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1. 发明授权

US5281447A Patterned deposition of metals via photochemical decomposition of metal-oxalate complexes 失效
标题翻译：通过金属 - 草酸盐络合物的光化学分解形成金属沉积
公开(公告)号：US5281447A
公开(公告)日：1994-01-25
申请号：US783054
申请日：1991-10-25
申请人： Michael J. Brady , Stephen L. Buchwalter , Richard J. Gambino , Martin J. Goldberg , Kam L. Lee , Alfred Viehbeck
发明人： Michael J. Brady , Stephen L. Buchwalter , Richard J. Gambino , Martin J. Goldberg , Kam L. Lee , Alfred Viehbeck
IPC分类号： C23C18/14 , G03C5/58 , G03F7/004 , G03F7/26 , H05K3/10 , B05D3/06 , B05D5/12
CPC分类号： C23C18/14 , C23C18/1608 , C23C18/1612 , C23C18/204 , C23C18/208 , C23C18/30 , G03C5/58 , G03F7/0047 , G03F7/265 , H05K3/105 , H05K2203/056 , H05K2203/121
摘要： The invention is directed to a method for forming a metal coating on a substrate by applying an oxalate of a Group VIII element from the Periodic Table of the Elements to the substrate. The oxalate is selected so that it will decompose to a complex of a zero valent Group VIII element or a Group VIII element on exposure to an energy source. Microelectronic circuits, etch masks or metal contacts on superconductors can be formed by the method when the oxalate coating is exposed to an energy source through a mask or the energy source beamed at the oxalate to trace a pattern on it.The metal thus obtained can be subsequently coated by electroless compositions especially where the Group VIII element is a catalyst for electroless coatings such as palladium. Additionally, the metal coating may be coated by an electrolytic composition.Through hole plating can also be achieved by applying the oxalates of a Group VIII element in the through hole of a circuit board followed by exposure to an energy source optionally followed by the application of an electroless and/or electrolytic metal composition.
摘要翻译：本发明涉及一种通过将元素周期表中第VIII族元素的草酸盐施用到基材上而在基材上形成金属涂层的方法。选择草酸盐，使其在暴露于能量源时将分解成零价VIII族元素或VIII族元素的络合物。当通过掩模将草酸盐涂层暴露于能量源或者在草酸盐上辐射的能量源来追踪其上的图案时，可以通过该方法形成微电子电路，超导体上的金属接触或金属接触。由此获得的金属可以随后通过无电组合物涂覆，特别是其中VIII族元素是无电镀涂层如钯的催化剂。此外，金属涂层可以由电解组合物涂覆。也可以通过将VIII族元素的草酸盐施加到电路板的通孔中，然后暴露于能量源，随后施加无电解和/或电解金属组合物来实现通孔电镀。

2. 发明授权

US5179467A Charge transfer salts and uses thereof 失效
标题翻译：电荷转移盐及其用途
公开(公告)号：US5179467A
公开(公告)日：1993-01-12
申请号：US583888
申请日：1990-09-17
申请人： Stephen L. Buchwalter , Martin J. Goldberg , Revathi Iyengar , Terrence R. O'Toole , Alfred Viehbeck
发明人： Stephen L. Buchwalter , Martin J. Goldberg , Revathi Iyengar , Terrence R. O'Toole , Alfred Viehbeck
IPC分类号： C09K9/02 , H01B1/12
CPC分类号： H01B1/121 , C09K9/02 , H01B1/12
摘要： An electrochemical color change cell incorporating as a color changing agent intramolecular charge transfer salt or an intermolecular charge transfer salt. The intermolecular charge transfer salts and the intramolecular charge transfer salts have a plurality of oxidation states and a wide variation in color change. The intermolecular and intramolecular charge transfer salts preferably contain a violene moiety and a moiety having a carbonyl group conjugated to an aromatic moiety. The intramolecular charge transfer salts have a stable covalent radical-anion/radical-cation configuration. The intermolecular charge transfer salts have a stable ionic radical-anion/radical-cation configuration.
摘要翻译：一种结合作为变色剂分子内电荷转移盐或分子内电荷转移盐的电化学变色细胞。分子间电荷转移盐和分子内电荷转移盐具有多种氧化态和颜色变化的广泛变化。分子间和分子内电荷转移盐优选含有突出部分和具有与芳族部分结合的羰基的部分。分子内电荷转移盐具有稳定的共价自由基 - 阴离子/自由基 - 阳离子配置。分子间电荷转移盐具有稳定的离子自由基 - 阴离子/自由基 - 阳离子配置。

