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    • 1. 发明申请
    • Multiple precursor cyclical depositon system
    • 多个前体循环保存系统
    • US20050008779A1
    • 2005-01-13
    • US10913888
    • 2004-08-06
    • Michael YangHyungsuk YoonHui ZhangHongbin FangMing Xi
    • Michael YangHyungsuk YoonHui ZhangHongbin FangMing Xi
    • C23C16/44C23C16/455C23C16/00
    • C23C16/45544C23C16/45531C23C16/45561
    • Embodiments of the present invention relate to an apparatus and method of cyclical deposition utilizing three or more precursors in which delivery of at least two of the precursors to a substrate structure at least partially overlap. One embodiment of depositing a ternary material layer over a substrate structure comprises providing at least one cycle of gases to deposit a ternary material layer. One cycle comprises introducing a pulse of a first precursor, introducing a pulse of a second precursor, and introducing a pulse of a third precursor in which the pulse of the second precursor and the pulse of the third precursor at least partially overlap. In one aspect, the ternary material layer includes, but is not limited to, tungsten boron silicon (WBxSiy), titanium silicon nitride (TiSixNy), tantalum silicon nitride (TaSixNy), silicon oxynitride (SiOxNy), and hafnium silicon oxide (HfSixOy). In one aspect, the composition of the ternary material layer may be tuned by changing the flow ratio of the second precursor to the third precursor between cycles.
    • 本发明的实施方案涉及利用三种或更多种前体的循环沉积的装置和方法,其中至少两种前体至少部分重叠的衬底结构。 在衬底结构上沉积三元材料层的一个实施例包括提供至少一个循环的气体以沉积三元材料层。 一个周期包括引入第一前体的脉冲,引入第二前体的脉冲,以及引入第三前体的脉冲,其中第二前体的脉冲和第三前体的脉冲至少部分重叠。 在一个方面,三元材料层包括但不限于钨硼硅(WBxSiy),氮化硅钛(TiSixNy),氮化钽(TaSixNy),氧氮化硅(SiOxNy)和氧化铪铪(HfSixOy) 。 在一个方面,三元材料层的组成可以通过在循环之间改变第二前体与第三前体的流动比来调节。
    • 2. 发明授权
    • Multiple precursor cyclical deposition system
    • 多前体循环沉积系统
    • US07396565B2
    • 2008-07-08
    • US10913888
    • 2004-08-06
    • Michael Xi YangHyungsuk Alexander YoonHui ZhangHongbin FangMing Xi
    • Michael Xi YangHyungsuk Alexander YoonHui ZhangHongbin FangMing Xi
    • C23C16/40
    • C23C16/45544C23C16/45531C23C16/45561
    • Embodiments of the present invention relate to an apparatus and method of cyclical deposition utilizing three or more precursors in which delivery of at least two of the precursors to a substrate structure at least partially overlap. One embodiment of depositing a ternary material layer over a substrate structure comprises providing at least one cycle of gases to deposit a ternary material layer. One cycle comprises introducing a pulse of a first precursor, introducing a pulse of a second precursor, and introducing a pulse of a third precursor in which the pulse of the second precursor and the pulse of the third precursor at least partially overlap. In one aspect, the ternary material layer includes, but is not limited to, tungsten boron silicon (WBxSiy), titanium silicon nitride (TiSixNy), tantalum silicon nitride (TaSixNy), silicon oxynitride (SiOxNy), and hafnium silicon oxide (HfSixOy). In one aspect, the composition of the ternary material layer may be tuned by changing the flow ratio of the second precursor to the third precursor between cycles.
