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1. 发明授权

US06224728B1 Valve for fluid control 有权
标题翻译：阀门用于流体控制
公开(公告)号：US06224728B1
公开(公告)日：2001-05-01
申请号：US09373872
申请日：1999-08-13
申请人： Michael C. Oborny , Phillip H. Paul , Kenneth R. Hencken , Gregory C. Frye-Mason , Ronald P. Manginell
发明人： Michael C. Oborny , Phillip H. Paul , Kenneth R. Hencken , Gregory C. Frye-Mason , Ronald P. Manginell
IPC分类号： C12Q168
CPC分类号： F04B19/006
摘要： A valve for controlling fluid flows. This valve, which includes both an actuation device and a valve body provides: the ability to incorporate both the actuation device and valve into a unitary structure that can be placed onto a microchip, the ability to generate higher actuation pressures and thus control higher fluid pressures than conventional microvalves, and a device that draws only microwatts of power. An electrokinetic pump that converts electric potential to hydraulic force is used to operate, or actuate, the valve.
摘要翻译：用于控制流体流动的阀。该阀包括致动装置和阀体，其提供：将致动装置和阀两者结合成可放置在微芯片上的整体结构的能力，产生更高的致动压力并因此控制较高流体压力的能力比传统的微型阀，以及只能获得微瓦功率的装置。将电势转换为液压力的电动泵用于操作或致动阀。

2. 发明授权

US06277257B1 Electrokinetic high pressure hydraulic system 有权
标题翻译：电动高压液压系统
公开(公告)号：US06277257B1
公开(公告)日：2001-08-21
申请号：US09271687
申请日：1999-03-18
申请人： Phillip H. Paul , David J. Rakestraw , Don W. Arnold , Kenneth R. Hencken , Joseph S. Schoeniger , David W. Neyer
发明人： Phillip H. Paul , David J. Rakestraw , Don W. Arnold , Kenneth R. Hencken , Joseph S. Schoeniger , David W. Neyer
IPC分类号： B01D6144
CPC分类号： G01N30/32 , F04B19/006 , G01N2030/285 , G01N2030/326
摘要： An electrokinetic high pressure hydraulic pump for manipulating fluids in capillary-based systems. The pump uses electro-osmotic flow to provide a high pressure hydraulic system, having no moving mechanical parts, for pumping and/or compressing fluids, for providing valve means and means for opening and closing valves, for controlling fluid flow rate, and manipulating fluid flow generally and in capillary-based systems (Microsystems), in particular. The compact nature of the inventive high pressure hydraulic pump provides the ability to construct a micro-scale or capillary-based HPLC system that fulfills the desire for small sample quantity, low solvent consumption, improved efficiency, the ability to run samples in parallel, and field portability. Control of pressure and solvent flow rate is achieved by controlling the voltage applied to an electrokinetic pump.
摘要翻译：一种电动高压液压泵，用于在毛细管系统中操纵流体。泵使用电渗流提供高压液压系统，没有移动的机械部件，用于泵送和/或压缩流体，用于提供阀装置和用于打开和关闭阀门的装置，用于控制流体流速和操纵流体特别是在毛细管系统（Microsystems）中通常流动。本发明的高压液压泵的紧凑特性提供构建基于微量或基于毛细管的HPLC系统的能力，其满足对小样品量，低溶剂消耗，提高的效率，并行运行样品的能力的需求，以及现场可携带性。通过控制施加到电动泵的电压来实现压力和溶剂流速的控制。

