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1. 发明授权

US08636052B2 Dual-fluid heat exchanger 失效
标题翻译：双流体换热器
公开(公告)号：US08636052B2
公开(公告)日：2014-01-28
申请号：US12555588
申请日：2009-09-08
申请人： Eric Kline , Paul N. Krystek , Paul R. Michels , Susan J. Swenson , Stephen M. Zins
发明人： Eric Kline , Paul N. Krystek , Paul R. Michels , Susan J. Swenson , Stephen M. Zins
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： F28D15/00 , F28F23/00 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit dual-fluid heat exchanger has a housing containing first and second immiscible fluids. A heat-introducing base element contacts the first fluid. A heat-receiving surface on the base element is configured for interfacial contact with a heat-radiating surface of an integrated circuit device. A heat-removing condenser element contacts the second fluid, or is separated therefrom by a gap. The first and second fluids are selected to controllably remove heat from the integrated circuit device by forming heated mass units of the first fluid that migrate through the second fluid and come into contact with the condenser element, where they are cooled and allowed to return to the base element. A heat-expulsion portion on the condenser element is configured to dissipate heat removed by the condenser element to an exterior environment outside the heat exchanger.
摘要翻译：集成电路双流体热交换器具有容纳第一和第二不混溶流体的壳体。导热基体元件接触第一流体。基座元件上的受热表面构造成与集成电路器件的散热表面的界面接触。除热电容器元件接触第二流体，或者通过间隙与其分离。选择第一和第二流体以通过形成迁移穿过第二流体并与冷凝器元件接触的第一流体的加热质量单元来控制地从集成电路装置移除热量，在那里它们被冷却并允许其返回到基本元素冷凝器元件上的散热部分构造成将由冷凝器元件移除的热量散发到热交换器外部的外部环境。

2. 发明申请

US20110056655A1 Dual-Fluid Heat Exhanger 失效
标题翻译：双流体热交换器
公开(公告)号：US20110056655A1
公开(公告)日：2011-03-10
申请号：US12555588
申请日：2009-09-08
申请人： Eric Kline , Paul N. Krystek , Paul R. Michels , Susan J. Swenson , Stephen M. Zins
发明人： Eric Kline , Paul N. Krystek , Paul R. Michels , Susan J. Swenson , Stephen M. Zins
IPC分类号： F28D15/00
CPC分类号： F28D15/00 , F28F23/00 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit dual-fluid heat exchanger has a housing containing first and second immiscible fluids. A heat-introducing base element contacts the first fluid. A heat-receiving surface on the base element is configured for interfacial contact with a heat-radiating surface of an integrated circuit device. A heat-removing condenser element contacts the second fluid, or is separated therefrom by a gap. The first and second fluids are selected to controllably remove heat from the integrated circuit device by forming heated mass units of the first fluid that migrate through the second fluid and come into contact with the condenser element, where they are cooled and allowed to return to the base element. A heat-expulsion portion on the condenser element is configured to dissipate heat removed by the condenser element to an exterior environment outside the heat exchanger.
摘要翻译：集成电路双流体热交换器具有容纳第一和第二不混溶流体的壳体。导热基体元件接触第一流体。基座元件上的受热表面构造成与集成电路器件的散热表面的界面接触。除热电容器元件接触第二流体，或者通过间隙与其分离。选择第一和第二流体以通过形成迁移穿过第二流体并与冷凝器元件接触的第一流体的加热质量单元来控制地从集成电路器件移除热量，在那里它们被冷却并允许其返回到基本元素冷凝器元件上的散热部分构造成将由冷凝器元件移除的热量散发到热交换器外部的外部环境。

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