    • 本发明的实施方案涉及利用三种或更多种前体的循环沉积的装置和方法,其中至少两种前体至少部分重叠的衬底结构。 在衬底结构上沉积三元材料层的一个实施例包括提供至少一个循环的气体以沉积三元材料层。 一个周期包括引入第一前体的脉冲,引入第二前体的脉冲,以及引入第三前体的脉冲,其中第二前体的脉冲和第三前体的脉冲至少部分重叠。 在一个方面,三元材料层包括但不限于钨硼硅(W x Si x Si x Si x Si x Si x Si x Si x Si x Si x Si x Si x Si x Si x Si x <<) (TaSi x N y),氮化硅(TaSi x N y N y),氮氧化硅(SiO 2) N x Y)和氧化铪氧化铪(HfSi x O y y)。 在一个方面,三元材料层的组成可以通过在循环之间改变第二前体与第三前体的流动比来调节。
    • 3. 发明授权
    • Multiple precursor cyclical deposition system
    • 多前体循环沉积系统
    • US06846516B2
    • 2005-01-25
    • US10118605
    • 2002-04-08
    • Michael Xi YangHyungsuk Alexander YoonHui ZhangHongbin FangMing Xi
    • Michael Xi YangHyungsuk Alexander YoonHui ZhangHongbin FangMing Xi
    • C23C16/44C23C16/455C23C16/40
    • C23C16/45544C23C16/45531C23C16/45561
    • Embodiments of the present invention relate to an apparatus and method of cyclical deposition utilizing three or more precursors in which delivery of at least two of the precursors to a substrate structure at least partially overlap. One embodiment of depositing a ternary material layer over a substrate structure comprises providing at least one cycle of gases to deposit a ternary material layer. One cycle comprises introducing a pulse of a first precursor, introducing a pulse of a second precursor, and introducing a pulse of a third precursor in which the pulse of the second precursor and the pulse of the third precursor at least partially overlap. In one aspect, the ternary material layer includes, but is not limited to, tungsten boron silicon (WBxSiy), titanium silicon nitride (TiSixNy), tantalum silicon nitride (TaSixNy), silicon oxynitride (SiOxNy), and hafnium silicon oxide (HfSixOy). In one aspect, the composition of the ternary material layer may be tuned by changing the flow ratio of the second precursor to the third precursor between cycles.
    • 本发明的实施方案涉及利用三种或更多种前体的循环沉积的装置和方法,其中至少两种前体至少部分重叠的衬底结构。 在衬底结构上沉积三元材料层的一个实施例包括提供至少一个循环的气体以沉积三元材料层。 一个周期包括引入第一前体的脉冲,引入第二前体的脉冲,以及引入第三前体的脉冲,其中第二前体的脉冲和第三前体的脉冲至少部分重叠。 在一个方面,三元材料层包括但不限于钨硼硅(WBxSiy),氮化硅钛(TiSixNy),氮化钽(TaSixNy),氧氮化硅(SiOxNy)和氧化铪铪(HfSixOy) 。 在一个方面,三元材料层的组成可以通过在循环之间改变第二前体与第三前体的流动比来调节。
    • 4. 发明申请
    • SYSTEM AND METHOD FOR FORMING AN INTEGRATED BARRIER LAYER
    • 用于形成集成障碍层的系统和方法
    • US20110100295A1
    • 2011-05-05
    • US12987962
    • 2011-01-10
    • Ming XiMichael YangHui Zhang
    • Ming XiMichael YangHui Zhang
    • C23C16/52C23C16/455
    • H01L21/76846H01L21/28562H01L28/75H01L28/84H01L28/90
    • An apparatus for processing a substrate is provided. The apparatus includes a process chamber, and a dual-mode gas distribution plate disposed within the process chamber. The dual-mode gas distribution plate comprises a first gas distribution zone disposed in a center of the gas distribution plate, and a second gas distribution zone surrounding the first gas distribution zone, the second gas distribution zone being fluidly isolated from the first gas distribution zone, wherein the first gas distribution zone is coupled to a valve system to deliver sequential pulses of a first gas to the first gas distribution zone to perform a cyclical deposition process, and the second gas distribution zone is in communication with a flow controller to deliver a second gas to perform a chemical vapor deposition process.
    • 提供了一种用于处理衬底的设备。 该装置包括处理室和设置在处理室内的双模气体分配板。 双模式气体分配板包括设置在气体分配板的中心的第一气体分配区和围绕第一气体分配区的第二气体分配区,第二气体分配区与第一气体分配区流体隔离 ,其中所述第一气体分配区域联接到阀系统以将第一气体的顺序脉冲输送到所述第一气体分配区域以执行循环沉积过程,并且所述第二气体分配区域与流量控制器连通以递送 第二气体进行化学气相沉积工艺。