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1. 发明授权

US08079870B2 Coaxial connector with efficient assembly operation 失效
标题翻译：同轴连接器，高效的组装操作
公开(公告)号：US08079870B2
公开(公告)日：2011-12-20
申请号：US12864259
申请日：2009-01-26
申请人： Masatoshi Nakamura , Taishi Morikawa
发明人： Masatoshi Nakamura , Taishi Morikawa
IPC分类号： H01R9/05
CPC分类号： H01R9/0518 , H01R4/185 , Y10T29/49123
摘要： To provide a coaxial connector and an assembling method of the coaxial connector in which an operation efficiency can be enhanced, and also facilities related to the assembling can be simplified. The coaxial connector is assembled through a first step of assembling an insulator assembly, a second step of setting the insulator assembly in an outer conductor terminal through an upper opening portion of the outer conductor terminal from a direction perpendicular to a terminal axis thereof, and a third step of holding an insulator of the insulator assembly by press-crimping a pair of press-crimping pieces for insulator holding and effecting the connection and fixing to a coaxial cable of the insulator assembly by press-crimping a pair of press-crimping pieces for braid connection and a pair of press-crimping pieces for sheath fixation.
摘要翻译：为了提供可以提高操作效率的同轴连接器的同轴连接器和组装方法，并且还可以简化与组装相关的设备。通过组装绝缘体组件的第一步来组装同轴连接器，第二步骤是将外部导体端子中的绝缘体组件从垂直于其端子轴线的方向穿过外部导体端子的上部开口部分设置，通过压接一对用于绝缘体保持的压接片来实现绝缘体组件的绝缘体的固定和固定到绝缘体组件的同轴电缆上的第三步骤是将一对压接片压接在一起编织连接和一对用于护套固定的压接片。

2. 发明申请

US20100297877A1 COAXIAL CONNECTOR AND ASSEMBLING METHOD OF COAXIAL CONNECTOR 失效
标题翻译：同轴连接器和同轴连接器装配方法
公开(公告)号：US20100297877A1
公开(公告)日：2010-11-25
申请号：US12864259
申请日：2009-01-26
申请人： Masatoshi Nakamura , Taishi Morikawa
发明人： Masatoshi Nakamura , Taishi Morikawa
IPC分类号： H01R9/05 , H01B13/20
CPC分类号： H01R9/0518 , H01R4/185 , Y10T29/49123
摘要： To provide a coaxial connector and an assembling method of the coaxial connector in which an operation efficiency can be enhanced, and also facilities related to the assembling can be simplified. The coaxial connector 1 is assembled through a first step of assembling an insulator assembly 6, a second step of setting the insulator assembly 6 in an outer conductor terminal 5 through an upper opening portion 27 of the outer conductor terminal 5 from a direction perpendicular to a terminal axis thereof, and a third step of holding an insulator 4 of the insulator assembly 6 by press-crimping a pair of press-crimping pieces for insulator holding 28 and effecting the connection and fixing to a coaxial cable 2 of the insulator assembly 6 by press-crimping a pair of press-crimping pieces for braid connection 23 and a pair of press-crimping pieces for sheath fixation 24.
摘要翻译：为了提供可以提高操作效率的同轴连接器的同轴连接器和组装方法，并且还可以简化与组装有关的设备。同轴连接器1通过组装绝缘体组件6的第一步进行组装，第二步骤是通过外部导体端子5的上部开口部分27将外部导体端子5从垂直于端子轴以及通过压接一对绝缘体保持件28的压接片来保持绝缘体组件6的绝缘体4并通过连接和固定到绝缘体组件6的同轴电缆2的第三步骤压接一对用于编织连接的压接片23和用于护套固定的一对压接片24。