3. 发明授权

US06572749B1 Electrokinetic high pressure hydraulic system 有权
标题翻译：电动高压液压系统
公开(公告)号：US06572749B1
公开(公告)日：2003-06-03
申请号：US09912154
申请日：2001-07-23
申请人： Phillip H. Paul , David J. Rakestraw , Don W. Arnold , Kenneth R. Hencken , Joseph S. Schoeniger , David W. Neyer
发明人： Phillip H. Paul , David J. Rakestraw , Don W. Arnold , Kenneth R. Hencken , Joseph S. Schoeniger , David W. Neyer
IPC分类号： B05B500
CPC分类号： G01N30/32 , F04B19/006 , G01N2030/285 , G01N2030/326
摘要： An electrokinetic high pressure hydraulic pump for manipulating fluids in capillary-based system. The pump uses electro-osmotic flow to provide a high pressure hydraulic system, having no moving mechanical parts, for pumping and/or compressing fluids, for providing valve means and means for opening and closing valves, for controlling fluid flow rate, and manipulating fluid flow generally and in capillary-based systems (microsystems), in particular. The compact nature of the inventive high pressure hydraulic pump provides the ability to construct a micro-scale or capillary-based HPLC system that fulfills the desire for small sample quantity, low solvent consumption, improved efficiency, the ability to run samples in parallel, and field portability. Control of pressure and solvent flow rate is achieved by controlling the voltage applied to an electrokinetic pump.
摘要翻译：一种电动高压液压泵，用于在毛细管系统中操纵流体。泵使用电渗流提供高压液压系统，没有移动的机械部件，用于泵送和/或压缩流体，用于提供阀装置和用于打开和关闭阀门的装置，用于控制流体流速和操纵流体特别是在毛细管系统（微系统）中流动。本发明的高压液压泵的紧凑特性提供构建基于微量或基于毛细管的HPLC系统的能力，其满足对小样品量，低溶剂消耗，提高的效率，并行运行样品的能力的需求，以及现场可携带性。通过控制施加到电动泵的电压来实现压力和溶剂流速的控制。

4. 发明申请

US20130085462A1 ELECTROKINETIC PUMP BASED WOUND TREATMENT SYSTEM AND METHODS 审中-公开
标题翻译：基于电动泵的绕线处理系统及方法
公开(公告)号：US20130085462A1
公开(公告)日：2013-04-04
申请号：US13632884
申请日：2012-10-01
申请人： Kenneth Kei-ho NIP , Jessica L. Strohmann , Doris Sun-Chia Shieh , Tuan Quoc Mai , Robert B. Lewis , Kenneth R. Hencken , Craig S. Bryant
发明人： Kenneth Kei-ho NIP , Jessica L. Strohmann , Doris Sun-Chia Shieh , Tuan Quoc Mai , Robert B. Lewis , Kenneth R. Hencken , Craig S. Bryant
IPC分类号： A61M35/00 , A61M1/00
CPC分类号： A61M1/0058 , A61F13/00068 , A61F2013/00174 , A61F2013/00412 , A61F2013/00536 , A61M1/0025 , A61M1/0066 , A61M1/0084 , A61M1/0088 , A61M1/009 , A61M2205/52
摘要： A wound treatment system includes a patch, first and second fluid reservoirs, an electrokinetic pump assembly, and a controller. The patch is configured to enclose a wound area and includes an inlet and an outlet. The first fluid reservoir is fluidically connected to the inlet and the second fluid reservoir is fluidically connected to the outlet. The electrokinetic pump assembly is configured to pump a first treatment fluid from the first fluid reservoir into the patch through the inlet and to pump fluid from the patch through the outlet and into the second fluid reservoir. The controller is configured to operate the electrokinetic pump assembly and to include an electronic memory containing computer readable instructions for operating the electrokinetic pump assembly to perform a wound therapy protocol in the wound area.
摘要翻译：伤口治疗系统包括补片，第一和第二流体储存器，电动泵组件和控制器。该贴片构造成包围一个伤口区域并且包括入口和出口。第一流体储存器流体地连接到入口，并且第二流体储存器流体地连接到出口。电动泵组件构造成将第一处理流体从第一流体储存器通过入口泵送到补片中，并且将流体从补片泵送通过出口并进入第二流体储存器。控制器被配置为操作电动泵组件并且包括包含用于操作电动泵组件以在伤口区域中执行伤口治疗方案的计算机可读指令的电子存储器。

