会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明授权
    • Surface mount interposer
    • 表面安装插入器
    • US5491303A
    • 1996-02-13
    • US210509
    • 1994-03-21
    • Michael L. Weiss
    • Michael L. Weiss
    • H05K3/34H05K3/36H05K1/14
    • H05K3/3436H05K3/368H05K2201/049H05K2201/0949H05K2201/10378H05K2201/10477H05K2201/10734Y02P70/613
    • An interposer (100) for connecting two or more printed circuit boards (302, 304) is a circuit-carrying substrate (102) with two or more solder pads (104, 109)on each of two sides (105, 107). Each of the solder pads are connected to an electrically conductive via (106) in the substrate, providing electrical interconnection from one side to the other side. Each solder pad has a solder bump (108) on it. A circuit assembly is made by soldering the solder bumps on one side of the interposer to corresponding solder pads on a printed circuit board (302). The solder bumps on the other side of the interposer are likewise soldered to the corresponding solder pads of a second printed circuit board (304).
    • 用于连接两个或多个印刷电路板(302,304)的插入器(100)是在两侧(105,107)中的每一个上具有两个或更多个焊盘(104,109)的电路承载基板(102)。 每个焊盘连接到衬底中的导电通孔(106),从而提供从一侧到另一侧的电互连。 每个焊盘在其上具有焊料凸块(108)。 通过将插入件的一侧上的焊料凸块焊接到印刷电路板(302)上的相应焊盘来制成电路组件。 插入器另一侧的焊料凸块同样焊接到第二印刷电路板(304)的相应的焊盘上。