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1. 发明申请

US20060097757A1 Integrated circuit die including a temperature detection circuit, and system and methods for calibrating the temperature detection circuit 失效
公开(公告)号：US20060097757A1
公开(公告)日：2006-05-11
申请号：US10982019
申请日：2004-11-05
申请人： Melia Gordon , Charles Johns , Hiroki Kihara , Iwao Takiguchi , Tetsuji Tamura , Michael Wang , Kazuaki Yazawa , Munehiro Yoshida
发明人： Melia Gordon , Charles Johns , Hiroki Kihara , Iwao Takiguchi , Tetsuji Tamura , Michael Wang , Kazuaki Yazawa , Munehiro Yoshida
IPC分类号： H03K5/153
CPC分类号： G01K15/00 , G01R31/2856 , G01R31/2874 , G01R31/31704 , G01R31/319 , G01R31/31908
摘要： An integrated circuit die is disclosed including a temperature detection circuit and a memory configured to store calibration data. The temperature detection circuit is operatively coupled to the memory, and receives an input signal. The temperature detection circuit is configured to produce an output signal dependent upon the input signal and indicative of whether a temperature of the integrated circuit die is greater than a selected temperature. During a normal operating mode of the integrated circuit die the input signal comprises the calibration data. A system and methods for calibrating the temperature detection circuit are also described.

2. 发明申请

US20060289862A1 Systems and methods for thermal sensing 有权
公开(公告)号：US20060289862A1
公开(公告)日：2006-12-28
申请号：US11168591
申请日：2005-06-28
申请人： Munehiro Yoshida , Daniel Stasiak , Michael Wang , Charles Johns , Hiroki Kihara , Tetsuji Tamura , Kazuaki Yazawa , Iwao Takiguchi
发明人： Munehiro Yoshida , Daniel Stasiak , Michael Wang , Charles Johns , Hiroki Kihara , Tetsuji Tamura , Kazuaki Yazawa , Iwao Takiguchi
IPC分类号： H01L23/58
CPC分类号： H01L25/162 , G06F1/206 , H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： Systems and methods for positioning thermal sensors within an integrated circuit in a manner that provides useful thermal measurements corresponding to different parts of the integrated circuit. In one embodiment, an integrated circuit includes multiple, duplicate functional blocks. A separate thermal sensor is coupled to each of the duplicate functional blocks, preferably in the same relative location on each of the duplicate functional blocks, and preferably at a hotspot. One embodiment also includes thermal sensors on one or more functional blocks of other types in the integrated circuit. One embodiment includes a thermal sensor positioned at a cool spot, such as at the edge of the integrated circuit chip. Each of the thermal sensors may have ports to enable power and ground connections or data connections between the sensors and external components or devices.

3. 发明授权

US07535020B2 Systems and methods for thermal sensing 有权
标题翻译：热感测系统和方法
公开(公告)号：US07535020B2
公开(公告)日：2009-05-19
申请号：US11168591
申请日：2005-06-28
申请人： Munehiro Yoshida , Daniel Stasiak , Michael F. Wang , Charles R. Johns , Hiroki Kihara , Tetsuji Tamura , Kazuaki Yazawa , Iwao Takiguchi
发明人： Munehiro Yoshida , Daniel Stasiak , Michael F. Wang , Charles R. Johns , Hiroki Kihara , Tetsuji Tamura , Kazuaki Yazawa , Iwao Takiguchi
IPC分类号： H01L23/58
CPC分类号： H01L25/162 , G06F1/206 , H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： Systems and methods for positioning thermal sensors within an integrated circuit in a manner that provides useful thermal measurements corresponding to different parts of the integrated circuit. In one embodiment, an integrated circuit includes multiple, duplicate functional blocks. A separate thermal sensor is coupled to each of the duplicate functional blocks, preferably in the same relative location on each of the duplicate functional blocks, and preferably at a hotspot. One embodiment also includes thermal sensors on one or more functional blocks of other types in the integrated circuit. One embodiment includes a thermal sensor positioned at a cool spot, such as at the edge of the integrated circuit chip. Each of the thermal sensors may have ports to enable power and ground connections or data connections between the sensors and external components or devices.
摘要翻译：用于以集成电路的不同部分提供有用的热测量的方式在集成电路内定位热传感器的系统和方法。在一个实施例中，集成电路包括多个复制功能块。单独的热传感器耦合到每个重复功能块，优选地在每个复制功能块上相同的相对位置，并且优选地在热点处。一个实施例还包括在集成电路中的其它类型的一个或多个功能块上的热传感器。一个实施例包括位于集成电路芯片的边缘处的冷点处的热传感器。每个热传感器可以具有端口，以实现传感器和外部组件或设备之间的电源和接地连接或数据连接。