5. 发明申请

US20120282112A1 GANGING ELECTROKINETIC PUMPS 审中-公开
标题翻译：搅拌电动泵
公开(公告)号：US20120282112A1
公开(公告)日：2012-11-08
申请号：US13465927
申请日：2012-05-07
申请人： Kenneth Kei-ho Nip , Kenneth R. Hencken , Doris Sun-Chia Shieh , Robert B. Lewis , Tuan Quoc Mai
发明人： Kenneth Kei-ho Nip , Kenneth R. Hencken , Doris Sun-Chia Shieh , Robert B. Lewis , Tuan Quoc Mai
IPC分类号： F04B17/03
CPC分类号： F04B23/06 , F04B17/00 , F04B43/043
摘要： An electrokinetic system includes a first electrokinetic pump, a second electrokinetic pump, a reservoir having delivery fluid therein, and a controller. The first electrokinetic pump is configured to provide a first range of flow rates. The second electrokinetic pump is configured to provide a second range of flow rates. The second range includes flow rates that are greater than the flow rates of the first range. The reservoir is fluidically attached to the first electrokinetic pump and the second electrokinetic pump. The controller is configured to apply voltage to one of the first or second electrokinetic pumps and then apply voltage to the other of the first or second electrokinetic pumps so as to vary the flow rate range of delivery fluid pump from the reservoir.
摘要翻译：电动系统包括第一电动泵，第二电动泵，其中具有输送流体的储存器和控制器。第一电动泵配置成提供第一范围的流速。第二电动泵配置成提供第二范围的流速。第二范围包括大于第一范围的流速的流量。储存器流体地附接到第一电动泵和第二电动泵。控制器被配置为向第一或第二电动泵之一施加电压，然后将电压施加到第一或第二电动泵中的另一个，以便改变输送流体泵从储存器的流量范围。

6. 发明授权

US06770183B1 Electrokinetic pump 有权
标题翻译：电动泵
公开(公告)号：US06770183B1
公开(公告)日：2004-08-03
申请号：US09916717
申请日：2001-07-26
申请人： Kenneth R. Hencken , George B. Sartor
发明人： Kenneth R. Hencken , George B. Sartor
IPC分类号： G01N27447
CPC分类号： F04B19/006 , B01L3/5027
摘要： An electrokinetic pump in which the porous dielectric medium of conventional electrokinetic pumps is replaced by a patterned microstructure. The patterned microstructure is fabricated by lithographic patterning and etching of a substrate and is formed by features arranged so as to create an array of microchannels. The microchannels have dimensions on the order of the pore spacing in a conventional porous dielectric medium. Embedded unitary electrodes are vapor deposited on either end of the channel structure to provide the electric field necessary for electroosmotic flow.
摘要翻译：一种电动泵，其中常规电动泵的多孔电介质被图案化微结构所取代。图案化微结构通过光刻图案化和蚀刻衬底制造，并且通过布置成产生微通道阵列的特征形成。微通道在常规多孔电介质中具有孔间距的尺寸。嵌入式单体电极气相沉积在通道结构的任一端，以提供电渗流所需的电场。

7. 发明申请

US20110018259A1 Microfluidic Connections 有权
标题翻译：微流体连接
公开(公告)号：US20110018259A1
公开(公告)日：2011-01-27
申请号：US12874055
申请日：2010-09-01
申请人： Don W. Arnold , Kenneth R. Hencken , Sammy S. Datwani , Patrick Pak-Ho Leung , Douglas R. Cyr , Jason E. Rehm
发明人： Don W. Arnold , Kenneth R. Hencken , Sammy S. Datwani , Patrick Pak-Ho Leung , Douglas R. Cyr , Jason E. Rehm
IPC分类号： F16L25/00
CPC分类号： B01L3/502715 , B01J19/0093 , B01J2219/00783 , B01J2219/0081 , B01L3/565 , B01L9/527 , B01L2200/027 , B01L2200/04 , B01L2300/0816 , G01N30/6095 , G01N30/6026
摘要： A junction is made between a first microfluidic substrate (12) having an elongate component (303) protruding from it and a second microfluidic substrate (22) having a corresponding conduit (261). Each of the substrates has a pair of alignment features, for example planar orthogonal surfaces (13, 15; 23, 25) or grooves (141, 151; 241, 251) in opposite sides of the substrate. The substrates are placed on an alignment jig 6 having location features (63, 65) corresponding to the alignment features. The elongate component can be surrounded by a compressible gasket 40). The substrates are pushed towards each other so that the elongate component enters the conduit and the gasket, if any, is compressed. A fluid-tight junction results so long as the substrates are maintained in the necessary position, either by permanent means, or, if a junction which can be disassembled is needed, by maintaining pressure between the substrates. Novel apparatus and novel microfluidic assemblies, including microfluidic chips having grooves in their sides, are described.
摘要翻译：在具有从其突出的细长部件（303）的第一微流体衬底（12）和具有相应管道（261）的第二微流体衬底（22）之间形成接头。每个基板具有一对对准特征，例如在基板的相对侧中的平面正交表面（13,15; 23,25）或凹槽（141,151; 241,251）。基板被放置在对准夹具6上，对准夹具6具有与对准特征对应的位置特征（63,65）。细长部件可以被可压缩垫片40）包围。基板被推向彼此，使得细长部件进入导管，并且垫圈（如果有的话）被压缩。只要通过永久的方式将基板保持在必要的位置，或者如果需要可以拆卸的接头，则通过保持基板之间的压力，导致流体密封接合。描述了新颖的装置和新颖的微流体组件，包括在其侧面具有凹槽的微流体芯片。

