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1. 发明授权

US07280342B1 Low inductance high ESR capacitor 有权
标题翻译：低电感高ESR电容
公开(公告)号：US07280342B1
公开(公告)日：2007-10-09
申请号：US11639796
申请日：2006-12-15
申请人： Michael S. Randall , Allen Hill , Peter Blais , Garry Renner , Randal Vaughan , Azizuddin Tajuddin
发明人： Michael S. Randall , Allen Hill , Peter Blais , Garry Renner , Randal Vaughan , Azizuddin Tajuddin
IPC分类号： H01G4/005 , H01G4/06 , H01G4/228
CPC分类号： H01G4/232 , H01G4/30
摘要： A low inductance multi-layer capacitor. The capacitor comprises interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate comprises two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.
摘要翻译：低电感多层电容器。电容器包括交错并联的内部电极板，其间具有电介质。每个内部电极板包括两个引出片，并且通常为T形。第一外部电极端子电连接到偶数内部电极板的引出接线片，第二外部电极端子电连接到奇数内部电极板的引出接线片。外部电极端子位于电容器的公共第一外表面和公共相对的第二外表面上。

2. 发明申请

US20070165361A1 Low inductance high ESR capacitor 有权
公开(公告)号：US20070165361A1
公开(公告)日：2007-07-19
申请号：US11639796
申请日：2006-12-15
申请人： Michael S. Randall , Allen Hill , Peter Blais , Garry Renner , Randal Vaughan , Azizuddin Tajuddin
发明人： Michael S. Randall , Allen Hill , Peter Blais , Garry Renner , Randal Vaughan , Azizuddin Tajuddin
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/30
摘要： A low inductance multi-layer capacitor. The capacitor comprises interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate comprises two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.

3. 发明申请

US20080236717A1 PROCESS OF MANUFACTURING A MULTILAYER DEVICE AND DEVICE MANUFACTURED THEREBY 审中-公开
标题翻译：制造多层设备的方法及其制造的设备
公开(公告)号：US20080236717A1
公开(公告)日：2008-10-02
申请号：US12116526
申请日：2008-05-07
申请人： Abhijit Gurav , Azizuddin Tajuddin , Daniel Skamser , Garry Renner , March Maguire , Michael S. Randall , Randal Vaughan
发明人： Abhijit Gurav , Azizuddin Tajuddin , Daniel Skamser , Garry Renner , March Maguire , Michael S. Randall , Randal Vaughan
IPC分类号： B29C65/00
CPC分类号： H01G4/0085 , H01G4/12 , H01G4/30 , Y10T156/10
摘要： A process for forming a multilayer ceramic capacitor. The process includes depositing a ceramic precursor on a substrate and an electrode ink in a predetermined pattern on the ceramic precursor to form a green sheet. The electrode ink has an adhesion promoter incorporated therein. The green sheet is overlayed with at least one second green sheet to form a layered green sheet which is then fused under pressure.
摘要翻译：一种形成多层陶瓷电容器的工艺。该方法包括将陶瓷前体沉积在基底上，并在陶瓷前体上以预定图案沉积电极墨以形成生片。电极油墨具有并入其中的粘合促进剂。生片与至少一个第二生片重叠以形成分层的生片，然后在压力下熔融。

4. 发明授权

US08717774B2 Electronic passive device 有权
标题翻译：电子无源器件
公开(公告)号：US08717774B2
公开(公告)日：2014-05-06
申请号：US13292267
申请日：2011-11-09
申请人： Michael S. Randall , Garry Renner , John D. Prymak , Azizuddin Tajuddin
发明人： Michael S. Randall , Garry Renner , John D. Prymak , Azizuddin Tajuddin
IPC分类号： H05K7/00
CPC分类号： H01L23/50 , H01L23/642 , H01L2924/0002 , H01L2924/19103 , H01L2924/3011 , H01L2924/00
摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.
摘要翻译：描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。插入器具有第一平面和第二平面。上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。提供至少一个馈电电容器。电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。

5. 发明申请

US20120081870A1 ELECTRONIC PASSIVE DEVICE 有权
标题翻译：电子被动设备
公开(公告)号：US20120081870A1
公开(公告)日：2012-04-05
申请号：US13292267
申请日：2011-11-09
申请人： Michael S. Randall , Garry Renner , John D. Prymak , Azizuddin Tajuddin
发明人： Michael S. Randall , Garry Renner , John D. Prymak , Azizuddin Tajuddin
IPC分类号： H01R12/70
CPC分类号： H01L23/50 , H01L23/642 , H01L2924/0002 , H01L2924/19103 , H01L2924/3011 , H01L2924/00
摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.
摘要翻译：描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。插入器具有第一平面和第二平面。上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。提供至少一个馈电电容器。电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。

6. 发明申请

US20080192452A1 Passive electronic device 审中-公开
标题翻译：被动电子设备
公开(公告)号：US20080192452A1
公开(公告)日：2008-08-14
申请号：US11705260
申请日：2007-02-12
申请人： Michael S. Randall , Garry Renner , John D. Prymak , Azizuddin Tajuddin
发明人： Michael S. Randall , Garry Renner , John D. Prymak , Azizuddin Tajuddin
IPC分类号： H05K7/00 , H05K1/16
CPC分类号： H05K1/0231 , H01L23/49827 , H01L23/50 , H01L2224/16225 , H01L2924/3011 , H05K1/141 , H05K2201/10378 , H05K2201/10704 , H05K2201/10734
摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.
摘要翻译：描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。插入器具有第一平面和第二平面。上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。提供至少一个电容器。电容器具有多个平行板，其间具有电介质。至少一个第一外部端接件与第一组交替的平行板电接触，并且至少一个第二外部端接件与第二组交替的平行板电接触。电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。

