专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 外观设计

USD405779S Carrier element for a semiconductor chip for integration into a chipcard 失效
公开(公告)号：USD405779S
公开(公告)日：1999-02-16
申请号：US70054
申请日：1997-04-25
申请人： Michael Huber , Peter Stampka , Erik Heinemann , Christian Hauser , Frank Pueschner
设计人： Michael Huber , Peter Stampka , Erik Heinemann , Christian Hauser , Frank Pueschner

2. 发明申请

US20130278378A1 SECURE EPASS BOOKLET BASED ON DOUBLE CHIP TECHNOLOGY 有权
标题翻译：基于双芯片技术的安全通讯书
公开(公告)号：US20130278378A1
公开(公告)日：2013-10-24
申请号：US13450510
申请日：2012-04-19
申请人： Juergen Hoegerl , Frank Pueschner , Peter Stampka , Michael Huber
发明人： Juergen Hoegerl , Frank Pueschner , Peter Stampka , Michael Huber
IPC分类号： G06F7/04 , G06K19/077
CPC分类号： G06K7/10158 , G06K19/07372 , G06K19/07773 , G06K19/07794
摘要： A tamper-evident credential has a radio frequency identification (RFID) package with a first antenna and a subordinate antenna, RFID package defining a first part of the credential. The credential also has a subordinate RFID package defining a second part of the credential. The subordinate RFID package selectively coupled to said subordinate antenna so that an interrogation signal applied to said first antenna package is transmitted to the subordinate RFID package across said subordinate antenna.
摘要翻译：防盗证书具有具有第一天线和下级天线的射频识别（RFID）封装，RFID封装限定凭证的第一部分。凭证还具有定义凭证的第二部分的从属RFID包。所述下级RFID封装选择性地耦合到所述从属天线，使得施加到所述第一天线封装的询问信号通过所述从属天线传输到所述下级RFID封装。

3. 发明授权

US06191951B1 Smart card module and smart card including a smart card module 有权
标题翻译：智能卡模块和智能卡包括智能卡模块
公开(公告)号：US06191951B1
公开(公告)日：2001-02-20
申请号：US09390494
申请日：1999-09-03
申请人： Detlef Houdeau , Josef Mundigl , Frank Pueschner , Peter Stampka , Michael Huber , Josef Heitzer
发明人： Detlef Houdeau , Josef Mundigl , Frank Pueschner , Peter Stampka , Michael Huber , Josef Heitzer
IPC分类号： H05K500
CPC分类号： G06K19/07747 , G06K19/07743 , H01L2224/16
摘要： A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.
摘要翻译：智能卡模块包括导电地连接到形成有接触区域的金属引线框架的半导体芯片。半导体芯片和接触区域通过设置在施加到半导体芯片的电绝缘保护层的表面上的连接区域导电接触。该表面背离半导体芯片。可以通过使用焊接接头或导电粘合剂粘合在连接区域和接触区域之间建立接触。还提供了包括智能卡模块的智能卡。

4. 发明授权

US09177181B2 Secure epass booklet based on double chip technology 有权
标题翻译：基于双芯片技术的安全epass小册子
公开(公告)号：US09177181B2
公开(公告)日：2015-11-03
申请号：US13450510
申请日：2012-04-19
申请人： Juergen Hoegerl , Frank Pueschner , Peter Stampka , Michael Huber
发明人： Juergen Hoegerl , Frank Pueschner , Peter Stampka , Michael Huber
IPC分类号： G06K7/04 , G06K7/10
CPC分类号： G06K7/10158 , G06K19/07372 , G06K19/07773 , G06K19/07794
摘要： A tamper-evident credential has a radio frequency identification (RFID) package with a first antenna and a subordinate antenna, RFID package defining a first part of the credential. The credential also has a subordinate RFID package defining a second part of the credential. The subordinate RFID package selectively coupled to said subordinate antenna so that an interrogation signal applied to said first antenna package is transmitted to the subordinate RFID package across said subordinate antenna.
摘要翻译：防盗证书具有具有第一天线和下级天线的射频识别（RFID）封装，RFID封装限定凭证的第一部分。凭证还具有定义凭证的第二部分的从属RFID包。所述下级RFID封装选择性地耦合到所述从属天线，使得施加到所述第一天线封装的询问信号通过所述从属天线传输到所述下级RFID封装。