8. 发明申请

US20120282111A1 SYSTEM AND METHOD OF DIFFERENTIAL PRESSURE CONTROL OF A RECIPROCATING ELECTROKINETIC PUMP 审中-公开
标题翻译：复合电动泵的差压控制系统与方法
公开(公告)号：US20120282111A1
公开(公告)日：2012-11-08
申请号：US13465902
申请日：2012-05-07
申请人： Kenneth Kei-ho Nip , Kenneth R. Hencken , Doris Sun-Chia Shieh , Robert B. Lewis , Tuan Quoc Mai
发明人： Kenneth Kei-ho Nip , Kenneth R. Hencken , Doris Sun-Chia Shieh , Robert B. Lewis , Tuan Quoc Mai
IPC分类号： F04B49/06
CPC分类号： F04B49/06 , F04B19/00 , F04B19/006 , F04B43/04
摘要： A method of controlling the output of an electrokinetic pump to deliver a target stroke volume includes applying a pump drive signal to the electrokinetic pump for a pump stroke time duration and then determining a volume of a delivery fluid pumped. Then, comparing the volume of the delivery fluid pumped to the target stroke volume; generate a new time interval for applying the pump drive signal. Then apply the pump drive signal to the electrokinetic pump for the new time interval. A system for delivery of fluid includes an electrokinetic pump under the control of an electronic controller. The electronic controller contains computer readable instructions to determine an output of the electrokinetic pump and then generate a stroke time delivery adjustment for precise pumping schemes.
摘要翻译：控制电动泵的输出以输送目标行程体积的方法包括将泵驱动信号施加到电动泵以获得泵冲程持续时间，然后确定泵送的输送流体的体积。然后，将泵送的输送流体的体积与目标行程体积进行比较; 产生应用泵驱动信号的新时间间隔。然后在新的时间间隔内将泵驱动信号应用于电动泵。用于输送流体的系统包括在电子控制器的控制下的电动泵。电子控制器包含用于确定电动泵的输出的计算机可读指令，然后产生用于精确泵送方案的冲程时间输送调整。

