09 , H05K3/4602 , H05K2201/0338 , H05K2201/0352 , H05K2201/068 , H05K2201/09136
摘要： There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.
摘要翻译：提供了印刷电路板。印刷电路板可以被构造为包括：芯层，其中至少两层的弯曲防止部分插入在多个绝缘构件之间并且包括具有不同热膨胀系数的金属层; 形成为在芯层的内部和芯层的外表面中的至少一个上具有期望图案的电路图案; 以及形成在芯层上并包括露出电路图案的开口部分的绝缘层，以及制造印刷电路板的方法。根据上述印刷电路板和印刷电路板的制造方法，通过在印刷电路板内设置弯曲防止部，能够提高进度和生产率的印刷电路板，以及制造印刷电路板的方法可以提供印刷电路板。

6. 发明授权

US08541096B2 Printed circuit board and method of manufacturing the same 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08541096B2
公开(公告)日：2013-09-24
申请号：US12654446
申请日：2009-12-18
申请人： Mi Sun Hwang , Jae Joon Lee , Myung Sam Kang
发明人： Mi Sun Hwang , Jae Joon Lee , Myung Sam Kang
IPC分类号： H05K1/03 , H05K7/02
CPC分类号： H05K3/10 , H05K1/0271 , H05K1/09 , H05K3/4602 , H05K2201/0338 , H05K2201/0352 , H05K2201/068 , H05K2201/09136
摘要： There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.
摘要翻译：提供了印刷电路板。印刷电路板可以被构造为包括：芯层，其中至少两层的弯曲防止部分插入在多个绝缘构件之间并且包括具有不同热膨胀系数的金属层; 形成为在芯层的内部和芯层的外表面中的至少一个上具有期望图案的电路图案; 以及形成在芯层上并包括露出电路图案的开口部分的绝缘层，以及制造印刷电路板的方法。根据上述印刷电路板和印刷电路板的制造方法，通过在印刷电路板内设置弯曲防止部，能够提高进度和生产率的印刷电路板，以及制造印刷电路板的方法可以提供印刷电路板。

7. 发明授权

US08415200B2 Method for manufacturing semiconductor package 失效
标题翻译：制造半导体封装的方法
公开(公告)号：US08415200B2
公开(公告)日：2013-04-09
申请号：US13007444
申请日：2011-01-14
申请人： Mi Sun Hwang , Keung Jin Sohn , Eung Suek Lee , Myung Sam Kang
发明人： Mi Sun Hwang , Keung Jin Sohn , Eung Suek Lee , Myung Sam Kang
IPC分类号： H01L23/48
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/49816 , H01L23/49894 , H01L24/16 , H01L24/48 , H01L24/81 , H01L2224/16237 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/81192 , H01L2224/81385 , H01L2224/81815 , H01L2924/00014 , H01L2924/01087 , H01L2924/15311 , H05K3/06 , H05K3/4038 , H05K3/4647 , H05K2203/0384 , H01L2924/00015 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed herein is a method for manufacturing a semiconductor package which uses a base member 120 in which a first metal layer 113, a barrier layer 115, and a second metal layer 117 are stacked on both surface thereof in sequence based on an adhesive member 111 to simultaneously manufacture two printed circuit boards through a single sheet process, thereby making it possible to improve manufacturing efficiency; electrically connects a semiconductor chip 300 to a printed circuit board through a solder bump 250, thereby making it possible to implement a high-density package substrate; and forms a metal post 140 instead of a through hole to required in an interlayer circuit connection, thereby making it possible to reduce costs required in the processing/plating of the through hole.
摘要翻译：本发明公开了一种半导体封装件的制造方法，该半导体封装件使用基片120，其中第一金属层113，阻挡层115和第二金属层117依次以两个表面层叠在第一金属层113，阻挡层115和第二金属层117上，同时通过单片工艺制造两个印刷电路板，从而可以提高制造效率; 通过焊料凸块250将半导体芯片300电连接到印刷电路板，从而可以实现高密度封装基板; 并且形成金属柱140而不是层间电路连接所需的通孔，从而可以降低通孔的加工/电镀所需的成本。