7. 发明授权

US08111524B2 Electronic passive device 有权
标题翻译：电子无源器件
公开(公告)号：US08111524B2
公开(公告)日：2012-02-07
申请号：US12526426
申请日：2008-02-12
申请人： Michael S. Randall , Garry Renner , John D. Prymak , Azizuddin Tajuddin
发明人： Michael S. Randall , Garry Renner , John D. Prymak , Azizuddin Tajuddin
IPC分类号： H05K3/00
CPC分类号： H05K1/0231 , H01L23/49827 , H01L23/50 , H01L2224/16225 , H01L2924/3011 , H05K1/141 , H05K2201/10378 , H05K2201/10704 , H05K2201/10734
摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.
摘要翻译：描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。插入器具有第一平面和第二平面。上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。提供至少一个馈电电容器。电容器具有多个平行板，其间具有电介质。至少一个第一外部端接件与第一组交替的平行板电接触，并且至少一个第二外部端接件与第二组交替的平行板电接触。电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。

8. 发明申请

US20080123247A1 Interposer decoupling array having reduced electrical shorts 失效
标题翻译：具有减小的电气短路的内插器去耦阵列
公开(公告)号：US20080123247A1
公开(公告)日：2008-05-29
申请号：US11604409
申请日：2006-11-27
申请人： Michael S. Randall , Garry Renner
发明人： Michael S. Randall , Garry Renner
IPC分类号： H01G4/232
CPC分类号： H01G4/232 , H01G4/35 , H01L27/0805 , H05K1/0231
摘要： A capacitor array with a multiplicity of capacitors with terminations of alternating polarity wherein the terminations are arranged in M columns and N rows. A circuit is provided with terminations in a grid of L columns and K rows wherein the terminations are of alternating polarity with the proviso that a first terminal with L={acute over (α)}M has the same polarity as a second terminal with L={acute over (α)}M+1 wherein {acute over (α)} is an integer.
摘要翻译：具有多个具有交替极性终端的电容器的电容器阵列，其中终端排列成M列和N行。电路具有L列和K列的栅格中的终端，其中端子具有交替极性，条件是具有L =αM的第一端子具有与具有L =αM+ 1的第二端子相同的极性，其中α为一个整数。

9. 发明授权

US07545623B2 Interposer decoupling array having reduced electrical shorts 失效
标题翻译：具有减小的电气短路的内插器去耦阵列
公开(公告)号：US07545623B2
公开(公告)日：2009-06-09
申请号：US11604409
申请日：2006-11-27
申请人： Michael S. Randall , Garry Renner
发明人： Michael S. Randall , Garry Renner
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/35 , H01L27/0805 , H05K1/0231
摘要： A capacitor array with a multiplicity of capacitors with terminations of alternating polarity wherein the terminations are arranged in M columns and N rows. A circuit is provided with terminations in a grid of L columns and K rows wherein the terminations are of alternating polarity with the proviso that a first terminal with L={acute over (α)}M has the same polarity as a second terminal with L={acute over (α)}M+1 wherein {acute over (α)} is an integer.
摘要翻译：具有多个具有交替极性终端的电容器的电容器阵列，其中终端排列成M列和N行。电路具有L列和K列的栅格中的终端，其中终端具有交替极性，条件是具有L = {急于（α）} M的第一端具有与具有L的第二端相同的极性 = {acute over（alpha）} M + 1其中{acute over（alpha）}是一个整数。

10. 发明授权

US08331078B2 Leaded multi-layer ceramic capacitor with low ESL and low ESR 有权
标题翻译：具有低ESL和低ESR的带铅多层陶瓷电容器
公开(公告)号：US08331078B2
公开(公告)日：2012-12-11
申请号：US12732549
申请日：2010-03-26
申请人： John E. McConnell , Reggie Phillips , Alan P. Webster , John Bultitude , Mark R. Laps , Lonnie G. Jones , Garry Renner
发明人： John E. McConnell , Reggie Phillips , Alan P. Webster , John Bultitude , Mark R. Laps , Lonnie G. Jones , Garry Renner
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G2/065 , H01G4/232 , H05K3/3426
摘要： A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates and said second base metal plates and the dielectric has a first coefficient of thermal expansion. A first termination is in electrical contact with the first plates and a second termination is in electrical contact with the second plates. Lead frames are attached to, and in electrical contact with, the terminations wherein the lead frames have a second coefficient of thermal expansion and the second coefficient of thermal expansion is higher than said first coefficient of thermal expansion. The lead frame is a non-ferrous material.
摘要翻译：一种多层陶瓷电容器，其具有至少一个芯片，并且具有平行隔开的关系的第一基底金属板和平行隔开的关系的第二基底金属板，其中第一板和第二板被交错。电介质位于第一基底金属板和第二基底金属板之间，电介质具有第一热膨胀系数。第一端接件与第一板电接触，第二端接件与第二板电接触。引线框架连接到端子处并与其接触，其中引线框架具有第二热膨胀系数，并且第二热膨胀系数高于所述第一热膨胀系数。引线框架是有色金属材料。

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