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1. 发明授权

US07005304B2 Micro-moving device and its manufacturing method 有权
标题翻译：微动装置及其制造方法
公开(公告)号：US07005304B2
公开(公告)日：2006-02-28
申请号：US10362913
申请日：2002-06-26
申请人： Masaya Nakatani , Katsuya Morinaka , Katsumasa Miki , Hirofumi Tajika
发明人： Masaya Nakatani , Katsuya Morinaka , Katsumasa Miki , Hirofumi Tajika
IPC分类号： H01L21/00
CPC分类号： G11B5/5552 , Y10S438/928
摘要： A micro-transfer device for fine positioning is employed typically in recording and playback apparatus for recording disks. Voltage is stably supplied to an expandable element which displaces the position of a recording head by applying voltage. An end different from one end connected to a base, where the recording head is mounted, is fixed to a fixing substrate for preventing changes in dimensions of the expandable element. An external electrode connection for supplying voltage to the expandable element is provided in an area on the fixing substrate.
摘要翻译：用于精细定位的微转移装置通常用于记录盘的记录和重放装置。电压被稳定地供给到通过施加电压来移位记录头的位置的可扩展元件。与安装有记录头的底座连接的一端不同的端部固定到固定基板上，以防止可扩张元件的尺寸变化。用于向可膨胀元件提供电压的外部电极连接设置在固定基板上的区域中。

2. 发明授权

US06554408B1 Fluid ejection device and process for the production thereof 失效
标题翻译：流体喷射装置及其制造方法
公开(公告)号：US06554408B1
公开(公告)日：2003-04-29
申请号：US09506751
申请日：2000-02-18
申请人： Katsumasa Miki , Masaya Nakatani , Isaku Kanno , Ryoichi Takayama , Koji Nomura
发明人： Katsumasa Miki , Masaya Nakatani , Isaku Kanno , Ryoichi Takayama , Koji Nomura
IPC分类号： B41J2045
CPC分类号： B41J2/1623 , B41J2/14233 , B41J2/161 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/1646 , B41J2002/14387
摘要： A fluid ejection device, such as for an ink jet printer or the like, having increased increasing nozzle density. A through-hole (15) is provided in a glass substrate (18) to which a second silicon substrate (19) is directly bonded to form an ink outlet (14). The first silicon substrate (17) is etched to form a pressure chamber (12), an ink channel (13) and an ink inlet (16), and bonded directly to the glass substrate (18). A piezoelectric thin film (11), having a conductive, elastic body (20), is bonded to the first substrate covering the pressure chamber (12). The elastic body (20) is sandwiched between the piezoelectric thin film (11) and a resin layer (25). The second substrate (19) has a thickness of less than about 0.8 mm in a range of thickness comprising about 1.2 to about 1.9 times (rg-rs), wherein rg is the diameter of the wide end of the through-hole (15) and rs is the diameter of the narrow end of the through-hole (15).
摘要翻译：诸如用于喷墨打印机等的流体喷射装置具有增加的喷嘴密度的增加。在玻璃基板（18）上设置有通孔（15），第二硅基板（19）直接接合在该玻璃基板（18）上形成出墨口（14）。蚀刻第一硅衬底（17）以形成压力室（12），墨水通道（13）和墨水入口（16），并直接粘合到玻璃基底（18）上。具有导电弹性体（20）的压电薄膜（11）与覆盖压力室（12）的第一基板接合。弹性体（20）夹在压电薄膜（11）和树脂层（25）之间。第二基板（19）的厚度小于约0.8mm，其厚度范围为约1.2至约1.9倍（rg-rs），其中rg是通孔（15）的宽端的直径，并且rs是通孔（15）的窄端的直径。

3. 发明授权

US06588883B2 Liquid injector, method of manufacturing the injector, and ink-jet spray using the injector 有权
标题翻译：液体注射器，制造喷射器的方法，以及使用喷射器的喷墨喷射
公开(公告)号：US06588883B2
公开(公告)日：2003-07-08
申请号：US10046531
申请日：2002-01-14
申请人： Masaya Nakatani , Katsumasa Miki
发明人： Masaya Nakatani , Katsumasa Miki
IPC分类号： B41J204
CPC分类号： B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1632
摘要： A liquid injector having a liquid eject outlet side reduced in size is provided. In a head block of the liquid injector, a pressurizing chamber is linearly aligned with a liquid eject outlet and liquid feed inlet.
摘要翻译：提供具有液体喷射出口侧尺寸减小的液体喷射器。在液体注射器的头部块中，加压室与液体喷射出口和液体进料入口线性对准。