3. 发明授权

US09567414B2 Method for producing polyacrylic acid (salt)-based water absorbent resin powder 有权
标题翻译：制备聚丙烯酸（盐）基吸水树脂粉末的方法
公开(公告)号：US09567414B2
公开(公告)日：2017-02-14
申请号：US13982166
申请日：2012-01-30
申请人： Kozo Nogi , Masatoshi Nakamura , Hirofumi Shibata , Koji Honda , Yusuke Watanabe , Satoshi Matsumoto , Reiko Nakatsuru , Kunihiko Ishizaki , Kazuki Kimura , Sayaka Machida
发明人： Kozo Nogi , Masatoshi Nakamura , Hirofumi Shibata , Koji Honda , Yusuke Watanabe , Satoshi Matsumoto , Reiko Nakatsuru , Kunihiko Ishizaki , Kazuki Kimura , Sayaka Machida
IPC分类号： C08F20/06 , C08F220/06 , C08J3/12 , C09D133/04 , C08J3/24
CPC分类号： C08F20/06 , C08F220/06 , C08J3/12 , C08J3/24 , C08J3/245 , C08J2333/02 , C09D133/04 , C08F2222/1013
摘要： From a view point of reduction in an out of spec product after surface crosslinking, particularly, when an alkylene carbonate compound is used as a surface crosslinking agent, influence by an air temperature is great, and it is necessary to reduce ethylene glycol which is produced as a byproduct, and there is provided a process for producing a polyacrylic acid (salt)-based water absorbent resin powder, comprising a step of polymerizing an aqueous acrylic acid (salt)-based monomer solution, a step of drying the resulting polymer, an optional grinding•classifying step, and a surface crosslinking step, wherein in the surface crosslinking step, (1) a surface crosslinking agent containing an alkylene carbonate compound and a polyhydric alcohol compound is mixed into a water absorbent resin powder, the mixture is heat-reacted and, further, simultaneously with, or separately from the mixing, an ion reactive surface crosslinking agent is mixed, and/or (2) mixing treatment of mixing a surface crosslinking agent solution into a water absorbent resin powder containing at least one or more kinds of ion reactive surface crosslinking agents is performed two or more times.
摘要翻译：从表面交联后的特定产品的减少的观点来看，特别是使用碳酸亚烷基酯化合物作为表面交联剂时，由于空气温度的影响大，所以需要还原所生成的乙二醇作为副产物，并且提供了一种制备基于聚丙烯酸（盐）的吸水性树脂粉末的方法，包括使基于丙烯酸（盐）的单体水溶液聚合的步骤，干燥所得聚合物的步骤，任选的研磨分级步骤和表面交联步骤，其中在表面交联步骤中，（1）将含有碳酸亚烃酯化合物和多元醇化合物的表面交联剂混合到吸水性树脂粉末中，将混合物加热和/或（2）混合表面的混合处理，和/或（2）混合表面的混合处理交联剂溶液进入含有至少一种或多种离子反应性表面交联剂的吸水性树脂粉末中进行两次或更多次。

4. 发明授权

US08536111B2 Hydrophilicity-restoring agent and method for restoring hydrophilicity 失效
标题翻译：亲水性恢复剂和恢复亲水性的方法
公开(公告)号：US08536111B2
公开(公告)日：2013-09-17
申请号：US12724502
申请日：2010-03-16
申请人： Akina Watanabe , Masatoshi Nakamura
发明人： Akina Watanabe , Masatoshi Nakamura
IPC分类号： C11D7/22 , C11D7/24 , C11D7/26
CPC分类号： G02B27/0006 , B60R1/0602 , C03C23/0075 , C03C2218/355
摘要： The present invention provides a hydrophilicity-restoring agent for removing inorganic matter from a hydrophilic surface whose hydrophilicity has been reduced by the adhesion of the inorganic matter to thereby restore the hydrophilicity of the hydrophilic surface, and provides a method for restoring the hydrophilicity of a hydrophilic surface using the hydrophilicity-restoring agent. A gel of a hydrophilicity-restoring agent is prepared by mixing a thickener such as polyethylene glycol and xanthan gum with an aqueous solution in which a ligand such as citric acid to form a chelate complex is dissolved. The hydrophilicity of the hydrophilic surface is restored by applying the hydrophilicity-restoring agent to the hydrophilic surface with a reduced hydrophilicity and removing the hydrophilicity-restoring agent after an appropriate lapse of time.
摘要翻译：本发明提供一种用于从亲水表面除去无机物的亲水性恢复剂，其亲水性通过无机物质的粘附而降低，从而恢复亲水表面的亲水性，并提供了恢复亲水性亲水性的方法表面使用亲水性恢复剂。通过将增稠剂如聚乙二醇和黄原胶与其中溶解配基如柠檬酸的水溶液混合来制备亲水恢复剂的凝胶。亲水性表面的亲水性通过将亲水性亲水性亲水性赋予亲水性亲水性并在合适的时间后除去亲水性恢复剂而恢复。

