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1. 发明授权

US06428911B2 Soldering method and soldered joint 有权
公开(公告)号：US06428911B2
公开(公告)日：2002-08-06
申请号：US09930245
申请日：2001-08-16
申请人： Masayuki Kitajima , Masakazu Takesue , Tadaaki Shono , Motoko Fujioka
发明人： Masayuki Kitajima , Masakazu Takesue , Tadaaki Shono , Motoko Fujioka
IPC分类号： B23K120
CPC分类号： B23K35/262 , B23K1/002 , B23K1/20 , H05K3/282 , H05K3/3463 , Y10T428/12903
摘要： The present invention provides a soldering method and a soldered joint securing a strength of joint equivalent to soldering using a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and without causing a rise in cost. A soldering method comprising a step of covering Cu electrodes of electronic equipment by a rust-proofing coating consisting of an organic compound including N and a step of forming soldered joints on the covered Cu electrodes, by using a solder material consisting of at least 2.0 wt % and less than 3 wt % of Ag, 0.5 to 0.8 wt % of Cu, and a balance of Sn and unavoidable impurities. The solder material used in the present invention further contains not more than 3 wt % in total of at least one element selected from the group consisting of Sb, In, Au, Zn, Bi, and Al.

2. 发明授权

US06893512B2 Solder alloy and soldered bond 有权
标题翻译：焊接合金和焊接焊接
公开(公告)号：US06893512B2
公开(公告)日：2005-05-17
申请号：US10356546
申请日：2003-02-03
申请人： Masayuki Kitajima , Tadaaki Shono , Masakazu Takesue , Yutaka Noda
发明人： Masayuki Kitajima , Tadaaki Shono , Masakazu Takesue , Yutaka Noda
IPC分类号： B23K35/02 , B23K35/26 , C22C13/00 , H05K3/34
CPC分类号： B23K35/262 , B23K35/025 , B23K2101/36 , H05K3/3463
摘要： A solder alloy having a solderability comparable to that of a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.
摘要翻译：具有与常规Pb-Sn焊料合金相当的可焊性的焊料合金，而不会对环境产生不利影响，并且使用焊料合金。由Zn：4.0〜10.0重量％，In：1.0〜15.0重量％，Al：0.0020〜0.0100重量％，Sn和不可避免的杂质构成的焊料合金。由上述焊料合金构成的电气或电子设备的焊接结合体。

3. 发明授权

US06361626B1 Solder alloy and soldered bond 有权
标题翻译：焊接合金和焊接焊接
公开(公告)号：US06361626B1
公开(公告)日：2002-03-26
申请号：US09839371
申请日：2001-04-23
申请人： Masayuki Kitajima , Hitoshi Homma , Masakazu Takesue , Tadaaki Shono , Yutaka Noda
发明人： Masayuki Kitajima , Hitoshi Homma , Masakazu Takesue , Tadaaki Shono , Yutaka Noda
IPC分类号： C22C1300
CPC分类号： C22C13/00 , B23K35/262 , C22C13/02
摘要： A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb—Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys.
摘要翻译：无铅焊料合金和使用其的焊接焊料，其中焊料合金没有有害的环境效应，但具有与常规Pb-Sn焊料合金相当的可焊性。本发明的焊料合金由Zn：3.0〜14.0重量％，Al：0.0020〜0.0080重量％，余量由Sn和不可避免的杂质构成，Zn：3.0〜14.0重量％，Bi：3.0-6.0 wt％，Al：0.0020-0.0100wt％，余量为Sn和不可避免的杂质。本发明的焊接键由本发明的焊料合金中的任一种组成。

4. 发明授权

US06596094B2 Solder paste and electronic device 失效
公开(公告)号：US06596094B2
公开(公告)日：2003-07-22
申请号：US09993615
申请日：2001-11-27
申请人： Masayuki Ochiai , Yasuo Yamagishi , Hiroki Uchida , Masayuki Kitajima , Masakazu Takesue , Tadaaki Shono
发明人： Masayuki Ochiai , Yasuo Yamagishi , Hiroki Uchida , Masayuki Kitajima , Masakazu Takesue , Tadaaki Shono
IPC分类号： B23K35363
CPC分类号： B23K35/025 , B23K35/0244 , B23K35/262 , H05K3/3463 , H05K3/3484 , H05K2201/0215 , H05K2201/0218 , H05K2201/10689 , H05K2203/0545 , Y10T428/12063 , Y10T428/12882
摘要： A solder paste, includes a flux, a solder alloy particle scattered or mixed in the flux and including Sn and Zn as composition elements, and a metal particle scattered or mixed in the flux and including an element in the IB group in the periodic table as a composition element.

