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    • 2. 发明授权
    • Wafer rotation in semiconductor processing
    • 晶圆在半导体加工中旋转
    • US06622111B1
    • 2003-09-16
    • US09521046
    • 2000-03-08
    • Michael R. ConboyElfido Coss, Jr.Sam H. Allen, Jr.
    • Michael R. ConboyElfido Coss, Jr.Sam H. Allen, Jr.
    • G01C1918
    • H01L21/67276
    • The movement of individual wafers in a semiconductor facility is tracked via a set of coordinates that include rotational points of reference on the wafer that coincide with the wafer's location in the processing line. In an example embodiment, the method includes imparting angles of rotation on the wafers in different stages of the processing system. The different angles of rotation on each wafer are collected as data along with the wafer location in the processing system and the tool/equipment identification code. The combined angle of rotation and wafer location data is used to map the path the wafer has traveled from the onset of processing. An important advantage of the invention is the increased control and traceability that the invention brings to wafer processing.
    • 单个晶片在半导体设备中的移动通过一组坐标来跟踪,该坐标系包括与晶片在处理线中的位置一致的晶片上的旋转参考点。 在示例性实施例中,该方法包括在处理系统的不同阶段在晶片上施加旋转角度。 每个晶片上的不同旋转角度作为数据以及处理系统中的晶片位置和工具/设备识别码被收集。 组合的旋转角度和晶片位置数据用于映射晶片从处理开始行进的路径。 本发明的一个重要优点是本发明对晶片处理带来的增加的控制和可追溯性。
    • 3. 发明授权
    • Method of dynamically enabling additional sensors based upon initial sensor data, and system for accomplishing same
    • 基于初始传感器数据动态启用附加传感器的方法,以及用于实现其的系统
    • US06792389B1
    • 2004-09-14
    • US10060455
    • 2002-01-30
    • Sam H. Allen, Jr.Elfido Coss, Jr.Michael R. Conboy
    • Sam H. Allen, Jr.Elfido Coss, Jr.Michael R. Conboy
    • G06F1132
    • H01L21/67253G05B23/0227
    • The present invention is generally directed to method of dynamically enabling additional sensors based upon initial sensor data, and a system for accomplishing same. In one illustrative embodiment, the method comprises initiating a process operation in a process tool, determining if an abnormal process event has occurred in the process operation based upon data sensed by at least one control sensor, enabling at least one additional sensor to acquire additional data related to the process operation if an abnormal process event is determined to have occurred and obtaining data from the enabled additional sensor. In another illustrative embodiment, the present invention is directed to a system that comprises a process tool adapted to perform a process operation, at least one control sensor adapted to sense a parameter indicative of the process operation performed in the process tool and a controller for receiving data from the at least one control sensor and determining if an abnormal process event has occurred based upon the data, the controller further adapted to enable at least one additional sensor adapted to acquire additional data related to the process operation if an abnormal process event has occurred.
    • 本发明一般涉及基于初始传感器数据动态地实现附加传感器的方法,以及用于实现其的系统。 在一个说明性实施例中,该方法包括在过程工具中启动过程操作,基于由至少一个控制传感器感测到的数据来确定在处理操作中是否发生异常过程事件,使至少一个附加传感器能够获取附加数据 如果确定发生异常处理事件并从启用的附加传感器获取数据,则与过程操作相关。 在另一个说明性实施例中,本发明涉及一种系统,其包括适于执行处理操作的处理工具,适于感测指示在处理工具中执行的处理操作的参数的至少一个控制传感器和用于接收 来自所述至少一个控制传感器的数据,以及基于所述数据确定是否发生异常过程事件,所述控制器还适于使得至少一个附加传感器适于在发生异常处理事件时获取与所述过程操作相关的附加数据 。
    • 5. 发明授权
    • Method and apparatus for determining wafer identity and orientation
    • 用于确定晶片同一性和取向的方法和装置
    • US06666337B1
    • 2003-12-23
    • US09782843
    • 2001-02-14
    • Michael R. ConboySam H. Allen, Jr.Elfido Coss, Jr.
    • Michael R. ConboySam H. Allen, Jr.Elfido Coss, Jr.
    • B07C500
    • H01L23/544H01L2223/54406H01L2223/54493H01L2924/0002H01L2924/3511H01L2924/00
    • A system for identifying wafers contained in a wafer carrier includes a wafer sorter. Each wafer includes a surface terminating in an edge and a plurality of sector identification codes disposed on the surface proximate the edge. The wafer sorter is adapted to scan at least a portion of a wafer extending from the carrier and to identify at least one of the sector identification codes on the wafer independent of the orientation of the wafer in the wafer carrier. A method for identifying wafers contained in a wafer carrier is provided. Each wafer includes a surface terminating in an edge and a plurality of sector identification codes disposed on the surface proximate the edge. The method includes scanning at least a portion of a wafer extending from the carrier and identifying at least one of the sector identification codes on the wafer independent of the orientation of the wafer in the wafer carrier.