3. 发明授权

US5563273A Covalent compound having a radical-cationic moiety covalently linked to a radical anionicmoiety 失效
标题翻译：共价化合物具有与自由基阴离子性共价连接的自由基 - 阳离子部分
公开(公告)号：US5563273A
公开(公告)日：1996-10-08
申请号：US193921
申请日：1994-02-09
申请人： Stephen L. Buchwalter , Martin J. Goldberg , Revathi Iyengar , Terrence R. O'Toole , Alfred Viehbeck
发明人： Stephen L. Buchwalter , Martin J. Goldberg , Revathi Iyengar , Terrence R. O'Toole , Alfred Viehbeck
IPC分类号： G02F1/15 , C09K9/00 , C09K9/02 , G09F9/30 , G09G3/38 , H01B1/12 , C07D213/22 , C07D487/02
CPC分类号： H01B1/12 , C09K9/02 , H01B1/121
摘要： An electrochemical color change cell incorporating as a color changing agent intramolecular charge transfer salt or an intermolecular charge transfer salt. The intermolecular charge transfer salts and the intramolecular charge transfer salts have a plurality of oxidation states and a wide variation in color change. The intermolecular and intramolecular charge transfer salts preferably contain a violene moiety and a moiety having a carbonyl group conjugated to an aromatic moiety. The intramolecular charge transfer salts have a stable covalent radical-anion/radical-cation configuration. The intermolecular charge transfer salts have a stable ionic radical-anion/radical-cation configuration.
摘要翻译：一种结合作为变色剂分子内电荷转移盐或分子内电荷转移盐的电化学变色细胞。分子间电荷转移盐和分子内电荷转移盐具有多种氧化态和颜色变化的广泛变化。分子间和分子内电荷转移盐优选含有突出部分和具有与芳族部分结合的羰基的部分。分子内电荷转移盐具有稳定的共价自由基 - 阴离子/自由基 - 阳离子配置。分子间电荷转移盐具有稳定的离子自由基 - 阴离子/自由基 - 阳离子配置。

4. 发明授权

US5135779A Method for conditioning an organic polymeric material 失效
标题翻译：调理有机聚合物材料的方法
公开(公告)号：US5135779A
公开(公告)日：1992-08-04
申请号：US705556
申请日：1991-05-24
申请人： Alfred Viehbeck , Stephen L. Buchwalter , Martin J. Goldberg , Caroline A. Kovac , Stephen L. Tisdale
发明人： Alfred Viehbeck , Stephen L. Buchwalter , Martin J. Goldberg , Caroline A. Kovac , Stephen L. Tisdale
IPC分类号： C23C18/16 , C23C18/28 , H05K3/38
CPC分类号： H05K3/381 , C23C18/1608 , C23C18/2086 , C23C18/30 , C23C18/31
摘要： Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.
摘要翻译：某些有机聚合材料能够可逆地接受或捐赠来自还原剂的电子。聚合物中的氧化还原位点接受电子，结果发生聚合物的性质变化。该改变可用于改性或蚀刻聚合物材料。可以通过在受控的深度将金属种子并入材料中来修饰材料。种子通过金属阳离子与聚合物中的氧化还原位点的相互作用而引入，这导致阳离子还原形成中性金属种子。随后将含有种子的聚合材料暴露于无电镀浴中，导致具有对聚合物材料具有良好粘附性的所需特性的金属的进一步沉积。聚合物材料的蚀刻可以作为聚合物在非质子传递溶剂中当其氧化还原位点已经接受电子时的溶解度增加的结果进行。增加的溶解度允许在已经还原的聚合物材料的某些区域中蚀刻开口，留下其它区域不变。

5. 发明授权

US5242713A Method for conditioning an organic polymeric material 失效
标题翻译：用于调节有机聚合材料的方法
公开(公告)号：US5242713A
公开(公告)日：1993-09-07
申请号：US290486
申请日：1988-12-23
申请人： Alfred Viehbeck , Stephen L. Buchwalter , William A. Donson , John J. Glenning , Martin J. Goldberg , Kurt R. Grebe , Caroline A. Kovac , Linda C. Matthew , Walter P. Pawlowski , Mark J. Schadt , Michael R. Scheuermann , Stephen L. Tisdale
发明人： Alfred Viehbeck , Stephen L. Buchwalter , William A. Donson , John J. Glenning , Martin J. Goldberg , Kurt R. Grebe , Caroline A. Kovac , Linda C. Matthew , Walter P. Pawlowski , Mark J. Schadt , Michael R. Scheuermann , Stephen L. Tisdale
IPC分类号： C23C18/20 , C08J5/12 , C08J7/00 , C23C18/16 , C23C18/28 , H05K3/38
CPC分类号： C23C18/1608 , C23C18/166 , C23C18/2086 , C23C18/28 , C23C18/30 , H05K3/381 , Y10S525/903
摘要： Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.