8. 发明授权

US08080741B2 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US08080741B2
公开(公告)日：2011-12-20
申请号：US12149522
申请日：2008-05-02
申请人： Myung Sam Kang , Chin Kwan Kim
发明人： Myung Sam Kang , Chin Kwan Kim
IPC分类号： H05K1/11
CPC分类号： H05K3/4007 , H05K3/246 , H05K3/3457 , H05K3/4069 , H05K2201/0347 , H05K2201/0367 , H05K2201/0376 , H05K2201/09481 , H05K2201/09745
摘要： A printed circuit board, which increases the contact area between an IC and a printed circuit board, thus increasing the degree of adhesion, is disclosed. The printed circuit board includes: an insulation layer which includes a first circuit pattern, including at least one via land, embedded in the upper surface of the insulation layer to be flush with the upper surface, and a second circuit pattern formed in the lower surface of the insulation layer to be flush with the lower surface; a solder resist layer formed on the insulation layer; a via hole and a bump integrally formed on the second circuit pattern through the via hole and the via land such that it protrudes from the insulation layer to be higher than the solder resist layer.
摘要翻译：公开了一种印刷电路板，其增加了IC和印刷电路板之间的接触面积，从而增加了粘合度。印刷电路板包括：绝缘层，其包括嵌入在绝缘层的上表面中以与上表面齐平的至少一个通孔焊盘的第一电路图案，以及形成在下表面中的第二电路图案的绝缘层与下表面齐平; 形成在绝缘层上的阻焊层; 通孔和通过通孔和通孔焊盘一体地形成在第二电路图案上的突起，使得其从绝缘层突出成高于阻焊层。

9. 发明申请

US20110061907A1 Printed circuit board and method of manufacturing the same 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20110061907A1
公开(公告)日：2011-03-17
申请号：US12654538
申请日：2009-12-22
申请人： Myung Sam Kang , Chang Sup Ryu
发明人： Myung Sam Kang , Chang Sup Ryu
IPC分类号： H05K1/09 , H05K1/11 , C25D5/02 , B32B38/00
CPC分类号： C25D5/022 , C25D7/12 , H05K3/0035 , H05K3/242 , H05K3/243 , H05K3/3473 , H05K3/4007 , H05K3/42 , H05K2201/0367 , H05K2201/09481 , H05K2203/054 , H05K2203/0577 , H05K2203/1581
摘要： A printed circuit board according to an aspect of the invention may include: a board portion having an electrode portion provided on a surface thereof; a solder resist layer provided on the surface of the board portion and having an opening therein to expose the electrode portion to the outside; and a bump layer having the same diameter as the opening and providing an electrical connection with an external chip component.
摘要翻译：根据本发明的一个方面的印刷电路板可以包括：具有设置在其表面上的电极部分的板部分; 阻焊层，设置在基板部分的表面上，并且在其中具有开口以将电极部分暴露于外部; 以及具有与开口相同直径并且提供与外部芯片部件的电连接的凸块层。

10. 发明申请

US20100132985A1 Printed circuit board having metal bump and method of manufacring the same 有权
标题翻译：具有金属凸块的印刷电路板及其制造方法
公开(公告)号：US20100132985A1
公开(公告)日：2010-06-03
申请号：US12379684
申请日：2009-02-26
申请人： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
发明人： Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
IPC分类号： H05K1/09 , H05K3/20 , H05K1/11
CPC分类号： H05K1/111 , H05K1/09 , H05K1/115 , H05K3/205 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2203/0323 , H05K2203/0376 , Y02P70/611 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
摘要： The invention relates to a printed circuit board having metal bumps which are of even heights and are directly connected to a circuit pattern without using additional bump pads thus allowing an arrangement thereof at fine pitches.
摘要翻译：本发明涉及具有均匀高度的金属凸块并且直接连接到电路图案的印刷电路板，而不使用额外的凸块，从而允许以细间距进行布置。

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