专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100328894A1 OPTICAL INTERCONNECTION DEVICE 有权
标题翻译：光学互连器件
公开(公告)号：US20100328894A1
公开(公告)日：2010-12-30
申请号：US12865780
申请日：2009-02-16
申请人： Mikio Oda , Tomotaka Ishida , Hisaya Takahashi , Hideyuki Ono , Jun Sakai , Takashi Ohtsuka , Arihide Noda , Hikaru Kouta
发明人： Mikio Oda , Tomotaka Ishida , Hisaya Takahashi , Hideyuki Ono , Jun Sakai , Takashi Ohtsuka , Arihide Noda , Hikaru Kouta
IPC分类号： H05K7/20 , G02B6/36
CPC分类号： H01L25/167 , G02B6/4201 , G02B6/4257 , G02B6/4266 , G02B6/4274 , H01L2924/0002 , H01L2924/15174 , H01L2924/15192 , H01L2924/00
摘要： Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules (12) are arranged on a periphery of an LSI (11) electrically connected to an electric wiring board (10), and liquid cooling mechanisms (13, 14) are respectively placed on the LSI (11) and the optical modules (12). The plurality of optical modules (12) may be arranged only on a surface of the electric wiring board (10) where the LSI (11) is mounted, only on a surface opposite to the surface where the LSI (11) is mounted, or on both the same surface as and the opposite surface to the surface where the LSI (11) is mounted.
摘要翻译：提供一种其中冷却所需的体积减小的光学互连装置。在光互连装置中，在与电气布线板（10）电连接的LSI（11）的周围配置多个光模块（12），液体冷却机构（13,14）分别置于 LSI（11）和光模块（12）。多个光学模块（12）可以仅布置在安装有LSI（11）的电气布线板（10）的仅在与安装LSI（11）的表面相对的表面上，或者在与安装LSI（11）的表面相同的表面上和相对的表面上。

2. 发明授权

US08345424B2 Optical interconnection device 有权
标题翻译：光互连设备
公开(公告)号：US08345424B2
公开(公告)日：2013-01-01
申请号：US12865780
申请日：2009-02-16
申请人： Mikio Oda , Tomotaka Ishida , Hisaya Takahashi , Hideyuki Ono , Jun Sakai , Takashi Ohtsuka , Arihide Noda , Hikaru Kouta
发明人： Mikio Oda , Tomotaka Ishida , Hisaya Takahashi , Hideyuki Ono , Jun Sakai , Takashi Ohtsuka , Arihide Noda , Hikaru Kouta
IPC分类号： H05K7/20
CPC分类号： H01L25/167 , G02B6/4201 , G02B6/4257 , G02B6/4266 , G02B6/4274 , H01L2924/0002 , H01L2924/15174 , H01L2924/15192 , H01L2924/00
摘要： Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules (12) are arranged on a periphery of an LSI (11) electrically connected to an electric wiring board (10), and liquid cooling mechanisms (13, 14) are respectively placed on the LSI (11) and the optical modules (12). The plurality of optical modules (12) may be arranged only on a surface of the electric wiring board (10) where the LSI (11) is mounted, only on a surface opposite to the surface where the LSI (11) is mounted, or on both the same surface as and the opposite surface to the surface where the LSI (11) is mounted.
摘要翻译：提供一种其中冷却所需的体积减小的光学互连装置。在光互连装置中，在与电气布线板（10）电连接的LSI（11）的周围配置有多个光模块（12），液体冷却机构（13,14）分别置于 LSI（11）和光模块（12）。多个光学模块（12）可以仅布置在安装有LSI（11）的电气布线板（10）的仅在与LSI（11）的表面相反的表面上的表面上，或者在与安装LSI（11）的表面相同的表面上和相对的表面上。