6. 发明授权

US5187241A Isoimide modifications of a polyimide and reaction thereof with nucleophiles 失效
标题翻译：聚酰亚胺的异构酰亚胺改性物和与亲核试剂的反应
公开(公告)号：US5187241A
公开(公告)日：1993-02-16
申请号：US770506
申请日：1991-10-03
申请人： Stephen L. Buchwalter , Ernest R. Frank , Terrence R. O'Toole , Richard R. Thomas , Alfred Viehbeck
发明人： Stephen L. Buchwalter , Ernest R. Frank , Terrence R. O'Toole , Richard R. Thomas , Alfred Viehbeck
IPC分类号： C08G73/06 , C08G73/10 , C08J7/12 , C23C18/22 , G03F7/038 , H05K3/38
CPC分类号： C08J7/12 , C08G73/1089 , C23C18/22 , H05K3/381 , C08J2379/08
摘要： The invention relates to the formation of isoimides from amic acids, especially polyisoimides by a novel process in which polyimides are first converted to polyamic acids and then contacted with an isoimidizing agent. An acyl halide of a heterocyclic nitrogen compound or an acyl halide of a heterocyclic sulphur compound can be used as the isoimidizing agent. The isoimidization may also be carried out in the presence of a compound containing a heterocyclic nitrogen especially a solvent containing a heterocyclic nitrogen.The invention is especially applicable to conducting nucleophilic addition reactions on the surface of polyimides where the surface has been converted to a polyamic acid or on the surface of polyamic acid materials followed by isoimidization and reaction of the isoimide with a nucleophile such as an amine or organic hydroxy compound.Photosensitive metal compounds or electroless metal coating catalysts can be coordinated with the compositions obtained.
摘要翻译：本发明涉及通过一种新方法从酰胺酸，特别是聚酰亚胺形成异酰亚胺，其中首先将聚酰亚胺转化为聚酰胺酸，然后与异氰酸酯接触。可以使用杂环氮化合物的酰卤或杂环硫化合物的酰卤作为异亚胺化剂。异氰酰化还可以在含有杂环氮的化合物，特别是含有杂环氮的溶剂的存在下进行。本发明特别适用于在表面已转化为聚酰胺酸或聚酰胺酸物质表面的聚酰亚胺的表面上进行亲核加成反应，随后异亚胺化和异亚胺与亲核试剂例如胺或有机物的反应羟基化合物。感光金属化合物或无电镀金属涂层催化剂可以与获得的组合物配位。

7. 发明授权

US5462628A Method for bonding two surfaces together 失效
标题翻译：将两个表面粘合在一起的方法
公开(公告)号：US5462628A
公开(公告)日：1995-10-31
申请号：US232417
申请日：1994-04-25
申请人： Alfred Viehbeck , Martin Goldberg , Stephen L. Tisdale , Stephen L. Buchwalter , Kurt R. Grebe , Caroline A. Kovac , Linda C. Matthew
发明人： Alfred Viehbeck , Martin Goldberg , Stephen L. Tisdale , Stephen L. Buchwalter , Kurt R. Grebe , Caroline A. Kovac , Linda C. Matthew
IPC分类号： C23C18/20 , C08J5/12 , C08J7/00 , C23C18/16 , C23C18/28 , H05K3/38 , B32B31/00
CPC分类号： C23C18/1608 , C23C18/166 , C23C18/2086 , C23C18/28 , C23C18/30 , H05K3/381 , Y10S525/903
摘要： Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.
摘要翻译：某些有机聚合材料能够可逆地接受或捐赠来自还原剂的电子。聚合物中的氧化还原位点接受电子，结果发生聚合物的性质变化。该改变可用于改性或蚀刻聚合物材料。可以通过在受控的深度将金属种子并入材料中来修饰材料。种子通过金属阳离子与聚合物中的氧化还原位点的相互作用而引入，这导致阳离子还原形成中性金属种子。随后将含有种子的聚合材料暴露于无电镀浴中，导致具有对聚合物材料具有良好粘附性的所需特性的金属的进一步沉积。聚合物材料的蚀刻可以作为聚合物在非质子传递溶剂中当其氧化还原位点已经接受电子时的溶解度增加的结果进行。增加的溶解度允许在已经还原的聚合物材料的某些区域中蚀刻开口，留下其它区域不变。

