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1. 发明授权

US06507204B1 Semiconductor testing equipment with probe formed on a cantilever of a substrate 失效
标题翻译：具有探针的半导体测试设备形成在基板的悬臂上
公开(公告)号：US06507204B1
公开(公告)日：2003-01-14
申请号：US09522477
申请日：2000-03-09
申请人： Masatoshi Kanamaru , Yoshishige Endo , Atsushi Hosogane , Tatsuya Nagata , Ryuji Kohno , Hideyuki Aoki , Akihiko Ariga
发明人： Masatoshi Kanamaru , Yoshishige Endo , Atsushi Hosogane , Tatsuya Nagata , Ryuji Kohno , Hideyuki Aoki , Akihiko Ariga
IPC分类号： G01R3102
CPC分类号： G01R1/06733 , G01R1/06727 , G01R1/06738 , G01R1/06761 , G01R1/06772 , G01R1/07342 , G01R3/00
摘要： The conventional semiconductor element testing equipment is arranged to position each probe accurately and need a burdensome operation for fixing, and includes only a limited number of electrode pads and chips to be tested at a batch. An equipment for testing a semiconductor element is arranged to keep each of electrode pads formed on a semiconductor element to be tested in direct contact with each of probes formed on a first substrate composed of silicon, one of electric connecting substrates disposed in the equipment. On the first substrate, each probe is formed on a cantilever and a wire is routed from a tip of each probe along a tip of the cantilever to the electrode pad formed on an opposite surface to the probe forming surface through an insulating layer.
摘要翻译：常规的半导体元件测试设备被布置成准确地定位每个探针，并且需要用于固定的繁重的操作，并且仅包括有限数量的待批测试的电极焊盘和芯片。布置了用于测试半导体元件的设备，以使每个形成在要测试的半导体元件上的电极焊盘与形成在由设置在设备中的电连接基板之一的硅构成的第一基板上形成的每个探针直接接触。在第一基板上，每个探针形成在悬臂上，并且从每个探针的尖端沿着悬臂的尖端布线到通过绝缘层与探针形成表面相对的表面上形成的电极焊盘。

2. 发明授权

US06531327B2 Method for manufacturing semiconductor device utilizing semiconductor testing equipment 失效
公开(公告)号：US06531327B2
公开(公告)日：2003-03-11
申请号：US10073343
申请日：2002-02-13
申请人： Masatoshi Kanamaru , Yoshishige Endo , Atsushi Hosogane , Tatsuya Nagata , Ryuji Kohno , Hideyuki Aoki , Akihiko Ariga
发明人： Masatoshi Kanamaru , Yoshishige Endo , Atsushi Hosogane , Tatsuya Nagata , Ryuji Kohno , Hideyuki Aoki , Akihiko Ariga
IPC分类号： H01L2166
CPC分类号： G01R1/06733 , G01R1/06727 , G01R1/06738 , G01R1/06761 , G01R1/06772 , G01R1/07342 , G01R3/00
摘要： A method for manufacturing a semiconductor device includes forming an integrated circuit on a surface of a wafer and testing electric characteristic of the integrated circuit. The testing includes positioning each of probes of a semiconductor testing equipment and each of electrodes of a tested semiconductor element with each other, and allowing each of the probes to come into contact with each of the electrodes. The semiconductor testing equipment includes a first substrate having a cantilever, the probes being formed on the cantilever of the first substrate, and wires for electrically connecting the probes to electrode pads which are formed on an opposite side of the first substrate to a side on which the probes are formed. Each of the wires has a region arranged on an insulating layer, which is formed on the cantilever, on the opposite side.

