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    • 3. 发明申请
    • DATA MODEL ACCESS CONFIGURATION AND CUSTOMIZATION
    • 数据模型访问配置和自定义
    • US20110153624A1
    • 2011-06-23
    • US12642286
    • 2009-12-18
    • Werner AignerRalf EhretRoman Moehl
    • Werner AignerRalf EhretRoman Moehl
    • G06F17/30
    • G06F17/3056
    • Apparatus, systems, and methods may operate to publish one or more stored back end data models accessible to a user interface and a development environment; to receive a configuration context; to generate derived model attributes by filtering, according to the configuration context, back end data attributes associated with the stored back end data models; to derive a set of mapping rules based on the derived model attributes; and store the set of mapping rules to be used to direct run-time data model request transformation activity. Further activities may include receiving an end-user request from a displayed user interface, transforming the end-user request into a transformed request according to the stored set of mapping rules, and transmitting the transformed request to one of the stored back end data models. Additional apparatus, systems, and methods are disclosed.
    • 设备,系统和方法可以操作以发布用户界面和开发环境可访问的一个或多个存储的后端数据模型; 接收配置上下文; 通过根据配置上下文过滤与所存储的后端数据模型相关联的后端数据属性来生成派生模型属性; 基于导出的模型属性导出一组映射规则; 并存储要用于指导运行时数据模型请求转换活动的映射规则集。 进一步的活动可以包括从显示的用户界面接收最终用户请求,根据所存储的映射规则集将终端用户请求转换成变换后的请求,并将转换的请求发送到所存储的后端数据模型之一。 公开了附加装置,系统和方法。
    • 4. 发明申请
    • Framework for a composite application and a method of implementing a frame work for a composite application
    • 组合应用程序的框架和实现组合应用程序框架工作的方法
    • US20070033088A1
    • 2007-02-08
    • US10550446
    • 2004-03-22
    • Werner AignerJuergen ZimmermannJoerg Beringer
    • Werner AignerJuergen ZimmermannJoerg Beringer
    • G06Q99/00G06F15/02G06F9/46
    • G06F9/54G06F8/20G06Q10/06G06Q10/067G06Q10/10H04L69/32
    • A framework (200, 300) for a composite application, the framework (200, 300) including: an object access layer (210, 330) operable to exchange data with a plurality of enterprise base systems (290a, b . . . z, 390a, b . . . z) and to present the data to a composite application through a uniform interface; a business object modelling layer (146, 410) including a business object modeller (146, 410) operable to provide a user interface for constructing a business object; the framework (200, 300) further including: a service layer (220, 340) operable to provide services to the composite application, wherein the service layer (220, 340) includes a collaboration services module (344) operable to provide a plurality of collaboration services to the composite application, wherein the object modelling layer (146, 410) is operable to directly link at least one of the plurality of collaboration services associated with the business object to the business object.
    • 一种用于复合应用的框架(200,300),所述框架(200,300)包括:对象访问层(210,330),可操作以与多个企业基础系统(290a,...,... z)交换数据 ,390 a,b。z),并通过统一的界面将数据呈现给复合应用程序; 业务对象建模层(146,410),包括可操作以提供用于构建业务对象的用户界面的业务对象建模器(146,410); 所述框架(200,300)还包括:可操作以向所述组合应用提供服务的服务层(220,340),其中所述服务层(220,340)包括协作服务模块(344),所述协作服务模块可操作以提供多个 协作服务到复合应用,其中对象建模层(146,410)可操作以将与业务对象相关联的多个协作服务中的至少一个直接链接到业务对象。
    • 5. 发明授权
    • Semiconductor wafer and process for producing a semiconductor wafer
    • 用于制造半导体晶片的半导体晶片和工艺
    • US07387963B2
    • 2008-06-17
    • US11487653
    • 2006-07-17
    • Rudolf RuppWerner AignerFriedrich Passek
    • Rudolf RuppWerner AignerFriedrich Passek
    • H01L21/302
    • H01L21/67219B24B9/065H01L21/02021H01L2924/0002H01L2924/00
    • A semiconductor wafer has an edge region with no defects larger than or equal to 0.3 μm. The wafers are produced by a process, comprising (a) providing a semiconductor wafer having a rounded and etched edge; (b) polishing the edge of the semiconductor wafer, in which step the semiconductor wafer, which is held on a centrally rotating chuck and projects beyond the chuck and at least one polishing drum which is inclined by a specific angle with respect to the chuck, rotates centrally and is covered with a polishing cloth, are moved toward one another and pressed onto one another under a specific contact pressure with a polishing abrasive being supplied continuously; (c) cleaning the semiconductor wafer; (d) inspecting an edge region of the semiconductor wafer using an inspection unit; and (e) further processing the semiconductor wafer.