5. 发明授权

US08487048B2 Water-absorbent resin and its production process 有权
标题翻译：吸水树脂及其生产工艺
公开(公告)号：US08487048B2
公开(公告)日：2013-07-16
申请号：US10555707
申请日：2004-05-07
申请人： Katsuyuki Wada , Masatoshi Nakamura , Kazuki Kimura , Kunihiko Ishizaki
发明人： Katsuyuki Wada , Masatoshi Nakamura , Kazuki Kimura , Kunihiko Ishizaki
IPC分类号： C08F8/00 , C08F8/14 , C08F8/32 , A61F13/53
CPC分类号： C08J3/243 , A61L15/60 , C08F8/00 , C08F2800/20 , C08F2810/20 , C08J3/245 , C08J2300/14 , Y10T428/254 , C08L33/02 , C08F220/04
摘要： Objects of the present invention are: to provide a water-absorbent resin which exhibits excellent balances between water absorption performances; and further to provide a process by which a water-absorbent resin having excellent absorption properties can be produced even if no hydrophilic organic solvent is used, or even if its amount is extremely reduced, when carrying out the surface-crosslinking treatment; and further to provide a water-absorbent resin optimum to absorbent articles such as diapers. As a means of achieving these objects, the process according to the present invention for production of the water-absorbent resin comprises: a step (1) of polymerizing a monomer component including an acid-group-containing unsaturated monomer as an essential component to thereby obtain a hydrogel polymer; a step (2) of drying and pulverizing the hydrogel polymer to thereby obtain a water-absorbent resin powder; a step (3) of adding a surface-crosslink-treating agent to the water-absorbent resin powder, wherein the surface-crosslink-treating agent includes a surface-crosslinking agent and water as essential components and has a hydrophilic organic solvent content of 0 to 10 mass % relative to the surface-crosslink-treating agent; and a step (4) of heating the resultant mixture to thereby carry out surface-crosslinking treatment; wherein a time of from the end of the step (3) till the beginning of the step (4) is within 5 minutes.
摘要翻译：本发明的目的是提供吸水性能优异的平衡性的吸水性树脂; 进一步提供一种在进行表面交联处理时即使不使用亲水性有机溶剂也可以产生吸水性优异的吸水性树脂，或者即使其量极少地减少的方法; 并且进一步提供对吸收制品如尿布最佳的吸水性树脂。作为实现这些目的的手段，本发明的制造吸水性树脂的方法包括：使包含含酸基的不饱和单体作为必要成分的单体成分聚合的工序（1）获得水凝胶聚合物; 干燥粉碎水凝胶聚合物从而获得吸水性树脂粉末的步骤（2）; 将表面交联处理剂添加到吸水性树脂粉末中的步骤（3），其中表面交联处理剂包括表面交联剂和水作为必要组分，并且亲水性有机溶剂含量为0 相对于表面交联处理剂为10质量％和加热所得混合物从而进行表面交联处理的步骤（4）; 其中从步骤（3）的结束到步骤（4）的开始的时间在5分钟内。

6. 发明申请

US20110088806A1 METHOD OF TRANSPORTING ABSORBENT RESIN POWDER 有权
标题翻译：运输吸收树脂粉的方法
公开(公告)号：US20110088806A1
公开(公告)日：2011-04-21
申请号：US12935052
申请日：2009-03-26
申请人： Kozo Nogi , Masatoshi Nakamura , Koji Matsumoto , Kazuma Awai
发明人： Kozo Nogi , Masatoshi Nakamura , Koji Matsumoto , Kazuma Awai
IPC分类号： B65B1/16
CPC分类号： C08J3/12 , C08F6/008 , C08J3/075 , C08J3/245 , C08J2333/02
摘要： Provided is a method of transporting an absorbent resin powder, said method being suitable for long-distance transport, and being able to inhibit the deterioration of the properties of the absorbent resin powder while also inhibiting obstructions. During the manufacturing process, the absorbent resin powder is transported pneumatically via transport pipes. This transport method involves two or more air transport devices (A, B, C) within one transport section, and the air transport devices (A, B, C) are connected in series by transport pipes (P1, P2, P3).
摘要翻译：提供了一种输送吸收性树脂粉末的方法，所述方法适用于长距离运输，并且能够抑制吸收性树脂粉末的性能的劣化同时也抑制障碍物。在制造过程中，吸收性树脂粉末通过运输管道气动输送。该输送方法涉及一个输送部内的两个以上的空气输送装置（A，B，C），空气输送装置（A，B，C）由输送管（P1，P2，P3）串联连接。