3. 发明申请

US20090026565A1 Optical Module 审中-公开
标题翻译：光模块
公开(公告)号：US20090026565A1
公开(公告)日：2009-01-29
申请号：US12223541
申请日：2007-02-02
申请人： Arihide Noda , Mikio Oda , Takashi Ohtsuka , Hisaya Takahashi , Hikaru Kouta , Jun Sakai
发明人： Arihide Noda , Mikio Oda , Takashi Ohtsuka , Hisaya Takahashi , Hikaru Kouta , Jun Sakai
IPC分类号： H01L31/0232 , C12Q1/68 , G01J1/00
CPC分类号： G02B6/4214 , G02B6/4232 , G02B6/4292 , H01L25/167 , H01L31/02002 , H01L2224/16225 , H01L2224/48091 , H01L2224/49109 , H01L2224/73253 , H01L2924/15192 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H05K1/184 , H05K3/3405 , H05K3/403 , H05K2201/10121 , H05K2201/10674 , H01L2924/00014 , H01L2924/00
摘要： The present invention includes: photoelectric conversion element 103 that converts electrical signals into optical signals and optical signals into electrical signals; and optical communication LSI 102 electrically connected to photoelectric conversion element 103. Also, the present invention includes electrical wiring substrate 101 including a plurality of electrodes 201 and 202 on which photoelectric conversion element 103 and optical communication LSI 102 are mounted by flip-chip attachment and a plurality of wiring layers 101a, 101b and 101c electrically connecting respective electrodes 201 and 202, wiring layers 101a, 101b and 101c being provided at an upper surface, a lower surface and an inner portion of electrical wiring substrate 101, respectively. Also, electrodes 201 and 202 to which photoelectric conversion element 103 is bonded are provided at a side surface of electrical wiring substrate 101.
摘要翻译：本发明包括：将电信号转换为光信号和光信号的电信号的光电转换元件103; 以及与光电转换元件103电连接的光通信LSI 102.另外，本发明包括电子布线基板101，其包括多个电极201和202，其上通过倒装芯片附接安装光电转换元件103和光通信LSI102，电连接各个电极201和202的多个布线层101a，101b和101c，布线层101a，101b和101c分别设置在电布线基板101的上表面，下表面和内部。而且，在电配线基板101的侧面设置与光电转换元件103接合的电极201和202。

4. 发明授权

US08419295B2 Photoelectric conversion/connection device 失效
标题翻译：光电转换/连接装置
公开(公告)号：US08419295B2
公开(公告)日：2013-04-16
申请号：US12449174
申请日：2008-01-21
申请人： Yuichi Koreeda , Wataru Ohtsu , Mikio Oda , Hisaya Takahashi , Takashi Ohtsuka , Hikaru Kouta , Hideyuki Ono
发明人： Yuichi Koreeda , Wataru Ohtsu , Mikio Oda , Hisaya Takahashi , Takashi Ohtsuka , Hikaru Kouta , Hideyuki Ono
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/4284
摘要： In a photoelectric conversion/connection device (100) including an optical element (320), a mounting board (310) on which the optical element is mounted, and an optical connector (400) which is connected to the mounting board so as to be optically connected to the optical element, the optical connector (400) is arranged on a surface (310a) opposite to a mounting surface (310b) of the mounting board (310) and the optical element (320) is exposed. The photoelectric conversion/connection device (100) includes a motherboard (210) having a main surface (210a) and an electric connector (220) to be mounted on the main surface of the motherboard. The electric connector (220) is detachably connected to the mounting board (310).
摘要翻译：在包括光学元件（320）的光电转换/连接装置（100），安装有光学元件的安装板（310）和连接到安装板的光连接器（400）光连接到光学元件，光连接器（400）布置在与安装板（310）的安装表面（310b）相对的表面（310a）上，并且光学元件（320）被暴露。光电转换/连接装置（100）包括具有主表面（210a）的主板（210）和安装在母板主表面上的电连接器（220）。电连接器（220）可拆卸地连接到安装板（310）。

5. 发明申请

US20100098383A1 PHOTOELECTRIC CONVERSION/CONNECTION DEVICE 失效
标题翻译：光电转换/连接装置
公开(公告)号：US20100098383A1
公开(公告)日：2010-04-22
申请号：US12449174
申请日：2008-01-21
申请人： Yuichi Koreeda , Wataru Ohtsu , Mikio Oda , Hisaya Takahashi , Takashi Ohtsuka , Hikaru Kouta , Hideyuki Ono
发明人： Yuichi Koreeda , Wataru Ohtsu , Mikio Oda , Hisaya Takahashi , Takashi Ohtsuka , Hikaru Kouta , Hideyuki Ono
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/4284
摘要： In a photoelectric conversion/connection device (100) including an optical element (320), a mounting board (310) on which the optical element is mounted, and an optical connector (400) which is connected to the mounting board so as to be optically connected to the optical element, the optical connector (400) is arranged on a surface (310a) opposite to a mounting surface (310b) of the mounting board (310) and the optical element (320) is exposed. The photoelectric conversion/connection device (100) includes a motherboard (210) having a main surface (210a) and an electric connector (220) to be mounted on the main surface of the motherboard. The electric connector (220) is detachably connected to the mounting board (310).
摘要翻译：在包括光学元件（320）的光电转换/连接装置（100），安装有光学元件的安装板（310）和连接到安装板的光连接器（400）光连接到光学元件，光连接器（400）布置在与安装板（310）的安装表面（310b）相对的表面（310a）上，并且光学元件（320）被暴露。光电转换/连接装置（100）包括具有主表面（210a）的主板（210）和安装在母板主表面上的电连接器（220）。电连接器（220）可拆卸地连接到安装板（310）。

