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1. 发明申请

US20110303403A1 Flexible Heat Exchanger 审中-公开
标题翻译：柔性换热器
公开(公告)号：US20110303403A1
公开(公告)日：2011-12-15
申请号：US12814175
申请日：2010-06-11
申请人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
发明人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
IPC分类号： F28F21/00 , B21D53/02
CPC分类号： H01L23/4332 , F28F3/12 , F28F2255/02 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： An embodiment of the invention comprises a method for constructing a heat exchanger for cooling one or more semiconductor components. The method comprises the step of providing first and second planar sheets of specified thermally conductive metal foil, wherein each of the sheets has and exterior side and an interior side. The method further comprises forming one or more thermal contact nodes (TCNs) in the first sheet, wherein each TCN extends outward from the exterior side of the first sheet, and comprises a planar contact member and one or more side sections, the side sections respectively including resilient components that enable the contact member of the TCN to move toward and away from the exterior side of the first sheet, and the side sections and contact member of a TCN collectively forming a coolant chamber. Channel segments are configured along the interior side of the first sheet, wherein each channel extends between the coolant chambers and two TCNs, or between the coolant chamber of a TCN and an input port or output port, selectively. The method further comprises joining the interior side of the second sheet to the interior side of the first sheet, in order to form a sealed flow path that includes each channel segment, and enables liquid coolant to flow into and out of the coolant chamber of each TCN.
摘要翻译：本发明的实施例包括一种用于构造用于冷却一个或多个半导体部件的热交换器的方法。该方法包括提供特定导热金属箔的第一和第二平面片的步骤，其中每个片具有外侧和内侧。该方法还包括在第一片材中形成一个或多个热接触节点（TCN），其中每个TCN从第一片材的外侧向外延伸，并且包括平面接触构件和一个或多个侧面部分，侧面部分包括能够使TCN的接触构件朝向和远离第一板的外侧移动的弹性部件，以及TCN的侧部和接触部件共同形成冷却剂室。通道段沿着第一片材的内侧配置，其中每个通道选择性地在冷却剂室和两个TCN之间或TCN的冷却剂室与输入端口或输出端口之间延伸。该方法还包括将第二片材的内侧连接到第一片材的内侧，以便形成包括每个通道段的密封流动路径，并且使液体冷却剂能够流入和流出每个通道段的冷却剂室 TCN。

2. 发明申请

US20120138269A1 DUPLEX FLEXIBLE HEAT EXCHANGER 有权
标题翻译：双重灵活热交换器
公开(公告)号：US20120138269A1
公开(公告)日：2012-06-07
申请号：US12959477
申请日：2010-12-03
申请人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
发明人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
IPC分类号： F28D15/00
CPC分类号： F28D15/00 , F04D13/024 , F04D29/586 , F28F2250/08 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method and system for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.
摘要翻译：公开了一种用于冷却电热源的方法和系统。热交换器具有两个主要子组件。通过设置在热源旁边的第二子组件提供闭环流体流。通过与第二子组件连通的第一子组件提供开环流体流。第一和第二子组件中的每一个具有旋转元件。进入第一子组件的流体流使第一旋转元件旋转，并且旋转元件之间的磁连通引起第二旋转元件的移动，从而实现第二子组件内的流体运动。操作上，闭环子组件从热源移除热量并将其传送到开环子组件，以便在下游流体流中进行随后的热传递。

3. 发明授权

US09170056B2 Duplex flexible heat exchanger 有权
标题翻译：双相柔性换热器
公开(公告)号：US09170056B2
公开(公告)日：2015-10-27
申请号：US12959477
申请日：2010-12-03
申请人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
发明人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
IPC分类号： F04D13/02 , F04D13/04 , H05K7/20 , F28D15/00 , F04D29/58 , H01L23/473
CPC分类号： F28D15/00 , F04D13/024 , F04D29/586 , F28F2250/08 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method and system for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.
摘要翻译：公开了一种用于冷却电热源的方法和系统。热交换器具有两个主要子组件。通过设置在热源旁边的第二子组件提供闭环流体流。通过与第二子组件连通的第一子组件提供开环流体流。第一和第二子组件中的每一个具有旋转元件。进入第一子组件的流体流使第一旋转元件旋转，并且旋转元件之间的磁连通引起第二旋转元件的移动，从而实现第二子组件内的流体运动。操作上，闭环子组件从热源移除热量并将其传送到开环子组件，以便在下游流体流中进行随后的热传递。

