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1. 发明授权

US6107181A Method of forming bumps and template used for forming bumps 失效
公开(公告)号：US6107181A
公开(公告)日：2000-08-22
申请号：US015265
申请日：1998-01-29
申请人： Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka
发明人： Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka
IPC分类号： B23K26/10 , B23K26/38 , C03C15/00 , C03C23/00 , H01L21/60 , H01L21/68 , H05K3/00 , H05K3/34 , H01L21/44
CPC分类号： B23K26/10 , B23K26/382 , B23K26/40 , B23K26/402 , C03C15/00 , C03C23/0025 , H01L21/6835 , H01L24/11 , H05K3/3478 , B23K2203/16 , B23K2203/30 , B23K2203/42 , B23K2203/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2224/75 , H01L2224/75743 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01033 , H01L2924/01047 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/15311 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/0525 , H05K2203/082 , H05K2203/107 , H05K3/002 , H05K3/0029 , H05K3/0055 , Y10S438/963 , Y10T29/49144
摘要： A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.

2. 发明授权

US06432806B1 Method of forming bumps and template used for forming bumps 失效
标题翻译：形成凸块的方法和用于形成凸块的模板
公开(公告)号：US06432806B1
公开(公告)日：2002-08-13
申请号：US09417770
申请日：1999-10-14
申请人： Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka
发明人： Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka
IPC分类号： H01L2144
CPC分类号： B23K26/10 , B23K26/382 , B23K26/40 , B23K2103/16 , B23K2103/30 , B23K2103/42 , B23K2103/50 , C03C15/00 , C03C23/0025 , H01L21/6835 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2224/75 , H01L2224/75743 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01033 , H01L2924/01047 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/15311 , H05K3/002 , H05K3/0029 , H05K3/0055 , H05K3/3478 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/0525 , H05K2203/082 , H05K2203/107 , Y10S438/963 , Y10T29/49144 , H01L2924/00 , H01L2224/05599
摘要： A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.
摘要翻译：公开了一种制造具有通过真空抽吸吸引和支撑导电球的通孔的模板的方法。通过蚀刻形成通孔，并且通过激光束使通孔的侧壁平滑通孔的侧壁。可以使用该方法形成模板和金属凸块。或者，模板可以形成为两层结构。

3. 发明授权

US06320158B1 Method and apparatus of fabricating perforated plate 失效
标题翻译：制造多孔板的方法和装置
公开(公告)号：US06320158B1
公开(公告)日：2001-11-20
申请号：US09231485
申请日：1999-01-14
申请人： Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka , Fumihiko Tokura
发明人： Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka , Fumihiko Tokura
IPC分类号： B23K2638
CPC分类号： B23K26/382 , B23K26/10 , B23K26/40 , B23K2103/16 , B23K2103/30 , B23K2103/42 , B23K2103/50 , C03C15/00 , C03C23/0025 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2224/742 , H01L2224/75 , H01L2224/75745 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/014 , H01L2924/07802 , H05K3/0029 , H05K3/3478 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/082 , H01L2924/00 , H01L2224/05599
摘要： A method of forming bumps onto a chip having electrodes. The method includes the use of a template having through-holes arranged in correspondence to the electrodes of the chip. The template holds conductive balls to be formed into bumps to the template at the through-holes by vacuum suction. The through-holes of the template are formed by a laser, by supporting a glass plate on a support table having cavities and irradiating the plate with laser beams at the position of the cavities.
摘要翻译：在具有电极的芯片上形成凸块的方法。该方法包括使用具有对应于芯片的电极布置的通孔的模板。该模板通过真空抽吸保持在通孔处形成与模板的凸起的导电球。模板的通孔由激光器形成，通过将玻璃板支撑在具有空腔的支撑台上，并且在空腔的位置处用激光束照射该板。