6. 发明申请

US20100002999A1 Assembly-type durable optical connector adapter 有权
标题翻译：组装型耐用光连接器适配器
公开(公告)号：US20100002999A1
公开(公告)日：2010-01-07
申请号：US12459647
申请日：2009-07-06
申请人： Naoki Katagiyama , Yuichi Koreeda , Hikaru Kouta , Hisaya Takahashi , Mikio Oda , Hideyuki Ono
发明人： Naoki Katagiyama , Yuichi Koreeda , Hikaru Kouta , Hisaya Takahashi , Mikio Oda , Hideyuki Ono
IPC分类号： G02B6/00
CPC分类号： G02B6/3825 , G02B6/3893
摘要： In an optical connector adapter for use in connecting a first and a second optical connector plug to each other, a second adapter half is butted against a first adapter half in a predetermined direction. The first and second adapter halves have engaging means for maintaining the first and second adapter halves in a butted state in the predetermined direction. The engaging means is configured to be disposed inside the optical connector adapter and to be prevented from releasing engagement thereof by at least one of the first and second optical connector plugs.
摘要翻译：在用于将第一和第二光学连接器插头彼此连接的光学连接器适配器中，第二适配器半部在预定方向上与第一适配器半部对接。第一和第二适配器半部具有接合装置，用于将第一和第二适配器半部在预定方向上保持对接状态。接合装置被配置为设置在光学连接器适配器内部，并且防止其被第一和第二光学连接器插头中的至少一个释放其接合。

7. 发明授权

US08047725B2 Assembly-type durable optical connector adapter 有权
标题翻译：组装型耐用光连接器适配器
公开(公告)号：US08047725B2
公开(公告)日：2011-11-01
申请号：US12459647
申请日：2009-07-06
申请人： Naoki Katagiyama , Yuichi Koreeda , Hikaru Kouta , Hisaya Takahashi , Mikio Oda , Hideyuki Ono
发明人： Naoki Katagiyama , Yuichi Koreeda , Hikaru Kouta , Hisaya Takahashi , Mikio Oda , Hideyuki Ono
IPC分类号： G02B6/38
CPC分类号： G02B6/3825 , G02B6/3893
摘要： In an optical connector adapter for use in connecting a first and a second optical connector plug to each other, a second adapter half is butted against a first adapter half in a predetermined direction. The first and second adapter halves have engaging means for maintaining the first and second adapter halves in a butted state in the predetermined direction. The engaging means is configured to be disposed inside the optical connector adapter and to be prevented from releasing engagement thereof by at least one of the first and second optical connector plugs.
摘要翻译：在用于将第一和第二光学连接器插头彼此连接的光学连接器适配器中，第二适配器半部在预定方向上与第一适配器半部对接。第一和第二适配器半部具有接合装置，用于将第一和第二适配器半部在预定方向上保持对接状态。接合装置被配置为设置在光学连接器适配器内部，并且防止其被第一和第二光学连接器插头中的至少一个释放其接合。

8. 发明申请

US20070164297A1 Optical-element integrated semiconductor integrated circuit and fabrication method thereof 审中-公开
标题翻译：光元件集成半导体集成电路及其制造方法
公开(公告)号：US20070164297A1
公开(公告)日：2007-07-19
申请号：US10584735
申请日：2004-10-14
申请人： Mikio Oda , Hisaya Takahashi , Kaichiro Nakano , Hikaru Kouta , Kohroh Kobayashi
发明人： Mikio Oda , Hisaya Takahashi , Kaichiro Nakano , Hikaru Kouta , Kohroh Kobayashi
IPC分类号： H01L33/00 , H01L31/12 , H01L29/207 , H01L27/15 , H01L29/26
CPC分类号： H01L31/12 , H01L25/167 , H01L2924/0002 , H01L2924/00
摘要： Light-emitting device array 2 is mounted on LSI 1, following which necessary light-emitting devices 2a among two or more light-emitting devices 2 that make up mounted light-emitting device array 2 are allowed to remain and unnecessary light-emitting devices 2a are removed in order to mount light-emitting devices on a plurality of output ports that are randomly arranged on LSI 1.
摘要翻译：发光器件阵列2安装在LSI1上，随后允许保留组成安装的发光器件阵列2的两个或更多个发光器件2中必需的发光器件2a和不必要的发光器件为了将发光装置安装在随机地布置在LSI 1上的多个输出端口上，移除了图2a。