    • 半导体晶片具有没有大于或等于0.3μm的缺陷的边缘区域。 晶片通过一种工艺制造,包括(a)提供具有圆形和蚀刻边缘的半导体晶片; (b)抛光半导体晶片的边缘,其中保持在中心旋转卡盘上并突出超过卡盘的半导体晶片和相对于卡盘倾斜特定角度的至少一个抛光滚筒, 旋转中心并用抛光布覆盖,彼此相向移动并在特定的接触压力下相互压制,并连续供应抛光磨料; (c)清洁半导体晶片; (d)使用检查单元检查半导体晶片的边缘区域; 和(e)进一步处理半导体晶片。
    • 8. 发明授权
    • Data model access configuration and customization
    • 数据模型访问配置和定制
    • US08818975B2
    • 2014-08-26
    • US12642286
    • 2009-12-18
    • Werner AignerRalf EhretRoman Moehl
    • Werner AignerRalf EhretRoman Moehl
    • G06F17/30
    • G06F17/3056
    • Apparatus, systems, and methods may operate to publish one or more stored back end data models accessible to a user interface and a development environment; to receive a configuration context; to generate derived model attributes by filtering, according to the configuration context, back end data attributes associated with the stored back end data models; to derive a set of mapping rules based on the derived model attributes; and store the set of mapping rules to be used to direct run-time data model request transformation activity. Further activities may include receiving an end-user request from a displayed user interface, transforming the end-user request into a transformed request according to the stored set of mapping rules, and transmitting the transformed request to one of the stored back end data models. Additional apparatus, systems, and methods are disclosed.
    • 设备,系统和方法可以操作以发布用户界面和开发环境可访问的一个或多个存储的后端数据模型; 接收配置上下文; 通过根据配置上下文过滤与所存储的后端数据模型相关联的后端数据属性来生成派生模型属性; 基于导出的模型属性导出一组映射规则; 并存储要用于指导运行时数据模型请求转换活动的映射规则集。 进一步的活动可以包括从显示的用户界面接收最终用户请求,根据所存储的映射规则集将终端用户请求转换成变换后的请求,并将转换的请求发送到所存储的后端数据模型之一。 公开了附加装置,系统和方法。
    • 10. 发明申请
    • Semiconductor wafer and process for producing a semiconductor wafer
    • 用于制造半导体晶片的半导体晶片和工艺
    • US20070017900A1
    • 2007-01-25
    • US11487653
    • 2006-07-17
    • Rudolf RuppWerner AignerFriedrich Passek
    • Rudolf RuppWerner AignerFriedrich Passek
    • C03C15/00H01L21/461C23F1/00
    • H01L21/67219B24B9/065H01L21/02021H01L2924/0002H01L2924/00
    • A semiconductor wafer has an edge region with no defects larger than or equal to 0.3 μm. The wafers are produced by a process, comprising (a) providing a semiconductor wafer having a rounded and etched edge; (b) polishing the edge of the semiconductor wafer, in which step the semiconductor wafer, which is held on a centrally rotating chuck and projects beyond the chuck and at least one polishing drum which is inclined by a specific angle with respect to the chuck, rotates centrally and is covered with a polishing cloth, are moved toward one another and pressed onto one another under a specific contact pressure with a polishing abrasive being supplied continuously; (c) cleaning the semiconductor wafer; (d) inspecting an edge region of the semiconductor wafer using an inspection unit; and (e) further processing the semiconductor wafer.
    • 半导体晶片具有没有大于或等于0.3μm的缺陷的边缘区域。 晶片通过一种工艺制造,包括(a)提供具有圆形和蚀刻边缘的半导体晶片; (b)抛光半导体晶片的边缘,其中保持在中心旋转卡盘上并突出超过卡盘的半导体晶片和相对于卡盘倾斜特定角度的至少一个抛光滚筒, 旋转中心并用抛光布覆盖,彼此相向移动并在特定的接触压力下相互压制,并连续供应抛光磨料; (c)清洁半导体晶片; (d)使用检查单元检查半导体晶片的边缘区域; 和(e)进一步处理半导体晶片。