    • 用于识别包含在晶片载体中的晶片的系统包括晶片分选器。 每个晶片包括终止于边缘的表面和设置在靠近边缘的表面上的多个扇区识别代码。 晶片分选器适于扫描从载体延伸的晶片的至少一部分,并且在晶片载体上独立于晶片的取向来识别晶片上的扇区识别码中的至少一个。 提供了一种用于识别包含在晶片载体中的晶片的方法。 每个晶片包括终止于边缘的表面和设置在靠近边缘的表面上的多个扇区识别代码。 该方法包括扫描从载体延伸的晶片的至少一部分,并且在晶片载体上独立于晶片的取向来识别晶片上的扇区识别码中的至少一个。
    • 8. 发明授权
    • Wafer rotation randomization in cluster tool processing
    • 晶圆旋转随机化在群集工具处理中
    • US06662070B1
    • 2003-12-09
    • US09520483
    • 2000-03-08
    • Michael R. ConboySam H. Allen, Jr.Russel ShirleyElfido Coss, Jr.
    • Michael R. ConboySam H. Allen, Jr.Russel ShirleyElfido Coss, Jr.
    • G06F1900
    • H01L21/67276H01L21/67259
    • The detection of a processing deviation in a cluster tool of a wafer processing system is achieved by assigning individual wafers a set of positional coordinates each time the wafer moves within the cluster tool. In an example embodiment, a wafer is placed into a first chamber of the cluster tool and it is rotated to a certain angle of rotation. Each time the wafer moves within the cluster tool the wafer is given a different angle of rotation; both the rotation angle and the wafer location are then recorded as a set of positional coordinates. The wafer exits the cluster tool and is examined for structural or surface defects that indicate that there was a variation in the processing parameters. A wafer movement map is developed from the positional coordinates and the map is then used as an analysis tool to identify the processing location that caused defect to occur. An important advantage is the increased control and traceability that the tracking method brings to single wafer handling and processing.
    • 晶片处理系统的集群工具中的处理偏差的检测是通过每次晶片在集群工具内移动时分配一组位置坐标来实现的。 在示例性实施例中,将晶片放置在群集工具的第一室中,并将其旋转到一定的旋转角度。 每次晶片在集群工具内移动时,晶片都有不同的旋转角度; 然后将旋转角度和晶片位置两者记录为一组位置坐标。 晶片离开集群工具,并检查表明处理参数有变化的结构或表面缺陷。 从位置坐标开发晶片移动图,然后将该图用作分析工具,以识别导致缺陷发生的处理位置。 一个重要的优点是跟踪方法对单晶片处理和处理带来的增加的控制和可追溯性。
    • 9. 发明授权
    • Wafer rotation randomization for process defect detection in semiconductor fabrication
    • 半导体制造中的工艺缺陷检测的晶圆旋转随机化
    • US06625556B1
    • 2003-09-23
    • US09521047
    • 2000-03-08
    • Michael R. ConboySam H. Allen, Jr.Elfido Coss, Jr.
    • Michael R. ConboySam H. Allen, Jr.Elfido Coss, Jr.
    • G01C1918
    • H01L22/20
    • The detection of a processing deviation in a multiple stage wafer processing system is achieved by assigning individual wafers a set of positional coordinates each time the wafer moves within the wafer processing system. In an example embodiment, a wafer is placed into a first processing stage and it is rotated to a certain angle of rotation. As the wafer moves from one processing stage to another the wafer is given a different angle of rotation; both the rotation angle and the wafer location are then recorded as a set of positional coordinates. The processed wafer is examined for surface deviations arising from variations in the processing parameters. The positional coordinates are used to develop a wafer movement map that aids in identifying the processing stage location where the deviation in the processing parameters occurred. An important advantage is the increased processing deviation traceability that the method brings to wafer processing.
    • 多晶片处理系统中的处理偏差的检测是通过每次晶片在晶片处理系统内移动时分配单独的晶片一组位置坐标来实现的。 在示例性实施例中,将晶片放置在第一处理台中并将其旋转到一定的旋转角度。 当晶片从一个处理阶段移动到另一个处理阶段时,晶片被给予不同的旋转角度; 然后将旋转角度和晶片位置两者记录为一组位置坐标。 检查经处理的晶片是否因处理参数的变化而产生的表面偏差。 位置坐标用于开发晶片移动图,其帮助识别出现处理参数偏差的处理阶段位置。 一个重要的优点是该方法对晶圆加工带来的加工偏差可追溯性增加。