3. 发明授权

US06864568B2 Packaging device for holding a plurality of semiconductor devices to be inspected 失效
标题翻译：用于保持待检查的多个半导体器件的封装装置
公开(公告)号：US06864568B2
公开(公告)日：2005-03-08
申请号：US10252546
申请日：2002-09-24
申请人： Ryuji Kohno , Hiroya Shimizu , Masatoshi Kanamaru , Atsushi Hosogane , Toshio Miyatake , Hideo Miura , Tatsuya Nagata , Yoshishige Endo , Masaaki Namba , Yuji Wada
发明人： Ryuji Kohno , Hiroya Shimizu , Masatoshi Kanamaru , Atsushi Hosogane , Toshio Miyatake , Hideo Miura , Tatsuya Nagata , Yoshishige Endo , Masaaki Namba , Yuji Wada
IPC分类号： G01R31/26 , G01R1/04 , G01R1/073 , H01L21/66 , H01L23/02
CPC分类号： G01R1/0483 , H01L2924/0002 , H01L2924/00
摘要： A packaging device for holding thereon a plurality of semiconductor devices to be inspected on an inspection device including a probe to be electrically connected to an electrode of each of the semiconductor devices, comprises, holes for respectively receiving detachably therein the semiconductor devices to keep a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices, in a direction perpendicular to a thickness direction of the semiconductor devices, and electrically conductive members adapted to be connected respectively to the electrodes of the semiconductor devices, and extending to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members.
摘要翻译：一种用于在其上保持要检查的多个待检查的半导体器件的封装装置，包括：电连接到每个半导体器件的电极的探针，包括：用于分别接收半导体器件中的可分离地接收的孔，以保持位置半导体器件之间的关系以及在与半导体器件的厚度方向垂直的方向上半导体器件之间的间隔恒定的封装器件和每个半导体器件之间的位置关系以及适于分别连接的导电部件并且延伸到包装装置的外部，使得探针连接到每个导电构件。

4. 发明授权

US06465264B1 Method for producing semiconductor device and apparatus usable therein 失效
标题翻译：用于制造半导体器件的方法和可用于其中的装置
公开(公告)号：US06465264B1
公开(公告)日：2002-10-15
申请号：US09654612
申请日：2000-09-01
申请人： Ryuji Kohno , Hiroya Shimizu , Masatoshi Kanamaru , Atsushi Hosogane , Toshio Miyatake , Hideo Miura , Tatsuya Nagata , Yoshishige Endo , Masaaki Namba , Yuji Wada
发明人： Ryuji Kohno , Hiroya Shimizu , Masatoshi Kanamaru , Atsushi Hosogane , Toshio Miyatake , Hideo Miura , Tatsuya Nagata , Yoshishige Endo , Masaaki Namba , Yuji Wada
IPC分类号： G01R3126
CPC分类号： G01R1/0483 , H01L2924/0002 , H01L2924/00
摘要： A packaging device for holding thereon a plurality of semiconductor devices to be inspected on an inspection device including a probe to be electrically connected to an electrode of each of the semiconductor devices, comprises, holes for respectively receiving detachably therein the semiconductor devices to keep a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices, in a direction perpendicular to a thickness direction of the semiconductor devices, and electrically conductive members adapted to be connected respectively to the electrodes of the semiconductor devices, and extending to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members.
摘要翻译：一种用于在其上保持要检查的多个待检查的半导体器件的封装装置，包括：电连接到每个半导体器件的电极的探针，包括：用于分别接收半导体器件中的可分离地接收的孔，以保持位置半导体器件之间的关系以及在与半导体器件的厚度方向垂直的方向上半导体器件之间的间隔恒定的封装器件和每个半导体器件之间的位置关系以及适于分别连接的导电部件并且延伸到包装装置的外部，使得探针连接到每个导电构件。

5. 发明授权

US07018857B2 Method of manufacturing a semiconductor device including defect inspection using a semiconductor testing probe 失效
标题翻译：使用半导体测试探针制造包括缺陷检查的半导体器件的方法
公开(公告)号：US07018857B2
公开(公告)日：2006-03-28
申请号：US10459598
申请日：2003-06-12
申请人： Masatoshi Kanamaru , Takanori Aono , Tatsuya Nagata , Kenji Kawakami , Hideyuki Aoki
发明人： Masatoshi Kanamaru , Takanori Aono , Tatsuya Nagata , Kenji Kawakami , Hideyuki Aoki
IPC分类号： H01L21/66
CPC分类号： G01R1/06761 , G01R1/0735 , G01R3/00
摘要： A manufacturing method for improving the yield in a semiconductor manufacturing process and reducing the manufacturing cost produces a semiconductor device that is inexpensively manufactured and has a high reliability by reliably making contact during inspection with a suitable pressing force, while limiting damage to an electrode pad even when many inspected electrodes are inspected. A substrate used for inspection of the semiconductor device has a beam, a probe on the beam having a projecting shape for coming in contact with an electrode (electrode pad) of the semiconductor device, and a secondary electrode electrically connected to the probe through an electrically conductive member disposed on the side of the beam opposed to the side where the probe is provided. In an inspecting process, an inspecting device having a layer having many projections formed in the probe come in contact with the electrode pad of the semiconductor device.
摘要翻译：一种用于提高半导体制造工艺中的产量并降低制造成本的制造方法产生了廉价制造的半导体器件，并且通过在合适的按压力期间可靠地进行接触检查而具有高的可靠性，同时限制对电极焊盘的损伤甚至当检查了许多检查电极时。用于检查半导体器件的衬底具有光束，所述光束上的探针具有用于与半导体器件的电极（电极焊盘）接触的突出形状，以及通过电气电连接到探针的次级电极导电构件设置在与设置探针的一侧相对的梁的侧面上。在检查过程中，具有形成在探针中的具有许多突起的层的检查装置与半导体器件的电极焊盘接触。

