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1. 发明公开

EP1901648A1 IMPLANTABLE CAPACITIVE PRESSURE SENSOR SYSTEM AND METHOD 有权
标题翻译：植入式电容式压力传感器
公开(公告)号：EP1901648A1
公开(公告)日：2008-03-26
申请号：EP06750495.1
申请日：2006-04-14
申请人： MEDTRONIC, INC.
发明人： SCHUGT, Michael, A. , MIESEL, Keith, A. , BURDON, Jeremy, W. , BONDE, Eric, H.
IPC分类号： A61B5/0215
CPC分类号： A61B5/0215 , H01L2224/48227 , H01L2924/15192
摘要： Embodiments of the invention provide systems and methods for an implantable capacitive pressure sensor. Some embodiments of the invention include a capacitive pressure sensor capsule comprising a substrate, a conductive plate functionally coupled to the substrate, a conductive diaphragm spaced from the conductive plate and functionally coupled to the substrate, a lid hermetically sealed against the substrate, and pressure sensing circuitry disposed within a volume generally defined by the lid and the substrate. Embodiments of the invention also include a lead provided with an implantable pressure sensor capsule and a method of manufacturing a capacitive pressure sensor capsule.

2. 发明申请

WO2006115889A1 IMPLANTABLE CAPACITIVE PRESSURE SENSOR SYSTEM AND METHOD 审中-公开
标题翻译：可变电容式压力传感器系统及方法
公开(公告)号：WO2006115889A1
公开(公告)日：2006-11-02
申请号：PCT/US2006/014467
申请日：2006-04-14
申请人： MEDTRONIC, INC. , SCHUGT, Michael, A. , MIESEL, Keith, A. , BURDON, Jeremy, W. , BONDE, Eric, H.
发明人： SCHUGT, Michael, A. , MIESEL, Keith, A. , BURDON, Jeremy, W. , BONDE, Eric, H.
IPC分类号： A61B5/0215
CPC分类号： A61B5/0215 , H01L2224/48227 , H01L2924/15192
摘要： Embodiments of the invention provide systems and methods for an implantable capacitive pressure sensor. Some embodiments of the invention include a capacitive pressure sensor capsule comprising a substrate, a conductive plate functionally coupled to the substrate, a conductive diaphragm spaced from the conductive plate and functionally coupled to the substrate, a lid hermetically sealed against the substrate, and pressure sensing circuitry disposed within a volume generally defined by the lid and the substrate. Embodiments of the invention also include a lead provided with an implantable pressure sensor capsule and a method of manufacturing a capacitive pressure sensor capsule.
摘要翻译：本发明的实施例提供了一种用于可植入电容式压力传感器的系统和方法。本发明的一些实施例包括电容式压力传感器胶囊，其包括基底，功能性地连接到基底的导电板，与导电板间隔开并功能耦合到基底的导电隔膜，密封地抵靠基底的盖子和压力感测设置在通常由盖和基板限定的体积内的电路。本发明的实施例还包括具有可植入压力传感器胶囊的引线和制造电容式压力传感器胶囊的方法。

3. 发明申请

WO2007035332A1 IMPLANTABLE CO-FIRED ELECTRICAL INTERCONNECT SYSTEMS AND DEVICES AND METHODS OF FABRICATION THEREFOR 审中-公开
标题翻译：可植入的电气互连系统及其装置及其制造方法
公开(公告)号：WO2007035332A1
公开(公告)日：2007-03-29
申请号：PCT/US2006/035509
申请日：2006-09-12
申请人： MEDTRONIC, INC. , BURDON, Jeremy, W. , KNOWLES, Shawn, D. , YAMAMOTO, Joyce, K.
发明人： BURDON, Jeremy, W. , KNOWLES, Shawn, D. , YAMAMOTO, Joyce, K.
IPC分类号： A61N1/375 , H01G4/35
CPC分类号： H01G4/35 , A61N1/3754
摘要： ABSTRACT The invention includes a family of miniaturized, hermetic electrical feedthrough assemblies having at least one passive electrical component electrically coupled to a conductive pathway traversing each said assembly which are adapted for implantation within a biological system. The electrical feedthrough assembly according to the invention can be used as a component of an implantable medical device (IMD) such as an implantable pulse generator, cardioverter-defibrillator, physiologic sensor, drug-delivery system and the like. Such assemblies require biocompatibility and resistance to degradation under applied bias current or voltage. Such an assembly is fabricated by interconnected electrical pathways, or vias, of a conductive metallic paste disposed between ceramic green-state material. The layers are stacked together and sintered to form a substantially monolithic dielectric structure with at least one embedded metallization pathway extending through the structure.
摘要翻译：摘要本发明包括一系列小型化，密封的电馈通组件，其具有至少一个无源电部件，其电耦合到横穿每个所述组件的导电通路，其适于植入生物系统内。根据本发明的电馈通组件可以用作可植入式医疗装置（IMD）的组件，例如可植入式脉冲发生器，心律转复除颤器，生理传感器，药物递送系统等。这样的组件需要在施加的偏置电流或电压下的生物相容性和耐劣化性。这种组件由布置在陶瓷绿色材料之间的导电金属膏的互连电路或通孔制成。层叠在一起并烧结以形成具有延伸穿过该结构的至少一个嵌入金属化路径的基本上单片的电介质结构。

4. 发明授权

EP1901648B1 IMPLANTABLE CAPACITIVE PRESSURE SENSOR 有权
标题翻译：植入式电容式压力传感器
公开(公告)号：EP1901648B1
公开(公告)日：2015-03-18
申请号：EP06750495.1
申请日：2006-04-14
申请人： Medtronic, Inc.
发明人： SCHUGT, Michael, A. , MIESEL, Keith, A. , BURDON, Jeremy, W. , BONDE, Eric, H.
IPC分类号： A61B5/0215
CPC分类号： A61B5/0215 , H01L2224/48227 , H01L2924/15192

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