4. 发明申请

US20120312510A1 Automatic In Situ Coolant Flow Control in LFT Heat Exchanger 有权
标题翻译： LFT换热器自动现场冷却液流量控制
公开(公告)号：US20120312510A1
公开(公告)日：2012-12-13
申请号：US13157522
申请日：2011-06-10
申请人： Eric A. Eckberg , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Stephen M. Zins
发明人： Eric A. Eckberg , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Stephen M. Zins
IPC分类号： F28D15/00
CPC分类号： H05K7/20281 , F28D15/00 , F28F27/02 , G05D23/1852 , G05D23/1854 , H01L23/3672 , H01L23/3736 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An embodiment of the invention is directed to coolant flow control apparatus, in association with a liquid flow through heat exchanger situated to cool one or more electronic or other device. The apparatus comprises a first input channel for carrying liquid coolant to a first input of the heat exchanger, and further comprises a flow control device positioned along a flow path that includes the first input channel. The flow control device is provided with a gating element supported for selected movement across the flow path, in order to selectively vary the amount of coolant moving through the flow path. The apparatus further include an actuator located in the flow control device that comprises a metal component which is directly tied to the gating element, wherein the metal component changes its shape in response to specified changes in coolant temperature, and a given change in the shape of the metal component acts to selectively move the gating element with respect to the flow path.
摘要翻译：本发明的一个实施方案涉及冷却剂流动控制装置，其与通过热交换器的液体流相关联，该热交换器位于用于冷却一个或多个电子装置或其它装置。该装置包括用于将液体冷却剂携带到热交换器的第一输入端的第一输入通道，并且还包括沿着包括第一输入通道的流动路径定位的流量控制装置。流量控制装置设置有用于选择性地跨越流动路径运动的选通元件，以选择性地改变通过流动路径移动的冷却剂的量。该装置还包括位于流量控制装置中的致动器，其包括直接连接到选通元件的金属部件，其中金属部件响应于冷却剂温度的指定变化而改变其形状，并且给定的形状变化金属部件用于相对于流动路径选择性地移动浇注元件。

5. 发明授权

US08636052B2 Dual-fluid heat exchanger 失效
标题翻译：双流体换热器
公开(公告)号：US08636052B2
公开(公告)日：2014-01-28
申请号：US12555588
申请日：2009-09-08
申请人： Eric Kline , Paul N. Krystek , Paul R. Michels , Susan J. Swenson , Stephen M. Zins
发明人： Eric Kline , Paul N. Krystek , Paul R. Michels , Susan J. Swenson , Stephen M. Zins
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： F28D15/00 , F28F23/00 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit dual-fluid heat exchanger has a housing containing first and second immiscible fluids. A heat-introducing base element contacts the first fluid. A heat-receiving surface on the base element is configured for interfacial contact with a heat-radiating surface of an integrated circuit device. A heat-removing condenser element contacts the second fluid, or is separated therefrom by a gap. The first and second fluids are selected to controllably remove heat from the integrated circuit device by forming heated mass units of the first fluid that migrate through the second fluid and come into contact with the condenser element, where they are cooled and allowed to return to the base element. A heat-expulsion portion on the condenser element is configured to dissipate heat removed by the condenser element to an exterior environment outside the heat exchanger.
摘要翻译：集成电路双流体热交换器具有容纳第一和第二不混溶流体的壳体。导热基体元件接触第一流体。基座元件上的受热表面构造成与集成电路器件的散热表面的界面接触。除热电容器元件接触第二流体，或者通过间隙与其分离。选择第一和第二流体以通过形成迁移穿过第二流体并与冷凝器元件接触的第一流体的加热质量单元来控制地从集成电路装置移除热量，在那里它们被冷却并允许其返回到基本元素冷凝器元件上的散热部分构造成将由冷凝器元件移除的热量散发到热交换器外部的外部环境。