6. 发明申请

US20050074910A1 Manufacturing method of semiconductor device 失效
标题翻译：半导体器件的制造方法
公开(公告)号：US20050074910A1
公开(公告)日：2005-04-07
申请号：US10459598
申请日：2003-06-12
申请人： Masatoshi Kanamaru , Takanori Aono , Tatsuya Nagata , Kenji Kawakami , Hideyuki Aoki
发明人： Masatoshi Kanamaru , Takanori Aono , Tatsuya Nagata , Kenji Kawakami , Hideyuki Aoki
IPC分类号： G01R31/26 , G01R1/067 , G01R1/073 , G01R3/00 , H01L21/66
CPC分类号： G01R1/06761 , G01R1/0735 , G01R3/00
摘要： A manufacturing method for improving the yield in a semiconductor manufacturing process and reducing the manufacturing cost produces a semiconductor device that is inexpensively manufactured and has a high reliability by reliably making contact during inspection with a suitable pressing force, while limiting damage to an electrode pad even when many inspected electrodes are inspected. A substrate used for inspection of the semiconductor device has a beam, a probe on the beam having a projecting shape for coming in contact with an electrode (electrode pad) of the semiconductor device, and a secondary electrode electrically connected to the probe through an electrically conductive member disposed on the side of the beam opposed to the side where the probe is provided. In an inspecting process, an inspecting device having a layer having many projections formed in the probe come in contact with the electrode pad of the semiconductor device.
摘要翻译：一种用于提高半导体制造工艺中的产量并降低制造成本的制造方法产生了廉价制造的半导体器件，并且通过在合适的按压力期间可靠地进行接触检查而具有高的可靠性，同时限制对电极焊盘的损伤甚至当检查了许多检查电极时。用于检查半导体器件的衬底具有光束，所述光束上的探针具有用于与半导体器件的电极（电极焊盘）接触的突出形状，以及通过电气电连接到探针的次级电极导电构件设置在与设置探针的一侧相对的梁的侧面上。在检查过程中，具有形成在探针中的具有许多突起的层的检查装置与半导体器件的电极焊盘接触。

7. 发明授权

US06885208B2 Semiconductor device and test device for same 失效
标题翻译：半导体器件和测试装置相同
公开(公告)号：US06885208B2
公开(公告)日：2005-04-26
申请号：US10218596
申请日：2002-08-15
申请人： Toshio Miyatake , Tatsuya Nagata , Hiroya Shimizu , Ryuji Kohno , Hideyuki Aoki
发明人： Toshio Miyatake , Tatsuya Nagata , Hiroya Shimizu , Ryuji Kohno , Hideyuki Aoki
IPC分类号： G01R31/28 , G01R31/26 , G11C11/419 , G11C29/04 , H01L21/66 , H01L21/822 , H01L23/544 , H01L23/58 , H01L27/04
CPC分类号： H01L22/32 , G11C29/04 , G11C29/1201 , G11C2029/1206 , H01L22/34 , H01L2224/05554
摘要： A semiconductor device includes a quadrangular semiconductor substrate and a self test circuit formed on the semiconductor substrate. A plurality of pads are formed on the semiconductor substrate, which pads are coupled at least to the self test circuit. The semiconductor substrate includes four rectangular or square regions which each include a respective corner of the quadrangle, and at least two of the pads are respectively located on diagonally opposite ones of the regions from one another.
摘要翻译：半导体器件包括四边形半导体衬底和形成在半导体衬底上的自测电路。多个焊盘形成在半导体衬底上，这些焊盘至少耦合到自测电路。半导体衬底包括四个矩形或正方形区域，每个区域包括四边形的相应角部，并且至少两个衬垫分别位于彼此相对的一个区域上。