5. 发明授权

US06184475B2 Lead-free solder composition with Bi, In and Sn 失效
标题翻译：具有Bi，In和Sn的无铅焊料组成
公开(公告)号：US06184475B2
公开(公告)日：2001-02-06
申请号：US08526929
申请日：1995-09-12
申请人： Masayuki Kitajima , Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
发明人： Masayuki Kitajima , Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
IPC分类号： A05K116
CPC分类号： B23K35/025 , B23K35/262 , B23K35/264 , B23K35/3613 , B23K35/3615 , B23K35/3616 , B23K35/3618 , H05K3/3463
摘要： A lead-free solder alloy composition contains Sn, Bi and In, with respective contents such that the solder alloy composition provides a liquidus temperature below the heat resistant temperature of a work to be soldered. The alloy contains not more than about 60 wt % Bi; not more than about 50 wt % In; optionally at least one element selected from Ag, Zn, Ge, Ga, Sb, and P; and Sn. Also, lead-free solder powders containing same, and printed circuit boards, electronic components and electronic apparati employing such alloy.
摘要翻译：无铅焊料合金组合物含有Sn，Bi和In，各自的含量使得焊料合金组合物的液相线温度低于要焊接的工件的耐热温度。该合金含有不超过约60重量％的Bi; 不超过约50重量％的In; 可选地，选自Ag，Zn，Ge，Ga，Sb和P中的至少一种元素; 和Sn。另外，含有这种合金的无铅焊料粉末，以及印刷电路板，电子元件和使用这种合金的电子设备。

6. 发明授权

US06541898B2 Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method 失效
公开(公告)号：US06541898B2
公开(公告)日：2003-04-01
申请号：US09822636
申请日：2001-03-30
申请人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
发明人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
IPC分类号： H01L41047
CPC分类号： H01L41/29 , G11B5/5552 , G11B5/5556 , H01L41/0993 , H01L2224/48091 , H01L2224/73265 , H01L2924/01327 , Y10T29/42 , H01L2924/00014 , H01L2924/00
摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

7. 发明授权

US06521176B2 Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy 失效
标题翻译：无铅焊料合金和使用这种无铅焊料合金的电气和电子设备的制造过程
公开(公告)号：US06521176B2
公开(公告)日：2003-02-18
申请号：US09728120
申请日：2000-12-04
申请人： Masayuki Kitajima , Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
发明人： Masayuki Kitajima , Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
IPC分类号： C22C1302
CPC分类号： B23K35/025 , B23K35/262 , B23K35/264 , B23K35/3613 , B23K35/3615 , B23K35/3616 , B23K35/3618 , H05K3/3463
摘要： A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
摘要翻译：含有Sn，Ag和Bi的无铅焊料合金组合物，各自的浓度设定为使得无铅焊料合金的熔融温度低于要焊接的工件的预定耐热温度。