4. 发明申请

US20080024955A1 Capacitor 失效
公开(公告)号：US20080024955A1
公开(公告)日：2008-01-31
申请号：US11597812
申请日：2005-07-07
申请人： Katsumasa Miki , Tatsuo Fujii , Yuji Midou , Suzushi Kimura
发明人： Katsumasa Miki , Tatsuo Fujii , Yuji Midou , Suzushi Kimura
IPC分类号： H01G9/15 , H01G9/025 , H01G9/042 , H01G9/07
CPC分类号： H01G9/042 , H01G9/012 , H01G9/048
摘要： A capacitor includes a first capacitor element and a second capacitor element laminated on this first capacitor element. The first capacitor element is a solid electrolytic capacitor including a through-hole electrode penetrating a valve metal sheet and having one surface on which cathode and anode terminal portions are taken out. The second capacitor element has first and second electrodes which are provided via a dielectric layer, and second through-hole electrodes penetrating the dielectric layer. The second through-hole electrodes are coupled to the first electrode and insulated from the second electrode. Lead-out portions of the second electrodes are exposed from the dielectric layer. The second through-hole electrodes and the lead-out portions are disposed alternately. The first electrode is electrically coupled to the first through-hole electrode and the second electrode is electrically coupled to the valve metal sheet.

5. 发明申请

US20070242440A1 Multilayer Wiring Board, Method for Manufacturing Such Multilayer Wiring Board, and Semiconductor Device and Electronic Device Using Multilayer Wiring Board 有权
标题翻译：多层接线板，制造这种多层接线板的方法以及使用多层接线板的半导体器件和电子设备
公开(公告)号：US20070242440A1
公开(公告)日：2007-10-18
申请号：US11578039
申请日：2006-02-01
申请人： Yasuhiro Sugaya , Yoshiyuki Yamamoto , Toshiyuki Asahi , Katsumasa Miki , Yoshiyuki Saitou , Takeshi Nakayama
发明人： Yasuhiro Sugaya , Yoshiyuki Yamamoto , Toshiyuki Asahi , Katsumasa Miki , Yoshiyuki Saitou , Takeshi Nakayama
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K1/186 , H01L23/3128 , H01L23/49822 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H05K3/429 , H05K3/4623 , H05K2201/09536 , H05K2201/10015 , Y10T29/4913 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.
摘要翻译：多层基板包括多个电路板，包括具有接地层和功率层的多个布线层，具有绝缘氧化物膜层的固体电解电容器，电解质层和依次形成在一个表面上的导体层箔状金属基板的表面和穿过电路板的导电物质穿过其厚度。固体电解电容器设置成保持在多个电路板之间。导体层与形成在接地层上的接地电极连接，箔状金属基板与形成在电源层上的电力电极连接。

6. 发明授权

US06917514B2 Electrolytic capacitor and method for manufacturing the same 失效
标题翻译：电解电容器及其制造方法
公开(公告)号：US06917514B2
公开(公告)日：2005-07-12
申请号：US10618595
申请日：2003-07-15
申请人： Yuji Mido , Tatsuo Fujii , Katsumasa Miki , Suzushi Kimura
发明人： Yuji Mido , Tatsuo Fujii , Katsumasa Miki , Suzushi Kimura
IPC分类号： H01G9/26 , H01G9/00 , H01G9/004 , H01G9/012 , H01G9/04 , H01G9/14 , H01G9/28 , H01G4/228
CPC分类号： H01G9/012 , H01G4/33 , H01G9/04 , Y10T29/417
摘要： A solid electrolytic capacitor includes a valve metal sheet having a porous portion on one side of the sheet, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer formed on the solid electrolyte layer, a through-hole electrode connected to the collector layer and penetrating the valve metal sheet to be exposed to the other side of the sheet, and an electrode terminal insulated from the through-hole electrode and connected to the valve metal sheet. The capacitor further includes an insulating portion penetrating the valve metal sheet and a penetration electrode penetrating the insulating portion. The solid electrolytic capacitor has a large capacitance and an excellent radio frequency response, and can be easily mounted on a semiconductor device.
摘要翻译：固体电解电容器包括在片材的一侧具有多孔部分的阀金属片，形成在多孔部分上的电介质层，形成在电介质层上的固体电解质层，形成在固体电解质层上的集电层，连接到集电体层并穿透阀金属片以暴露于片材的另一侧的通孔电极以及与通孔电极绝缘并连接到阀金属片的电极端子。电容器还包括穿透阀金属片的绝缘部分和穿透绝缘部分的穿透电极。固体电解电容器具有大的电容和优异的射频响应，并且可以容易地安装在半导体器件上。