4. 发明申请

US20090044972A1 Circuit board, method of forming wiring pattern, and method of manufacturing circuit board 审中-公开
标题翻译：电路板，布线图案的形成方法以及电路板的制造方法
公开(公告)号：US20090044972A1
公开(公告)日：2009-02-19
申请号：US12155261
申请日：2008-05-30
申请人： Masayuki Kitajima , Takeshi Ishitsuka , Satoshi Emoto , Yutaka Noda , Seiichi Shimoura
发明人： Masayuki Kitajima , Takeshi Ishitsuka , Satoshi Emoto , Yutaka Noda , Seiichi Shimoura
IPC分类号： H05K3/12 , H05K1/09
CPC分类号： H05K1/095 , H05K1/117 , H05K1/118 , H05K3/1283 , H05K3/249 , H05K2201/0129 , H05K2201/035 , H05K2201/2009 , H05K2203/0278 , H05K2203/1105
摘要： When manufacturing a circuit board, a wiring pattern is printed on a substrate with a conductive paste formed of metal powder and thermoplastic resin, and then the conductive paste is subjected to a heating treatment and a pressing treatment.
摘要翻译：当制造电路板时，使用由金属粉末和热塑性树脂形成的导电膏将基板上印刷布线图案，然后对导电浆进行加热处理和压制处理。

5. 发明申请

US20080102294A1 Electrically conductive paste and method of making the same 审中-公开
标题翻译：导电胶及其制作方法
公开(公告)号：US20080102294A1
公开(公告)日：2008-05-01
申请号：US11790136
申请日：2007-04-24
申请人： Masayuki Kitajima , Yutaka Noda
发明人： Masayuki Kitajima , Yutaka Noda
IPC分类号： H01B1/22 , B32B15/04 , B44C1/22 , C23F1/16
CPC分类号： H05K1/095 , C09D11/52 , C23C28/00 , C23C30/00 , H01B1/22 , H05K2203/0789 , Y10T428/31678
摘要： Metallic powder particles disperse in paste matrix made of resin material. The metallic powder particles each defines a dissolved surface layer having reacted with acid solution. The metallic powder particles having reacted with acid solution is allowed to have a high electrical conductivity. The electrically conductive paste containing the mentioned metallic powder particles is also allowed to exhibit a sufficiently high electrical conductivity. The electrically conductive paste can thus be used for establishment of a fine wiring pattern and establishment of a wiring pattern for a high speed signal, for example. Moreover, the electrically conductive paste can easily be applied to a resin sheet in a predetermined pattern based on silk-screen printing, for example. The electrically conductive paste can be employed in various applications.
摘要翻译：金属粉末颗粒分散在由树脂材料制成的糊状基质中。金属粉末颗粒各自限定了与酸溶液反应的溶解表面层。与酸溶液反应的金属粉末颗粒被允许具有高导电性。含有所述金属粉末颗粒的导电性糊料也可以表现出足够高的导电性。因此，导电性糊剂可以用于建立精细布线图案，并且例如建立用于高速信号的布线图案。此外，例如，导电性糊剂可以容易地以基于丝网印刷的预定图案施加到树脂片材上。导电糊可用于各种应用。

6. 发明授权

US06744183B2 Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method 失效
标题翻译：压电元件与电极的接合方法以及使用该接合方法的压电微型致动器
公开(公告)号：US06744183B2
公开(公告)日：2004-06-01
申请号：US10347708
申请日：2003-01-21
申请人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
发明人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
IPC分类号： H01L41047
CPC分类号： H01L41/29 , G11B5/5552 , G11B5/5556 , H01L41/0993 , H01L2224/48091 , H01L2224/73265 , H01L2924/01327 , Y10T29/42 , H01L2924/00014 , H01L2924/00
摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.
摘要翻译：一种键合压电元件和电极的方法，包括以下步骤：在压电元件的接合表面上形成选自Au，Al，Zn，Cu和Sn的材料的第一涂层，并形成在电极的接合表面上第二次涂覆选自Au，Al，Zn，Cu和Sn的材料。第一和第二涂层的材料的组合优选为Au / Au，Au / Al，Zn / Cu或Sn / Cu。该方法还包括使第一和第二涂层彼此紧密接触并在压力下加热它们以在第一和第二涂层之间形成金属键或金属间化合物，从而结合压电元件和电极的步骤。