8. 发明授权

US06344690B1 Semiconductor device with gold bumps, and method and apparatus of producing the same 失效
标题翻译：具有金凸块的半导体装置及其制造方法和装置
公开(公告)号：US06344690B1
公开(公告)日：2002-02-05
申请号：US09691142
申请日：2000-10-19
申请人： Masayuki Kitajima , Masakazu Takesue , Yoshitaka Muraoka
发明人： Masayuki Kitajima , Masakazu Takesue , Yoshitaka Muraoka
IPC分类号： H01L2348
CPC分类号： H01L24/13 , B23K1/0016 , B23K35/26 , B23K35/262 , B23K35/3013 , B23K2101/36 , H01L21/6835 , H01L24/11 , H01L24/16 , H01L24/742 , H01L24/81 , H01L2224/0401 , H01L2224/05124 , H01L2224/0558 , H01L2224/056 , H01L2224/05624 , H01L2224/05644 , H01L2224/11003 , H01L2224/11334 , H01L2224/11822 , H01L2224/1184 , H01L2224/11901 , H01L2224/1308 , H01L2224/13083 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/1358 , H01L2224/13582 , H01L2224/136 , H01L2224/13605 , H01L2224/13609 , H01L2224/13613 , H01L2224/13618 , H01L2224/13655 , H01L2224/13671 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/742 , H01L2224/75 , H01L2224/7501 , H01L2224/7515 , H01L2224/7565 , H01L2224/75745 , H01L2224/81011 , H01L2224/81801 , H01L2224/83192 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/3436 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2224/29099
摘要： A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.
摘要翻译：半导体器件包括具有电极的半导体元件和附接到电极的金属凸块。金属凸块包括铜芯和覆盖芯的金表面层。此外，金属凸块可以包括连接在一起的金突起元件和焊料凸块元件。

9. 发明授权

US06786385B1 Semiconductor device with gold bumps, and method and apparatus of producing the same 失效
标题翻译：具有金凸块的半导体装置及其制造方法和装置
公开(公告)号：US06786385B1
公开(公告)日：2004-09-07
申请号：US09533365
申请日：2000-03-22
申请人： Masayuki Kitajima , Masakazu Takesue , Yoshitaka Muraoka
发明人： Masayuki Kitajima , Masakazu Takesue , Yoshitaka Muraoka
IPC分类号： B23K108
CPC分类号： H01L24/742 , B23K1/0016 , B23K35/26 , B23K35/262 , B23K35/3013 , B23K2101/36 , H01L21/6835 , H01L24/81 , H01L2224/03828 , H01L2224/0401 , H01L2224/0558 , H01L2224/05644 , H01L2224/11 , H01L2224/11003 , H01L2224/11334 , H01L2224/11822 , H01L2224/1184 , H01L2224/11901 , H01L2224/12 , H01L2224/13099 , H01L2224/13147 , H01L2224/1358 , H01L2224/136 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/81011 , H01L2224/81801 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , Y10T29/53178 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device includes a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.
摘要翻译：半导体器件包括具有电极的半导体元件和附接到电极的金属凸块。金属凸块包括铜芯和覆盖芯的金表面层。此外，金属凸块可以包括连接在一起的金突起元件和焊料凸块元件。

10. 发明授权

US06467141B2 Method of assembling micro-actuator 失效
标题翻译：组合微致动器的方法
公开(公告)号：US06467141B2
公开(公告)日：2002-10-22
申请号：US09820553
申请日：2001-03-29
申请人： Toru Okada , Kenji Iketaki , Hidehiko Kobayashi , Yutaka Noda , Masayuki Kitajima , Seiichi Shimoura , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka , Masanao Fujii
发明人： Toru Okada , Kenji Iketaki , Hidehiko Kobayashi , Yutaka Noda , Masayuki Kitajima , Seiichi Shimoura , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka , Masanao Fujii
IPC分类号： H04R1710
CPC分类号： G11B5/5552 , H01L41/313 , Y10T29/42 , Y10T29/49025 , Y10T29/49055
摘要： A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing. Finally, the adhered laminate thus obtained is placed in a heating furnace, and is heated at a predetermined temperature for a predetermined period of time, whereby each of the adhesives is fully cured.
摘要翻译：提供了一种组装微致动器的方法，其中具有多个致动器基座的基架被放置在台架上，第一粘合剂被施加到每个致动器基座，以及具有多个基极的基极框架被放置在第一粘合剂上。第一粘合剂通过加热和压制半固化。将第二粘合剂施加到每个基底电极上，并且将多个压电元件放置在第二粘合剂上。第二粘合剂通过加热和压制半固化。将第三粘合剂施加到压电元件，并且具有多个可移动电极的可动电极框架放置在第三粘合剂上。第三粘合剂通过加热和压制半固化。接下来，将第四粘合剂施加到每个可移动电极，并且具有多个铰链板的铰链板框架放置在第四粘合剂上。第四粘合剂通过加热和加压半固化。最后，将如此获得的粘合层压材料放置在加热炉中，并在预定温度下加热预定的时间，从而使各种粘合剂完全固化。

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