9. 发明授权

US07802923B2 Microfluidic connections 有权
标题翻译：微流体连接
公开(公告)号：US07802923B2
公开(公告)日：2010-09-28
申请号：US10599591
申请日：2005-04-01
申请人： Don W. Arnold , Kenneth R. Hencken , Sammy S. Datwani , Patrick Pak-Ho Leung , Douglas R. Cyr , Jason E. Rehm
发明人： Don W. Arnold , Kenneth R. Hencken , Sammy S. Datwani , Patrick Pak-Ho Leung , Douglas R. Cyr , Jason E. Rehm
IPC分类号： G02B6/36 , G02B6/38
CPC分类号： B01L3/502715 , B01J19/0093 , B01J2219/00783 , B01J2219/0081 , B01L3/565 , B01L9/527 , B01L2200/027 , B01L2200/04 , B01L2300/0816 , G01N30/6095 , G01N30/6026
摘要： A junction is made between a first microfluidic substrate (12) having an elongate component (303) protruding from it and a second microfluidic substrate (22) having a corresponding conduit (261). Each of the substrates has a pair of alignment features, for example planar orthogonal surfaces (13,15; 23,25) or grooves (141,151; 241, 251) in opposite sides of the substrate. The substrates are placed on an alignment jig 6 having location features (63, 65) corresponding to the alignment features. The elongate component can be surrounded by a compressible gasket 40). The substrates are pushed towards each other so that the elongate component enters the conduit and the gasket, if any, is compressed. A fluid-tight junction results so long as the substrates are maintained in the necessary position, either by permanent means, or, if a junction which can be disassembled is needed, by maintaining pressure between the substrates. Novel apparatus and novel microfluidic assemblies, including microfluidic chips having grooves in their sides, are described.
摘要翻译：在具有从其突出的细长部件（303）的第一微流体衬底（12）和具有相应管道（261）的第二微流体衬底（22）之间形成接头。每个基板具有一对对准特征，例如在基板相对侧的平面正交表面（13,15; 23,25）或凹槽（141,151; 241,251）。基板被放置在对准夹具6上，对准夹具6具有与对准特征对应的位置特征（63,65）。细长部件可以被可压缩垫片40）包围。基板被推向彼此，使得细长部件进入导管，并且垫圈（如果有的话）被压缩。只要通过永久的方式将基板保持在必要的位置，或者如果需要可以拆卸的接头，则通过保持基板之间的压力，导致流体密封接合。描述了新颖的装置和新颖的微流体组件，包括在其侧面具有凹槽的微流体芯片。

10. 发明申请

US20090129728A1 Microfluidic Connections 有权
标题翻译：微流体连接
公开(公告)号：US20090129728A1
公开(公告)日：2009-05-21
申请号：US10599591
申请日：2005-04-01
申请人： Don W. Arnold , Kenneth R. Hencken , Sammy S. Datwani , Patrick Pak-Ho Leung , Douglas R. Cyr , Jason E. Rehm
发明人： Don W. Arnold , Kenneth R. Hencken , Sammy S. Datwani , Patrick Pak-Ho Leung , Douglas R. Cyr , Jason E. Rehm
IPC分类号： G02B6/00 , F16J15/02
CPC分类号： B01L3/502715 , B01J19/0093 , B01J2219/00783 , B01J2219/0081 , B01L3/565 , B01L9/527 , B01L2200/027 , B01L2200/04 , B01L2300/0816 , G01N30/6095 , G01N30/6026
摘要： A junction is made between a first microfluidic substrate (12) having an elongate component (303) protruding from it and a second microfluidic substrate (22) having a corresponding conduit (261). Each of the substrates has a pair of alignment features, for example planar orthogonal surfaces (13,15; 23,25) or grooves (141,151; 241, 251) in opposite sides of the substrate. The substrates are placed on an alignment jig 6 having location features (63, 65) corresponding to the alignment features. The elongate component can be surrounded by a compressible gasket 40). The substrates are pushed towards each other so that the elongate component enters the conduit and the gasket, if any, is compressed. A fluid-tight junction results so long as the substrates are maintained in the necessary position, either by permanent means, or, if a junction which can be disassembled is needed, by maintaining pressure between the substrates. Novel apparatus and novel microfluidic assemblies, including microfluidic chips having grooves in their sides, are described.
摘要翻译：在具有从其突出的细长部件（303）的第一微流体衬底（12）和具有相应管道（261）的第二微流体衬底（22）之间形成接头。每个基板具有一对对准特征，例如在基板相对侧的平面正交表面（13,15; 23,25）或凹槽（141,151; 241,251）。基板被放置在对准夹具6上，对准夹具6具有与对准特征对应的位置特征（63,65）。细长部件可以被可压缩垫片40）包围。基板被推向彼此，使得细长部件进入导管，并且垫圈（如果有的话）被压缩。只要通过永久的方式将基板保持在必要的位置，或者如果需要可以拆卸的接头，则通过保持基板之间的压力，导致流体密封接合。描述了新颖的装置和新颖的微流体组件，包括在其侧面具有凹槽的微流体芯片。

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