7. 发明授权

US07883675B2 Fuel treatment device 有权
标题翻译：燃油处理装置
公开(公告)号：US07883675B2
公开(公告)日：2011-02-08
申请号：US12666891
申请日：2009-06-01
申请人： Masatoshi Nakamura , Takashi Nakagawa , Yuji Tsutsui , Masatoshi Teranishi
发明人： Masatoshi Nakamura , Takashi Nakagawa , Yuji Tsutsui , Masatoshi Teranishi
IPC分类号： B01J8/08 , B01J8/02
CPC分类号： B01J8/0469 , B01J8/003 , B01J2208/00504 , B01J2208/00769 , C01B3/384 , C01B3/48 , C01B2203/0233 , C01B2203/0283 , C01B2203/044 , C01B2203/047 , C01B2203/0816 , C01B2203/0883 , C01B2203/0894 , C01B2203/1005 , C01B2203/1294 , C01B2203/82
摘要： The present invention provides a fuel treatment device which can realize easy separation and collection of a catalyst contained in the device. In a fuel treatment device (21) of the present invention a fuel gas is supplied to a catalyst, which fills a catalyst filling space (24) surrounded by a cylindrical inner circumferential wall and a cylindrical outer circumferential wall, to produce a reformed gas. The fuel treatment device (21) has a removal section indicator indicating a catalyst removal section (29) on the outer circumferential surface of the outer circumferential wall of the cylindrical catalyst filling space (24) and an opening formation assister assisting the formation of a catalyst removal opening for removing the catalyst. The removal section indicator and the opening formation assister are, for example, an oval annular shallow groove (30) formed at the outer circumferential wall of the catalyst filling space (24) over substantially the entire length in the axial direction of the catalyst filling space (24). When a catalyst (25) is collected from the fuel treatment device (21) after a lapse of a period of use, the catalyst removal opening (29) surrounded by the annular shallow groove (30) is cut off, and a catalyst removal opening (40) is formed.
摘要翻译：本发明提供一种燃料处理装置，其能够容易地分离并收集装置中所含的催化剂。在本发明的燃料处理装置（21）中，向催化剂供给燃料气体，催化剂填充由圆筒状的内周壁和圆筒状的外周壁包围的催化剂填充空间（24），生成重整气体。燃料处理装置（21）具有指示在圆筒状催化剂填充空间（24）的外周壁的外周面上的催化剂除去部（29）的去除部指示器和辅助催化剂形成的开口形成助剂用于除去催化剂的除去开口。除去部指示器和开口形成助手例如是在催化剂填充空间（24）的外周壁上形成在催化剂填充空间的轴向方向上的基本上整个长度上的椭圆环形浅槽（30）（24）。当经过一段时间后从燃料处理装置（21）收集催化剂（25）时，由环形浅槽（30）包围的催化剂除去开口（29）被切断，催化剂去除开口（40）。

8. 发明申请

US20090234314A1 Water-Absorbent Resin Composition, Method of Manufacturing the Same, and Absorbent Article 有权
标题翻译：吸水性树脂组合物，其制造方法和吸收性物品
公开(公告)号：US20090234314A1
公开(公告)日：2009-09-17
申请号：US12083238
申请日：2006-12-19
申请人： Masatoshi Nakamura , Koji Miyake , Taku Iwamura , Yusuke Watanabe
发明人： Masatoshi Nakamura , Koji Miyake , Taku Iwamura , Yusuke Watanabe
IPC分类号： A61F13/15 , C08L67/00
CPC分类号： C08L101/14 , C08L33/02 , C08L2312/00
摘要： In one embodiment of the present invention, a water-absorbent resin composition is provided which shows only small reduction in liquid permeability and limited coloring over time or in relation to another factor. The water-absorbent resin composition (particulate absorbent agent) of the present invention contains: a polycarboxylate-based water-absorbent resin as a primary component, the resin having a crosslinked structure formed by polymerization of an acid group-containing unsaturated monomer; and multivalent metal cations (preferably, on surfaces of particles (i.e., the water-absorbent resin composition)) wherein: the multivalent metal cations other than Fe cations account for 0.001 to 1 mass % of the water-absorbent resin; and the ratio of the Fe cations to the multivalent metal cations other than the Fe cations is less than or equal to 5.00 mass %.
摘要翻译：在本发明的一个实施方案中，提供一种吸水性树脂组合物，其显示出随着时间或与另一个因素相关的液体渗透性和有限着色的微小的降低。本发明的吸水性树脂组合物（颗粒状吸收剂）含有：作为主要成分的聚羧酸酯系吸水性树脂，具有通过含酸基的不饱和单体的聚合形成的交联结构的树脂; 和多价金属阳离子（优选在颗粒表面（即吸水性树脂组合物）），其中：Fe阳离子以外的多价金属阳离子占吸水性树脂的0.001〜1质量％ Fe阳离子与Fe阳离子以外的多价金属阳离子的比例小于或等于5.00质量％。