4. 发明授权

US07102417B2 Integrated circuit die including a temperature detection circuit, and system and methods for calibrating the temperature detection circuit 失效
标题翻译：包括温度检测电路的集成电路管芯，以及用于校准温度检测电路的系统和方法
公开(公告)号：US07102417B2
公开(公告)日：2006-09-05
申请号：US10982019
申请日：2004-11-05
申请人： Melia F. Gordon , Charles Ray Johns , Hiroki Kihara , Iwao Takiguchi , Tetsuji Tamura , Michael Fan Wang , Kazuaki Yazawa , Munehiro Yoshida
发明人： Melia F. Gordon , Charles Ray Johns , Hiroki Kihara , Iwao Takiguchi , Tetsuji Tamura , Michael Fan Wang , Kazuaki Yazawa , Munehiro Yoshida
IPC分类号： H03K17/78
CPC分类号： G01K15/00 , G01R31/2856 , G01R31/2874 , G01R31/31704 , G01R31/319 , G01R31/31908
摘要： An integrated circuit die is disclosed including a temperature detection circuit and a memory configured to store calibration data. The temperature detection circuit is operatively coupled to the memory, and receives an input signal. The temperature detection circuit is configured to produce an output signal dependent upon the input signal and indicative of whether a temperature of the integrated circuit die is greater than a selected temperature. During a normal operating mode of the integrated circuit die the input signal comprises the calibration data. A system and methods for calibrating the temperature detection circuit are also described.
摘要翻译：公开了一种集成电路管芯，其包括温度检测电路和配置为存储校准数据的存储器。温度检测电路可操作地耦合到存储器，并且接收输入信号。温度检测电路被配置为根据输入信号产生输出信号，并且指示集成电路管芯的温度是否大于所选择的温度。在集成电路管芯的正常操作模式期间，输入信号包括校准数据。还描述了用于校准温度检测电路的系统和方法。

5. 发明申请

US20070074216A1 Task management method, task management device, semiconductor integrated circuit, electronic apparatus, and task management system 有权
标题翻译：任务管理方法，任务管理装置，半导体集成电路，电子设备和任务管理系统
公开(公告)号：US20070074216A1
公开(公告)日：2007-03-29
申请号：US10575042
申请日：2005-04-08
申请人： Kenichi Adachi , Kazuaki Yazawa , Iwao Takiguchi , Atsuhiko Imai , Tetsuji Tamura
发明人： Kenichi Adachi , Kazuaki Yazawa , Iwao Takiguchi , Atsuhiko Imai , Tetsuji Tamura
IPC分类号： G06F9/46
CPC分类号： G06F1/3203 , G06F1/329 , G06F9/4887 , Y02D10/126 , Y02D10/24
摘要： This task management method includes dividing a unit time of processing into a reserved band for guaranteeing real-timeness and a non-reserved band not for guaranteeing real-timeness, and skipping a task to be executed in the non-reserved band as appropriate when processor throughput falls. That is, when the operating frequency of the processor is lowered in order to suppress heat generation, the real-timeness of tasks to be executed in the reserved band is guaranteed at the expense of processing the task to be executed in the non-reserved band in a best-efforts fashion.
摘要翻译：该任务管理方法包括将处理的单位时间划分为用于保证实时性的保留频带和不保证实时性的非保留频带，并且当处理器适当时跳过在非保留频带中执行的任务吞吐量下降。也就是说，当为了抑制发热而降低处理器的工作频率时，保证在保留频带中执行的任务的实时性以处理在非保留频带中执行的任务为代价以尽力而为的方式。