9. 发明授权

US08358892B2 Connection structure of two-dimensional array optical element and optical circuit 失效
标题翻译：二维阵列光学元件和光电路的连接结构
公开(公告)号：US08358892B2
公开(公告)日：2013-01-22
申请号：US11817297
申请日：2006-02-28
申请人： Mikio Oda , Hikaru Kouta , Kaichirou Nakano , Hisaya Takahashi , Kohroh Kobayashi
发明人： Mikio Oda , Hikaru Kouta , Kaichirou Nakano , Hisaya Takahashi , Kohroh Kobayashi
IPC分类号： G02B6/26 , G02B6/42 , G02B6/12
CPC分类号： G02B6/4214 , G02B6/3676 , G02B6/4249 , G02B6/43
摘要： Optical elements (light sources 16 or photodetectors 18) are arranged in a two-dimensional array, and the relative positional relationship between the optical elements and optical waveguides 12 is defined such that optical waveguides 12 extend between the optical elements in the two-dimensional array substantially parallel to substrate 19 for increased parallelism. Micromirrors 15 are disposed in respective optical waveguides 12 to bend light beams through 90 degrees to realize a highly efficient optical coupling between the optical elements and optical waveguides 12. The optical waveguides are stacked in multiple stages, and light beams are lead to the optical waveguides in the multiple stacks through micromirrors 15 across the stacked plane of the optical waveguides, thereby realizing parallel connection between the two-dimensional array of optical elements and a two-dimensional array of optical waveguides. There is thus provided a connection structure between the optical elements and optical waveguides 12, which is small in size and high in efficiency, and is of high parallelism.
摘要翻译：光学元件（光源16或光电检测器18）被布置成二维阵列，并且光学元件和光波导12之间的相对位置关系被限定为使得光波导12在二维阵列中的光学元件之间延伸基本上平行于基板19以增加平行度。微镜15设置在相应的光波导12中以将光束弯曲90度，以实现光学元件和光波导12之间的高效光耦合。光波导以多级堆叠，光束通向光波导在穿过光波导的堆叠平面的微镜15的多个堆叠中，从而实现光学元件的二维阵列与光波导的二维阵列之间的并联连接。因此，在光学元件和尺寸小且效率高的光波导12之间提供了一种连接结构，并且具有高平行度。

10. 发明申请

US20090232443A1 CONNECTION STRUCTURE OF TWO-DIMENSIONAL ARRAY OPTICAL ELEMENT AND OPTICAL CIRCUIT 失效
标题翻译：二维阵列光学元件和光电路的连接结构
公开(公告)号：US20090232443A1
公开(公告)日：2009-09-17
申请号：US11817297
申请日：2006-02-28
申请人： Mikio Oda , Hikaru Kouta , Kaichirou Nakano , Hisaya Takahashi , Kohroh Kobayashi
发明人： Mikio Oda , Hikaru Kouta , Kaichirou Nakano , Hisaya Takahashi , Kohroh Kobayashi
IPC分类号： G02B6/12
CPC分类号： G02B6/4214 , G02B6/3676 , G02B6/4249 , G02B6/43
摘要： Optical elements (light sources 16 or photodetectors 18) are arranged in a two-dimensional array, and the relative positional relationship between the optical elements and optical waveguides 12 is defined such that optical waveguides 12 extend between the optical elements in the two-dimensional array substantially parallel to substrate 19 for increased parallelism. Micromirrors 15 are disposed in respective optical waveguides 12 to bend light beams through 90 degrees to realize a highly efficient optical coupling between the optical elements and optical waveguides 12. The optical waveguides are stacked in multiple stages, and light beams are lead to the optical waveguides in the multiple stacks through micromirrors 15 across the stacked plane of the optical waveguides, thereby realizing parallel connection between the two-dimensional array of optical elements and a two-dimensional array of optical waveguides. There is thus provided a connection structure between the optical elements and optical waveguides 12, which is small in size and high in efficiency, and is of high parallelism.
摘要翻译：光学元件（光源16或光电检测器18）被布置成二维阵列，并且光学元件和光波导12之间的相对位置关系被限定为使得光波导12在二维阵列中的光学元件之间延伸基本上平行于基板19以增加平行度。微镜15设置在相应的光波导12中以将光束弯曲90度，以实现光学元件和光波导12之间的高效光耦合。光波导以多级堆叠，光束通向光波导在穿过光波导的堆叠平面的微镜15的多个堆叠中，从而实现光学元件的二维阵列与光波导的二维阵列之间的并联连接。因此，在光学元件和尺寸小且效率高的光波导12之间提供了一种连接结构，并且具有高平行度。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式