7. 发明授权

US06855177B2 Method for producing solid electrolytic capacitor 失效
标题翻译：固体电解电容器的制造方法
公开(公告)号：US06855177B2
公开(公告)日：2005-02-15
申请号：US10362227
申请日：2002-06-24
申请人： Tatsuo Fujii , Katsumasa Miki , Makoto Nakano , Suzushi Kimura , Yuji Mido
发明人： Tatsuo Fujii , Katsumasa Miki , Makoto Nakano , Suzushi Kimura , Yuji Mido
IPC分类号： H01G9/028 , H01G9/00 , H01G9/012 , H01G9/04 , H01G9/08 , H01G9/15 , H01G4/228
CPC分类号： H01G9/15 , Y10T29/417 , Y10T29/43 , Y10T29/49128 , Y10T29/49165
摘要： A method for manufacturing large capacitance solid electrolytic capacitors that can be connected direct with semiconductor component, and offer a superior high frequency characteristic. An aluminum foil 3 is made porous in one of the surfaces, a dielectric layer 2 is formed on the porous portion, a through hole 4 is provided in the aluminum foil 3 at a certain specific location. An insulation layer 5 is formed to cover the other surface, viz. non-porous surface, of the aluminum foil 3 and the inner wall surface of through hole 4, a solid electrolytic layer 6 is provided on the dielectric layer 2, and a through hole electrode 7 is formed in the through hole 4, and then a collector layer 8 is formed on the solid electrolytic layer 6. The insulation layer 5 disposed on aluminum foil 3 is provided with an opening 9 at a certain specific location, and a connection terminal 10 is provided at the opening 9 of insulation layer 5 and the exposed surface of the through hole electrode 7, respectively.
摘要翻译：一种可直接与半导体元件连接的大容量固体电解电容器的制造方法，具有优异的高频特性。在其中一个表面上形成铝箔3多孔，在多孔部分上形成电介质层2，在铝箔3中的特定位置设置有通孔4。形成绝缘层5以覆盖另一表面，即，铝箔3的无孔表面和通孔4的内壁表面，在电介质层2上设置固体电解质层6，并且在通孔4中形成通孔电极7，然后将集电体层8形成在固体电解质层6上。设置在铝箔3上的绝缘层5在特定位置设置有开口9，并且在绝缘层5的开口9处设置有连接端子10，通孔电极7的暴露表面。