6. 发明申请

US20110056655A1 Dual-Fluid Heat Exhanger 失效
标题翻译：双流体热交换器
公开(公告)号：US20110056655A1
公开(公告)日：2011-03-10
申请号：US12555588
申请日：2009-09-08
申请人： Eric Kline , Paul N. Krystek , Paul R. Michels , Susan J. Swenson , Stephen M. Zins
发明人： Eric Kline , Paul N. Krystek , Paul R. Michels , Susan J. Swenson , Stephen M. Zins
IPC分类号： F28D15/00
CPC分类号： F28D15/00 , F28F23/00 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit dual-fluid heat exchanger has a housing containing first and second immiscible fluids. A heat-introducing base element contacts the first fluid. A heat-receiving surface on the base element is configured for interfacial contact with a heat-radiating surface of an integrated circuit device. A heat-removing condenser element contacts the second fluid, or is separated therefrom by a gap. The first and second fluids are selected to controllably remove heat from the integrated circuit device by forming heated mass units of the first fluid that migrate through the second fluid and come into contact with the condenser element, where they are cooled and allowed to return to the base element. A heat-expulsion portion on the condenser element is configured to dissipate heat removed by the condenser element to an exterior environment outside the heat exchanger.
摘要翻译：集成电路双流体热交换器具有容纳第一和第二不混溶流体的壳体。导热基体元件接触第一流体。基座元件上的受热表面构造成与集成电路器件的散热表面的界面接触。除热电容器元件接触第二流体，或者通过间隙与其分离。选择第一和第二流体以通过形成迁移穿过第二流体并与冷凝器元件接触的第一流体的加热质量单元来控制地从集成电路器件移除热量，在那里它们被冷却并允许其返回到基本元素冷凝器元件上的散热部分构造成将由冷凝器元件移除的热量散发到热交换器外部的外部环境。

7. 发明授权

US08840034B2 Automatic in situ coolant flow control in LFT heat exchanger 有权
标题翻译： LFT热交换器中的自动原位冷却液流量控制
公开(公告)号：US08840034B2
公开(公告)日：2014-09-23
申请号：US13157522
申请日：2011-06-10
申请人： Eric Alan Eckberg , Eric Vance Kline , Paul N. Krystek , Michael Robert Rasmussen , Stephen M. Zins
发明人： Eric Alan Eckberg , Eric Vance Kline , Paul N. Krystek , Michael Robert Rasmussen , Stephen M. Zins
IPC分类号： G05D23/02
CPC分类号： H05K7/20281 , F28D15/00 , F28F27/02 , G05D23/1852 , G05D23/1854 , H01L23/3672 , H01L23/3736 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An embodiment of the invention is directed to coolant flow control apparatus, in association with a liquid flow through heat exchanger situated to cool one or more electronic or other device. The apparatus comprises a first input channel for carrying liquid coolant to a first input of the heat exchanger, and further comprises a flow control device positioned along a flow path that includes the first input channel. The flow control device is provided with a gating element supported for selected movement across the flow path, in order to selectively vary the amount of coolant moving through the flow path. The apparatus further include an actuator located in the flow control device that comprises a metal component which is directly tied to the gating element, wherein the metal component changes its shape in response to specified changes in coolant temperature, and a given change in the shape of the metal component acts to selectively move the gating element with respect to the flow path.
摘要翻译：本发明的一个实施方案涉及冷却剂流动控制装置，其与通过热交换器的液体流相关联，该热交换器位于用于冷却一个或多个电子装置或其它装置。该装置包括用于将液体冷却剂携带到热交换器的第一输入端的第一输入通道，并且还包括沿着包括第一输入通道的流动路径定位的流量控制装置。流量控制装置设置有用于选择性地跨越流动路径运动的选通元件，以选择性地改变通过流动路径移动的冷却剂的量。该装置还包括位于流量控制装置中的致动器，其包括直接连接到选通元件的金属部件，其中金属部件响应于冷却剂温度的指定变化而改变其形状，并且给定的形状变化金属部件用于相对于流动路径选择性地移动浇注元件。