5. 发明授权

US06313524B1 Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate 失效
标题翻译：芯片模块具有可安装在外部印刷电路板或外部电路板基板上的多个平面接触元件
公开(公告)号：US06313524B1
公开(公告)日：2001-11-06
申请号：US09274506
申请日：1999-03-23
申请人： Frank Pueschner , Michael Huber , Peter Stampka , Jürgen Fischer , Josef Heitzer
发明人： Frank Pueschner , Michael Huber , Peter Stampka , Jürgen Fischer , Josef Heitzer
IPC分类号： H01L2328
CPC分类号： G06K19/07747 , G06K19/07743 , H01L23/49855 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H05K1/181 , H05K3/284 , H05K3/3426 , H05K2201/10977 , H05K2203/1316 , Y02P70/611 , Y02P70/613 , Y10T29/49146 , Y10T29/49172 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A chip module has a contact area disposed on its outer side formed of a plurality of essentially flat contact elements of electrically conductive material insulated from one another. At least one semiconductor chip having one or more integrated semiconductor circuits that are electrically connected to the contact elements of the contact area via bonding wires. The contact elements of the chip module are formed by a prefabricated lead frame for supporting the at least one semiconductor chip and have on two opposing sides of the chip module outwardly offset terminals arranged in rows next to one another. The outwardly offset terminals are provided for surface mounting the chip module on the mounting surface of an external printed circuit board or an external circuit board substrate.
摘要翻译：芯片模块具有设置在其外侧上的接触区域，该接触区域由彼此绝缘的导电材料的多个基本平坦的接触元件形成。至少一个具有一个或多个集成半导体电路的半导体芯片，其通过接合线与接触区域的接触元件电连接。芯片模块的接触元件由用于支撑至少一个半导体芯片的预制引线框架形成，并且在芯片模块的两个相对侧上向外偏移端子排列成彼此相邻的行。外部偏移端子用于将芯片模块表面安装在外部印刷电路板或外部电路板基板的安装表面上。

6. 发明授权

US06185507B2 Microprocessor, in particular for use in a chip card, with a control unit and with a housing surrounding the control unit 有权
标题翻译：微处理器，特别是用于芯片卡，具有控制单元和围绕控制单元的壳体
公开(公告)号：US06185507B2
公开(公告)日：2001-02-06
申请号：US09255991
申请日：1999-02-23
申请人： Michael Huber , Peter Stampka , Josef Heitzer
发明人： Michael Huber , Peter Stampka , Josef Heitzer
IPC分类号： G01N2710
CPC分类号： G07F7/1008 , G06F21/86 , G06F21/87 , G06K19/07 , G06K19/0716 , G06K19/073 , G06K19/07372 , G06Q20/341 , G07F7/082
摘要： A microprocessor has a control unit with a housing surrounding the control unit. The invention also relates to a chip card having such a microprocessor that is protected against manipulations. At least one sensor indicates ambient states and is connected to the control unit and is provided in a region of the housing of the microprocessor. The control unit is configured in such a way that it can be placed in an inactive state if a measurement signal that indicates a predetermined ambient state is and/or is not fed to the control unit from the sensor.
摘要翻译：微处理器具有控制单元，其具有围绕控制单元的壳体。本发明还涉及具有这种微处理器的芯片卡，该微处理器被保护以防止操作。至少一个传感器指示环境状态并且连接到控制单元并且设置在微处理器的壳体的区域中。如果指示预定环境状态的测量信号和/或没有从传感器馈送到控制单元，则控制单元被配置为使其能够处于非活动状态。

7. 外观设计

USD406822S Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module 失效
公开(公告)号：USD406822S
公开(公告)日：1999-03-16
申请号：US76605
申请日：1997-09-08
申请人： Michael Huber , Peter Stampka
设计人： Michael Huber , Peter Stampka