8. 发明授权

US06852137B2 Method for manufacturing solid electrolytic capacitor 失效
标题翻译：固体电解电容器的制造方法
公开(公告)号：US06852137B2
公开(公告)日：2005-02-08
申请号：US10363132
申请日：2002-07-16
申请人： Katsumasa Miki , Yuji Mido , Tatsuo Fujii , Makoto Nakano , Suzushi Kimura
发明人： Katsumasa Miki , Yuji Mido , Tatsuo Fujii , Makoto Nakano , Suzushi Kimura
IPC分类号： H01G9/00 , H01G9/012 , H01G9/15 , H01G4/228 , H01G9/10
CPC分类号： H01G9/15 , H01G9/012 , Y10T29/417
摘要： A method for manufacturing solid electrolytic capacitor that can be mounted direct on a semiconductor component and offers a superior high frequency characteristic. An aluminum foil 20 is provided on one surface with a resist film 23 and then with a through hole 24. Next, an insulation film 25 is formed to cover the other surface of aluminum foil 20 and to fill the first through hole, and then the resist film 23 is removed; and then the surface of aluminum foil 20 is roughened to be provided with a dielectric layer 27 thereon. A second through hole 36 is formed in the insulation film 25, which is filling the first through hole 24. A through hole electrode 28 is formed in the second through hole; and then, on the surface of the dielectric layer 27, a solid electrolytic layer 29 and a collector layer 30 are formed. After an opening 37 is provided, a first connection terminal 31 is formed therein, and a second connection electrode 32 on the exposed surface of the through hole electrode 28.
摘要翻译：一种制造固体电解电容器的方法，其可以直接安装在半导体部件上并提供优异的高频特性。铝箔20在一个表面上设置有抗蚀剂膜23，然后用通孔24提供。接下来，形成绝缘膜25以覆盖铝箔20的另一个表面并填充第一通孔，然后除去抗蚀剂膜23; 然后将铝箔20的表面粗糙化，在其上设置介电层27。第二通孔36形成在填充第一通孔24的绝缘膜25中。在第二通孔中形成有通孔电极28，然后在电介质层27的表面上形成固体电解质层29和集电体层30。在提供开口37之后，在其中形成第一连接端子31，并且在通孔电极28的暴露表面上形成第二连接电极32。

9. 发明授权

US06785147B2 Circuit module 有权
标题翻译：电路模块
公开(公告)号：US06785147B2
公开(公告)日：2004-08-31
申请号：US10381891
申请日：2003-06-23
申请人： Katsumasa Miki , Yuji Mido , Tetsuhiro Korechika , Suzushi Kimura
发明人： Katsumasa Miki , Yuji Mido , Tetsuhiro Korechika , Suzushi Kimura
IPC分类号： H05K702
CPC分类号： H05K1/185 , H01G4/40 , H01G9/15 , H01L23/50 , H01L2924/0002 , H01L2924/3011 , H05K1/162 , H05K2201/0187 , H05K2203/0315 , H01L2924/00
摘要： The present invention aims to provide a circuit module that includes a sheet-like solid electrolytic capacitor and reduces an area and volume required for mounting electronic components. In the sheet-like solid electrolytic capacitor, valve metal sheet 11 has dielectric layer 13 and current collector layer 12 formed on the surface thereof, and is packaged by insulators 14 and 15. The circuit module is structured to embed the sheet-like solid electrolytic capacitor in a circuit board.
摘要翻译：本发明旨在提供一种电路模块，其包括片状固体电解电容器，并减少了安装电子部件所需的面积和体积。在片状固体电解电容器中，阀金属片11具有形成在其表面上的电介质层13和集电体层12，并且由绝缘体14和15封装。电路模块被构造成将片状固体电解质电容器在电路板上。

10. 发明授权

US07821795B2 Multilayer wiring board 有权
标题翻译：多层接线板
公开(公告)号：US07821795B2
公开(公告)日：2010-10-26
申请号：US11578039
申请日：2006-02-01
申请人： Yasuhiro Sugaya , Yoshiyuki Yamamoto , Toshiyuki Asahi , Katsumasa Miki , Masaaki Katsumata , Yoshiyuki Saitou , Takeshi Nakayama
发明人： Yasuhiro Sugaya , Yoshiyuki Yamamoto , Toshiyuki Asahi , Katsumasa Miki , Masaaki Katsumata , Yoshiyuki Saitou , Takeshi Nakayama
IPC分类号： H05K1/18
CPC分类号： H05K1/186 , H01L23/3128 , H01L23/49822 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H05K3/429 , H05K3/4623 , H05K2201/09536 , H05K2201/10015 , Y10T29/4913 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.
摘要翻译：多层基板包括多个电路板，包括具有接地层和功率层的多个布线层，具有绝缘氧化物膜层的固体电解电容器，电解质层和依次形成在一个表面上的导体层箔状金属基板的表面和穿过电路板的导电物质穿过其厚度。固体电解电容器设置成保持在多个电路板之间。导体层与形成在接地层上的接地电极连接，箔状金属基板与形成在电源层上的电力电极连接。

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