8. 发明申请

US20110310566A1 FLUX-FREE DETACHABLE THERMAL INTERFACE BETWEEN AN INTERGRATED CIRCUIT DEVICE AND A HEAT SINK 失效
标题翻译：集成电路设备与散热器之间的无通路可拆卸热接口
公开(公告)号：US20110310566A1
公开(公告)日：2011-12-22
申请号：US12819753
申请日：2010-06-21
申请人： Maurice Francis Holahan , Eric Vance Kline , Paul N. Krystek , Michael Robert Rasmussen , Arvind Kumar Sinha , Stephen M. Zins
发明人： Maurice Francis Holahan , Eric Vance Kline , Paul N. Krystek , Michael Robert Rasmussen , Arvind Kumar Sinha , Stephen M. Zins
IPC分类号： H05K7/20 , H05K3/20
CPC分类号： H05K7/20472 , H01L23/433 , H01L2924/0002 , Y10T29/49128 , H01L2924/00
摘要： A thermal flow material-free thermally conductive interface between a mounted integrated circuit device and a heat sink that comprises a mounted integrated circuit device, a heat sink vertically disposed over the device, a vertically compressible thermally conductive member unattachably disposed between the device and the heat sink, and an unattached frame member horizontally enclosing the compressible member.
摘要翻译：在安装的集成电路器件和散热器之间的无热流材料的导热接口，其包括安装的集成电路器件，垂直设置在器件上的散热器，不可靠地设置在器件和热量之间的可垂直压缩的导热部件水槽和水平地包围可压缩构件的未连接的框架构件。

9. 发明授权

US09619774B2 Product tracking system 有权
公开(公告)号：US09619774B2
公开(公告)日：2017-04-11
申请号：US13224231
申请日：2011-09-01
申请人： Eric Alan Eckberg , Eric Vance Kline , Paul N. Krystek , Nathan Carl Mandelko , Michael Robert Rasmussen , Arvind Kumar Sinha , Stephen M. Zins
发明人： Eric Alan Eckberg , Eric Vance Kline , Paul N. Krystek , Nathan Carl Mandelko , Michael Robert Rasmussen , Arvind Kumar Sinha , Stephen M. Zins
IPC分类号： G06F7/00 , G06F17/30 , G06Q10/08 , G06F21/35 , G06F21/62
CPC分类号： G06Q10/0833 , G06F21/35 , G06F21/6209 , G06F2221/2101
摘要： A method, programmed medium and system are disclosed which provide increased secure tracking of materials and products through the use of a unique coding scheme. The coding scheme contains a unique security code identifier issued by a sole certification agency, and includes a non-coded scheme for public information, and a coded scheme for private information regarding the sourcing and development of materials and products. The disclosure provides for full tracking of a product throughout the supply chain by only certified participants. The disclosed system allows for increased secure tracking of materials and products, and allows for access to greater amounts of information at various stages of manufacture and/or assembly regarding a given material or product.

10. 发明申请

US20130060813A1 PRODUCT TRACKING SYSTEM 有权
标题翻译：产品追踪系统
公开(公告)号：US20130060813A1
公开(公告)日：2013-03-07
申请号：US13224231
申请日：2011-09-01
申请人： Eric Alan Eckberg , Eric Vance Kline , Paul N. Krystek , Nathan Carl Mandelko , Michael Robert Rasmussen , Arvind Kumar Sinha , Stephen M. Zins
发明人： Eric Alan Eckberg , Eric Vance Kline , Paul N. Krystek , Nathan Carl Mandelko , Michael Robert Rasmussen , Arvind Kumar Sinha , Stephen M. Zins
IPC分类号： G06F17/30
CPC分类号： G06Q10/0833 , G06F21/35 , G06F21/6209 , G06F2221/2101
摘要： A method, programmed medium and system are disclosed which provide increased secure tracking of materials and products through the use of a unique coding scheme. The coding scheme contains a unique security code identifier issued by a sole certification agency, and includes a non-coded scheme for public information, and a coded scheme for private information regarding the sourcing and development of materials and products. The disclosure provides for full tracking of a product throughout the supply chain by only certified participants. The disclosed system allows for increased secure tracking of materials and products, and allows for access to greater amounts of information at various stages of manufacture and/or assembly regarding a given material or product.
摘要翻译：公开了一种通过使用唯一编码方案提供对材料和产品的安全跟踪的方法，编程介质和系统。编码方案包含由唯一的认证机构签发的唯一的安全代码标识符，并且包括用于公开信息的非编码方案，以及关于材料和产品的采购和开发的私人信息的编码方案。本披露提供了只有认证参与者在整个供应链中完全跟踪产品。所公开的系统允许增加对材料和产品的安全跟踪，并允许在关于给定材料或产品的制造和/或组装的各个阶段获得更多量的信息。

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