6. 发明授权

US07167778B2 Electronic device cooling apparatus and method for cooling electronic device with temperature prediction 有权
标题翻译：电子装置冷却装置及具有温度预测的电子装置的冷却方法
公开(公告)号：US07167778B2
公开(公告)日：2007-01-23
申请号：US11140491
申请日：2005-05-27
申请人： Kazuaki Yazawa , Iwao Takiguchi , Tetsuji Tamura , Atsuhiko Imai , Kenichi Adachi
发明人： Kazuaki Yazawa , Iwao Takiguchi , Tetsuji Tamura , Atsuhiko Imai , Kenichi Adachi
IPC分类号： G05D23/00 , H01L23/34
CPC分类号： G06F1/206 , G01K7/425 , G05D23/1917 , H01L23/34 , H01L23/467 , H01L23/4735 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H05K7/20172 , H05K7/20209 , H01L2924/00
摘要： A temperature predicting unit predicts the temperature of an electronic device after a predetermined period, and the speed of temperature variation from the operating state of the load. Based on the results of prediction by the temperature predicting unit, a selection unit instructs either one or both of a nozzle control unit and an electric fan control unit to exercise control. According to a control signal from the selection unit, the nozzle control unit transmits a control signal to a nozzle unit to drive a jet cooling apparatus. According to a control signal from the selection unit, the electric fan control unit transmits a control signal to an electric fan unit to drive an electric fan. The selection unit selects the electric fan when the predicted speed of temperature variation exceeds a predetermined threshold, and selects the jet cooling apparatus when the predetermined thresholds is not exceeded.
摘要翻译：温度预测单元在预定时间段之后预测电子设备的温度，以及从负载的操作状态开始的温度变化速度。基于温度预测单元的预测结果，选择单元指示喷嘴控制单元和电风扇控制单元中的一个或两个进行控制。根据来自选择单元的控制信号，喷嘴控制单元向喷嘴单元发送控制信号以驱动喷射冷却装置。根据来自选择单元的控制信号，电风扇控制单元向电风扇单元发送控制信号以驱动电风扇。当预测的温度变化速度超过预定阈值时，选择单元选择电风扇，并且当不超过预定阈值时选择喷射冷却装置。

7. 发明授权

US07954101B2 Skipping non-time-critical task according to control table when operating frequency falls 有权
标题翻译：当工作频率下降时，根据控制表跳过非时间关键任务
公开(公告)号：US07954101B2
公开(公告)日：2011-05-31
申请号：US10575042
申请日：2005-04-08
申请人： Kenichi Adachi , Kazuaki Yazawa , Iwao Takiguchi , Atsuhiko Imai , Tetsuji Tamura
发明人： Kenichi Adachi , Kazuaki Yazawa , Iwao Takiguchi , Atsuhiko Imai , Tetsuji Tamura
IPC分类号： G06F9/46 , G06F1/00
CPC分类号： G06F1/3203 , G06F1/329 , G06F9/4887 , Y02D10/126 , Y02D10/24
摘要： This task management method includes dividing a unit time of processing into a reserved band for guaranteeing real-timeness and a non-reserved band not for guaranteeing real-timeness, and skipping a task to be executed in the non-reserved band as appropriate when processor throughput falls. That is, when the operating frequency of the processor is lowered in order to suppress heat generation, the real-timeness of tasks to be executed in the reserved band is guaranteed at the expense of processing the task to be executed in the non-reserved band in a best-efforts fashion.
摘要翻译：该任务管理方法包括将处理的单位时间划分为用于保证实时性的保留频带和不保证实时性的非保留频带，并且当处理器适当时跳过在非保留频带中执行的任务吞吐量下降。也就是说，当为了抑制发热而降低处理器的工作频率时，保证在保留频带中执行的任务的实时性以处理在非保留频带中执行的任务为代价以尽力而为的方式。

8. 发明申请

US20070198134A1 Processor, multiprocessor system, processor system, information processing apparatus, and temperature control method 审中-公开
标题翻译：处理器，多处理器系统，处理器系统，信息处理装置和温度控制方法
公开(公告)号：US20070198134A1
公开(公告)日：2007-08-23
申请号：US10589380
申请日：2004-12-22
申请人： Kenichi Adachi , Kazuaki Yazawa , Iwao Takiguchi , Atsuhiko Imai , Tetsuji Tamura
发明人： Kenichi Adachi , Kazuaki Yazawa , Iwao Takiguchi , Atsuhiko Imai , Tetsuji Tamura
IPC分类号： G05D23/00
CPC分类号： G06F1/206 , G06F1/3203 , G06F1/329 , G06F9/3836 , G06F9/3869 , G06F9/4881 , G06F9/505 , Y02D10/126 , Y02D10/24
摘要： An instruction decoder identifies, for each instruction, an operational block involved in the execution of the instruction and an associated heat release coefficient. The instruction decoder stores identified information in a heat release coefficient profile. An instruction scheduler schedules the instructions in accordance with the dependence of the instructions on data. A heat release frequency adder cumulatively adds the heat release coefficient to the heat release frequency of the operational block held in the operational block heat release frequency register as the execution of the scheduled instructions proceeds. A heat release frequency subtractor subtracts from the heat release frequency of the operational blocks in the operational block heat release frequency register in accordance with heat discharge that occurs with time. A hot spot detector detects an operational block with its heat release frequency, held in the operational block heat release frequency register, exceeding a predetermined threshold value as a hot spot. The instruction scheduler delays the execution of the instruction involving for its execution the operational block identified as a hot spot.
摘要翻译：指令解码器针对每个指令识别涉及执行指令的操作块和相关的放热系数。指令解码器将识别的信息存储在放热系数分布中。指令调度器根据指令对数据的依赖性来调度指令。随着调度指令的执行进行，放热频率加法器将放热系数累积地加到保持在操作块放热频率寄存器中的操作块的放热频率。热释放频率减法器根据随时间发生的放热量从操作块放热频率寄存器中的操作块的放热频率中减去。热点检测器以其热释放频率检测到操作块放热频率寄存器中的操作块超过预定阈值作为热点。指令调度器延迟涉及其执行的指令的执行被识别为热点的操作块。