9. 发明申请

US20080142993A1 FLIP-CHIP MOUNTING SUBSTRATE 有权
标题翻译：片芯安装基板
公开(公告)号：US20080142993A1
公开(公告)日：2008-06-19
申请号：US11957866
申请日：2007-12-17
申请人： Takashi Ozawa , Yasushi Araki , Masatoshi Nakamura , Seiji Sato
发明人： Takashi Ozawa , Yasushi Araki , Masatoshi Nakamura , Seiji Sato
IPC分类号： H01L23/538
CPC分类号： H05K1/111 , H01L23/49816 , H01L23/49838 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05647 , H01L2224/10175 , H01L2224/814 , H01L2924/00014 , H05K3/3452 , H05K2201/09381 , H05K2201/0989 , H05K2201/09909 , H05K2201/10674 , Y02P70/611 , H01L2924/014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： It is a flip-chip mounting substrate according to the invention has a wiring pattern in which bonding pads and predetermined parts of lead wires continuously extending from the bonding pads are exposed from an insulating layer or a solder resist. In the flip-chip mounting substrate, exposed parts of the wiring pattern are formed in to a plurality of different shapes. The exposed parts are formed so that the areas of the bonding pads are substantially equal to one another, and that the total areas of predetermined parts of the lead wires continuously extending from the bonding pads are substantially equal to one another.
摘要翻译：根据本发明的倒装芯片安装基板具有布线图案，其中从焊盘连续延伸的焊盘和引线的预定部分从绝缘层或阻焊剂露出。在倒装芯片安装基板中，布线图案的露出部分形成为多种不同的形状。露出的部分形成为使得接合焊盘的面积基本上彼此相等，并且从接合焊盘连续延伸的引线的预定部分的总面积基本相等。

10. 发明申请

US20070145553A1 FLIP-CHIP MOUNTING SUBSTRATE AND FLIP-CHIP MOUNTING METHOD 有权
标题翻译：片芯安装基板和片芯安装方法
公开(公告)号：US20070145553A1
公开(公告)日：2007-06-28
申请号：US11613753
申请日：2006-12-20
申请人： Yasushi Araki , Seiji Sato , Masatoshi Nakamura , Takashi Ozawa
发明人： Yasushi Araki , Seiji Sato , Masatoshi Nakamura , Takashi Ozawa
IPC分类号： H01L23/02
CPC分类号： H05K3/3452 , H01L21/563 , H01L23/3171 , H01L23/49816 , H01L23/49838 , H01L24/02 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/10175 , H01L2224/11 , H01L2224/1132 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/16237 , H01L2224/81192 , H01L2224/81193 , H01L2224/81385 , H01L2224/81801 , H01L2224/81815 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H05K2201/09381 , H05K2201/099 , H05K2201/10674 , H01L2924/00 , H01L2924/00014
摘要： A solder resist and a central pad to which a central Au bump provided on a semiconductor chip is flip-chip bonded are formed on a substrate main body. In a flip-chip mounting substrate where an underfill resin is provided after the semiconductor chip is mounted, a central opening portion for exposing the central pad is formed in the solder resist, and also, an edge portion forming the outer peripheral portion of the solder resist is partially overlapped with the outer peripheral portion of the central pad.
摘要翻译：在衬底主体上形成阻焊剂和设置在半导体芯片上的中心Au凸块倒装芯片接合的中心焊盘。在安装半导体芯片之后设置底部填充树脂的倒装芯片安装基板中，在阻焊层中形成用于露出中心焊盘的中心开口部分，并且还形成形成焊料外周部分的边缘部分抗蚀剂部分地与中心焊盘的外周部分重叠。

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