8. 发明授权

US5133840A Surface midification of a polyimide 失效
标题翻译：聚酰亚胺的表面中和
公开(公告)号：US5133840A
公开(公告)日：1992-07-28
申请号：US523764
申请日：1990-05-15
申请人： Leena P. Buchwalter , Stephen L. Buchwalter , Terrence R. O'Toole , Richard R. Thomas , Alfred Viehbeck
发明人： Leena P. Buchwalter , Stephen L. Buchwalter , Terrence R. O'Toole , Richard R. Thomas , Alfred Viehbeck
IPC分类号： C08G73/10 , C08J7/12 , C09D179/08 , C09J5/02 , C23C18/20 , C23C18/22 , H05K3/38
CPC分类号： C08J7/12 , C23C18/22 , H05K3/381 , C08J2379/08
摘要： The surface modification of polyimide materials by a chemical process is disclosed to provide a variety of functional groups on the surface. The surface is treated to produce polyamic acid carboxyl groups which are subsequently reacted with epoxies, hydrazines, or alcohols. The carboxyl groups can be also be subjected to other organic reactions, such as reduction with metal hydrides and the like. The versatility and controllability of this process lends itself to promoting adhesion of the polyimide to similarly treated polyimides, other polymers and other substrates as well as combining with metals such as metal catalysts used for depositing conductors on non-conductive surfaces such as circuit boards.

9. 发明授权

US5203955A Method for etching an organic polymeric material 失效
标题翻译：蚀刻有机聚合物材料的方法
公开(公告)号：US5203955A
公开(公告)日：1993-04-20
申请号：US705648
申请日：1991-05-24
申请人： Aldred Viehbeck , Stephen L. Buchwalter , John J. Glenning , Martin J. Goldberg , Caroline A. Kovac , Linda C. Matthew , Walter P. Pawlowski , Stephen L. Tisdale
发明人： Aldred Viehbeck , Stephen L. Buchwalter , John J. Glenning , Martin J. Goldberg , Caroline A. Kovac , Linda C. Matthew , Walter P. Pawlowski , Stephen L. Tisdale
IPC分类号： C23C18/16 , C23C18/28 , H05K3/38
CPC分类号： C23C18/2086 , C23C18/1608 , C23C18/30 , C23C18/36 , C23C18/405 , H05K3/381 , C25D5/022
摘要： Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.
摘要翻译：某些有机聚合材料能够可逆地接受或捐赠来自还原剂的电子。聚合物中的氧化还原位点接受电子，结果发生聚合物的性质变化。该改变可用于改性或蚀刻聚合物材料。可以通过在受控的深度将金属种子并入材料中来修饰材料。种子通过金属阳离子与聚合物中的氧化还原位点的相互作用而引入，这导致阳离子还原形成中性金属种子。随后将含有种子的聚合材料暴露于无电镀浴中，导致具有对聚合物材料具有良好粘附性的所需特性的金属的进一步沉积。聚合物材料的蚀刻可以作为聚合物在非质子传递溶剂中当其氧化还原位点已经接受电子时的溶解度增加的结果进行。增加的溶解度允许在已经还原的聚合物材料的某些区域中蚀刻开口，留下其它区域不变。

10. 发明授权

US08227264B2 Reworkable electronic device assembly and method 有权
标题翻译：可再生电子装置组装及方法
公开(公告)号：US08227264B2
公开(公告)日：2012-07-24
申请号：US13071894
申请日：2011-03-25
申请人： Paul S. Andry , Stephen L. Buchwalter , George A. Katopis , John U. Knickerbocker , Stelios G. Tsapepas , Bucknell C. Webb
发明人： Paul S. Andry , Stephen L. Buchwalter , George A. Katopis , John U. Knickerbocker , Stelios G. Tsapepas , Bucknell C. Webb
IPC分类号： H01L21/30
CPC分类号： H01L23/49827 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2224/16146 , H01L2224/16235 , H01L2224/17181 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/0002 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/00 , H01L2224/05552
摘要： An electronic device assembly is provided which includes a substrate, an interposer and an integrated circuit chip. The substrate is fabricated of a first material having a first thermal expansivity, and the interposer and integrated circuit chip are fabricated of a second material having a second thermal expansivity. The second thermal expansivity is different from the first thermal expansivity so that there is a coefficient of thermal expansion mismatch between the substrate and the interposer or chip. The interposer is coupled to the substrate via a first plurality of electrical contacts and an underfill adhesive at least partially surrounding the electrical contacts to bond the interposer to the substrate and thereby reduce strain on the first plurality of electrical contacts. The integrated circuit chip is coupled to the interposer via a second plurality of electrical contacts only, without use of an adhesive surrounding the second plurality of electrical contacts.
摘要翻译：提供一种电子器件组件，其包括衬底，插入器和集成电路芯片。衬底由具有第一热膨胀性的第一材料制成，并且插入器和集成电路芯片由具有第二热膨胀性的第二材料制成。第二热膨胀性与第一热膨胀性不同，因此在衬底和插入件或芯片之间存在热膨胀失配系数。插入器经由第一多个电触点和底部填充粘合剂耦合到基板，所述底部填充粘合剂至少部分地围绕电触点以将插入件结合到基板，从而减少第一多个电触点上的应变。集成电路芯片仅通过第二多个电触点而耦合到插入器，而不使用围绕第二多个电触点的粘合剂。

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