9. 发明授权

US07831842B2 Processor for controlling performance in accordance with a chip temperature, information processing apparatus, and method of controlling processor 有权
标题翻译：用于根据芯片温度控制性能的处理器，信息处理装置和控制处理器的方法
公开(公告)号：US07831842B2
公开(公告)日：2010-11-09
申请号：US10575041
申请日：2005-04-08
申请人： Kenichi Adachi , Kazuaki Yazawa , Iwao Takiguchi , Atsuhiko Imai , Tetsuji Tamura
发明人： Kenichi Adachi , Kazuaki Yazawa , Iwao Takiguchi , Atsuhiko Imai , Tetsuji Tamura
IPC分类号： G06F1/00 , G06F9/44
CPC分类号： G06F1/206 , G06F1/3206 , G06F1/324 , G06F1/3243 , G06F1/3287
摘要： A heat generation amount estimation unit acquires the number of sub processors currently in operation, acquires the current operating frequency, and estimates the amount of heat generation after a period Δt. A temperature control unit estimates the temperature after the period Δt based on the current temperature input from a temperature sensor and the amount of heat generation estimated, and compares it with a predetermined threshold temperature. If the predetermined threshold temperature is reached, the temperature control unit acquires the number of sub processors available in parallel after the period Δt from a task management unit, and consults a performance table to determine which operation point to shift to. A sub processor control unit and a frequency control unit switch to the number of sub processors in operation and the operating frequency accordingly. The performance table lists possible operation points in order of performance.
摘要翻译：发热量估计单元获取当前正在运行的子处理器的数量，获取当前的工作频率，并且估计时段＆Dgr; t之后的发热量。温度控制单元基于从温度传感器输入的当前温度和估计的发热量来估计周期＆Dgrt之后的温度，并将其与预定阈值温度进行比较。如果达到预定阈值温度，则温度控制单元从任务管理单元获取在时间段＆Dgrt之后并行可用的子处理器的数量，并且查阅性能表以确定要移动的操作点。子处理器控制单元和频率控制单元切换到操作中的子处理器的数量和相应的操作频率。性能表按性能顺序列出可能的操作点。

10. 发明授权

US07520669B2 Processor, processor system, temperature estimation device, information processing device, and temperature estimation method 有权
标题翻译：处理器，处理器系统，温度估计装置，信息处理装置和温度估计方法
公开(公告)号：US07520669B2
公开(公告)日：2009-04-21
申请号：US10591080
申请日：2005-04-26
申请人： Kazuaki Yazawa , Iwao Takiguchi , Atsuhiko Imai , Tetsuji Tamura , Kenichi Adachi
发明人： Kazuaki Yazawa , Iwao Takiguchi , Atsuhiko Imai , Tetsuji Tamura , Kenichi Adachi
IPC分类号： G01K1/00 , G01K7/00 , G06F19/00
CPC分类号： G06F1/324 , G06F1/206 , G06F1/3203 , Y02D10/126
摘要： A temperature sensor measures a temperature of a certain location inside a processor. An overall heat amount measurement unit measures the overall amount of heat of the processor. A temperature estimation unit estimates the temperatures of a plurality of hot spots occurring in the processor based on the temperature of the certain location detected by the temperature sensor, and determines the maximum temperature of the processor. The temperature estimation unit switches between maximum load temperature estimation coefficients and individual load temperature estimation coefficients stored in a storing unit for reference, depending on the overall amount of heat of the processor, and applies them to a temperature estimation function(s) for converting the sensor temperature into the temperatures of the hot spots. An operating frequency control unit exercises control for lowering the operating frequency of the processor when the maximum temperature of the processor estimated by the temperature estimation unit exceeds a predetermined limit temperature.
摘要翻译：温度传感器测量处理器内某一位置的温度。总热量测量单元测量处理器的总体热量。温度估计单元基于由温度传感器检测到的特定位置的温度来估计处理器中出现的多个热点的温度，并且确定处理器的最高温度。温度估计单元根据处理器的总体热量，在存储在存储单元中的最大负载温度估计系数和各个负载温度估计系数之间切换，并将其应用于温度估计功能，以将传感器温度进入热点温度。当由温度估计单元估计的处理器的最高温度超过预定极限温度时，操作频率控制单元执行用于降低处理器的工作频率的控制。

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