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    • 10. 发明申请
    • Wafer Inspection
    • 晶圆检验
    • US20140009759A1
    • 2014-01-09
    • US13822281
    • 2011-12-07
    • Guoheng ZhaoJenn-Kuen LeongMehdi Vaez-Iravani
    • Guoheng ZhaoJenn-Kuen LeongMehdi Vaez-Iravani
    • G01N21/88
    • G01N21/9501G01N21/21G01N21/47G01N21/8806G01N2201/06113H01L22/12H01L2924/0002H01L2924/00
    • Systems and methods for inspecting a wafer are provided. One system includes an illumination subsystem configured to illuminate the wafer; a collection subsystem configured to collect light scattered from the wafer and to preserve the polarization of the scattered light; an optical element configured to separate the scattered light collected in different segments of the collection numerical aperture of the collection subsystem, where the optical element is positioned at a Fourier plane or a conjugate of the Fourier plane of the collection subsystem; a polarizing element configured to separate the scattered light in one of the different segments into different portions of the scattered light based on polarization; and a detector configured to detect one of the different. portions of the scattered light and to generate output responsive to the detected light, which is used to detect defects on the wafer.
    • 提供了用于检查晶片的系统和方法。 一个系统包括配置成照亮晶片的照明子系统; 收集子系统,被配置为收集从晶片散射的光并保持散射光的偏振; 光学元件,被配置为将收集在收集子系统的收集数值孔径的不同段中的散射光分离,其中所述光学元件位于所述收集子系统的傅立叶平面或所述傅立叶平面的共轭处; 偏振元件,被配置为基于极化将所述不同段中的一个中的散射光分离成所述散射光的不同部分; 以及检测器,被配置为检测不同的一个。 散射光的一部分并且响应于检测到的光而产生输出,用于检测晶片上的缺陷。