8. 发明授权

US06384425B1 Nonconductive substrate forming a strip or a panel on which a multiplicity of carrier elements is formed 有权
标题翻译：形成带或其上形成有多个载体元件的面板的非导电基板
公开(公告)号：US06384425B1
公开(公告)日：2002-05-07
申请号：US09137924
申请日：1998-08-20
申请人： Michael Huber , Peter Stampka , Gerhard Schraud , Peter Striegel , Hans-Georg Mensch
发明人： Michael Huber , Peter Stampka , Gerhard Schraud , Peter Striegel , Hans-Georg Mensch
IPC分类号： H01L2358
CPC分类号： G06K19/07747 , G06K19/07743 , G06K19/07749 , G06K19/07769 , H05K1/0266 , H05K1/11 , H05K3/0097
摘要： A nonconductive substrate forms a strip or a panel on which a multiplicity of carrier elements is formed, in particular for installation in a chipcard. One side of the substrate is provided with conductive contact surfaces which lie within an outer contour line that determines the size of a carrier element. The other side of the substrate has conductor structures within the outer contour line which form at least contact fields for at least one coil to be contacted and for at least one semiconductor chip. The substrate has cut-outs outside each outer contour line, through which it is possible to access coil terminals of the semiconductor chip for testing purposes from the contact-surface side, as long as the carrier element is still in the strip or in the panel.
摘要翻译：非导电衬底形成条或面板，其上形成有多个载体元件，特别是用于安装在芯片卡中。衬底的一侧设置有位于确定载体元件尺寸的外轮廓线内的导电接触表面。衬底的另一侧具有在外轮廓线内的导体结构，其至少形成用于要接触的至少一个线圈和至少一个半导体芯片的接触场。基板在每个外轮廓线之外具有切口，只要载体元件仍处于条带或面板中，就可以通过该切口从接触表面侧接近用于测试目的的半导体芯片的线圈端子。

9. 发明授权

US06326683B1 Carrier element for a semiconductor chip 有权
标题翻译：用于半导体芯片的载体元件
公开(公告)号：US06326683B1
公开(公告)日：2001-12-04
申请号：US09193577
申请日：1998-11-17
申请人： Detlef Houdeau , Michael Huber , Volker Rohde , Richard Scheuenpflug , Peter Stampka
发明人： Detlef Houdeau , Michael Huber , Volker Rohde , Richard Scheuenpflug , Peter Stampka
IPC分类号： H01L2144
CPC分类号： G06K19/07747 , G06K19/07743 , H01L23/49855 , H01L2924/0002 , H05K3/3426 , Y02P70/613 , H01L2924/00
摘要： A carrier element for a semiconductor chip which can be incorporated in smart cards and soldered onto circuit boards using SMD technology. For this purpose, a copper lamination of a plastic sheet is structured by etching in such a way that contact areas are formed in one piece with conductor tracks which end at the edge of the carrier element and enable reliable soldering.
摘要翻译：用于半导体芯片的载体元件，其可以并入智能卡并且使用SMD技术焊接到电路板上。为此，通过蚀刻来形成塑料片的铜层压，使得接触区域形成为一体，导体轨道终止于载体元件的边缘并且实现可靠的焊接。

10. 发明授权

US06188580B1 Smart card and semiconductor chip for use in a smart card 失效
标题翻译：用于智能卡的智能卡和半导体芯片
公开(公告)号：US06188580B1
公开(公告)日：2001-02-13
申请号：US09246774
申请日：1999-02-08
申请人： Michael Huber , Peter Stampka , Detlef Houdeau
发明人： Michael Huber , Peter Stampka , Detlef Houdeau
IPC分类号： H05K511
CPC分类号： G06K19/07728 , G06K19/07743
摘要： The smart card has a card body and a plurality of contact areas exposed on a flat surface of the card body. The contact areas are fabricated from electrically conductive material and are electrically connected to contact terminals, which are assigned to an electronic circuit formed on the semiconductor substrate of a semiconductor chip. The contact areas are fabricated as a structured coating on a main surface of the semiconductor chip. The semiconductor chip, after fabrication with the contact areas is inserted and fixed in a receptacle opening in the card body of the smart card in such a way that the contact areas extend essentially flush with the outer face of the card body. In order to ensure sufficiently high mechanical flexibility, the thickness of the silicon substrate of the chip is preferably less than about 100 &mgr;m.
摘要翻译：智能卡具有卡体和暴露在卡体的平坦表面上的多个接触区域。接触区域由导电材料制成并且电连接到接触端子，接触端子被分配给形成在半导体芯片的半导体衬底上的电子电路。接触区域被制成半导体芯片的主表面上的结构化涂层。将具有接触区域的制造之后的半导体芯片插入并固定在智能卡的卡体中的插座开口中，使得接触区域基本上与卡体的外表面齐平。为了确保足够高的机械灵活性，芯片的硅衬底的厚度优选小于约100μm。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式