7. 发明授权

US06893512B2 Solder alloy and soldered bond 有权
标题翻译：焊接合金和焊接焊接
公开(公告)号：US06893512B2
公开(公告)日：2005-05-17
申请号：US10356546
申请日：2003-02-03
申请人： Masayuki Kitajima , Tadaaki Shono , Masakazu Takesue , Yutaka Noda
发明人： Masayuki Kitajima , Tadaaki Shono , Masakazu Takesue , Yutaka Noda
IPC分类号： B23K35/02 , B23K35/26 , C22C13/00 , H05K3/34
CPC分类号： B23K35/262 , B23K35/025 , B23K2101/36 , H05K3/3463
摘要： A solder alloy having a solderability comparable to that of a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.
摘要翻译：具有与常规Pb-Sn焊料合金相当的可焊性的焊料合金，而不会对环境产生不利影响，并且使用焊料合金。由Zn：4.0〜10.0重量％，In：1.0〜15.0重量％，Al：0.0020〜0.0100重量％，Sn和不可避免的杂质构成的焊料合金。由上述焊料合金构成的电气或电子设备的焊接结合体。

8. 发明授权

US06361626B1 Solder alloy and soldered bond 有权
标题翻译：焊接合金和焊接焊接
公开(公告)号：US06361626B1
公开(公告)日：2002-03-26
申请号：US09839371
申请日：2001-04-23
申请人： Masayuki Kitajima , Hitoshi Homma , Masakazu Takesue , Tadaaki Shono , Yutaka Noda
发明人： Masayuki Kitajima , Hitoshi Homma , Masakazu Takesue , Tadaaki Shono , Yutaka Noda
IPC分类号： C22C1300
CPC分类号： C22C13/00 , B23K35/262 , C22C13/02
摘要： A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb—Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys.
摘要翻译：无铅焊料合金和使用其的焊接焊料，其中焊料合金没有有害的环境效应，但具有与常规Pb-Sn焊料合金相当的可焊性。本发明的焊料合金由Zn：3.0〜14.0重量％，Al：0.0020〜0.0080重量％，余量由Sn和不可避免的杂质构成，Zn：3.0〜14.0重量％，Bi：3.0-6.0 wt％，Al：0.0020-0.0100wt％，余量为Sn和不可避免的杂质。本发明的焊接键由本发明的焊料合金中的任一种组成。

9. 发明授权

US06467141B2 Method of assembling micro-actuator 失效
标题翻译：组合微致动器的方法
公开(公告)号：US06467141B2
公开(公告)日：2002-10-22
申请号：US09820553
申请日：2001-03-29
申请人： Toru Okada , Kenji Iketaki , Hidehiko Kobayashi , Yutaka Noda , Masayuki Kitajima , Seiichi Shimoura , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka , Masanao Fujii
发明人： Toru Okada , Kenji Iketaki , Hidehiko Kobayashi , Yutaka Noda , Masayuki Kitajima , Seiichi Shimoura , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka , Masanao Fujii
IPC分类号： H04R1710
CPC分类号： G11B5/5552 , H01L41/313 , Y10T29/42 , Y10T29/49025 , Y10T29/49055
摘要： A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing. Finally, the adhered laminate thus obtained is placed in a heating furnace, and is heated at a predetermined temperature for a predetermined period of time, whereby each of the adhesives is fully cured.
摘要翻译：提供了一种组装微致动器的方法，其中具有多个致动器基座的基架被放置在台架上，第一粘合剂被施加到每个致动器基座，以及具有多个基极的基极框架被放置在第一粘合剂上。第一粘合剂通过加热和压制半固化。将第二粘合剂施加到每个基底电极上，并且将多个压电元件放置在第二粘合剂上。第二粘合剂通过加热和压制半固化。将第三粘合剂施加到压电元件，并且具有多个可移动电极的可动电极框架放置在第三粘合剂上。第三粘合剂通过加热和压制半固化。接下来，将第四粘合剂施加到每个可移动电极，并且具有多个铰链板的铰链板框架放置在第四粘合剂上。第四粘合剂通过加热和加压半固化。最后，将如此获得的粘合层压材料放置在加热炉中，并在预定温度下加热预定的时间，从而使各种粘合剂完全固化。

10. 发明授权

US06541898B2 Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method 失效
公开(公告)号：US06541898B2
公开(公告)日：2003-04-01
申请号：US09822636
申请日：2001-03-30
申请人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
发明人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
IPC分类号： H01L41047
CPC分类号： H01L41/29 , G11B5/5552 , G11B5/5556 , H01L41/0993 , H01L2224/48091 , H01L2224/73265 , H01L2924/01327 , Y10T29/42 , H01L2924/00014 , H01L2924/00
摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

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