8. 发明授权

US06977514B2 Probe structure 失效
标题翻译：探头结构
公开(公告)号：US06977514B2
公开(公告)日：2005-12-20
申请号：US10625566
申请日：2003-07-24
申请人： Ryuji Kohno , Tatsuya Nagata , Hiroya Shimizu , Toshio Miyatake , Hideo Miura
发明人： Ryuji Kohno , Tatsuya Nagata , Hiroya Shimizu , Toshio Miyatake , Hideo Miura
IPC分类号： G01R1/073 , H01L21/66 , G01R31/28
CPC分类号： G01R1/07378
摘要： A probe structure is provided in which secondary electrodes of a main base material and probes are formed can be electrically connected to electrodes in a substrate side even when a lot of probes are formed in a large area, so that a lot of LSIs within a wafer can be tested in one lot in a wafer test process, and an efficiency of the test process can be improved. In the probe structure, an interposer constituted by a high rigid material is arranged between the main base material having the probes formed therein and the substrate side, and the secondary electrodes of the main base material having the probes formed therein are electrically connected to the electrodes in the substrate side via the interposer.
摘要翻译：提供了一种探针结构，其中形成主基材和探针的二次电极可以在基板侧电连接到基板侧的电极，即使在大面积上形成大量的探针，使得晶片内的大量LSI 可以在晶片测试过程中一次性测试，并且可以提高测试过程的效率。在探针结构中，由具有高刚性材料的插入体配置在其中形成有探针的主基材和基板侧之间，并且其中形成有探针的主基材的二次电极电连接到电极在基板侧经由插入件。

9. 发明申请

US20060003219A1 Fuel cell having mechanism for pressurizing membrane electrode assembly and electronic device equipped with the same 审中-公开
标题翻译：具有用于加压膜电极组件的机构的燃料电池和配备有该电极组件的电子装置
公开(公告)号：US20060003219A1
公开(公告)日：2006-01-05
申请号：US11169775
申请日：2005-06-30
申请人： Ryuji Kohno , Tatsuya Nagata , Makoto Kitano
发明人： Ryuji Kohno , Tatsuya Nagata , Makoto Kitano
IPC分类号： H01M2/08 , H01M8/10 , H01M8/02
CPC分类号： H01M8/04208 , H01M8/0247 , H01M8/04186 , H01M8/248
摘要： It is an object of the present invention to provide a fuel cell having a pressurizing mechanism which can optimize pressure applied to a membrane electrode assembly (MEA) working as a power-generating element to realize high-efficiency power generation and an electronic device equipped with the same. The fuel cell 10A comprises the membrane electrode assembly module 20 which consumes the liquid fuel 40 to generate power, and the fuel chamber 30 for supplying the liquid fuel 40 which it holds inside to the membrane electrode assembly module 20 from the aperture 31, wherein it is provided with the pressurizing member 60 on the membrane electrode assembly module 20, clamping member 53 for fixing the pressurizing member 60 and fuel chamber 30, and elastic member for applying a pressure on the membrane electrode assembly module 20 in its thickness direction, to solve the problems.
摘要翻译：本发明的目的是提供一种具有加压机构的燃料电池，该加压机构能够优化施加于作为发电元件的膜电极组件（MEA）的压力，以实现高效发电，以及配备有一样。燃料电池10A包括消耗液体燃料40以产生动力的膜电极组件模块20，以及用于从孔31向液体燃料40供给到膜电极组件模块20内的液体燃料40的燃料室30，其中在膜电极组件模块20上设置有加压构件60，用于固定加压构件60和燃料室30的夹紧构件53以及在膜电极组件模块20的厚度方向上施加压力的弹性构件，解决问题。

10. 发明申请

US20060003196A1 Fuel cell and electronic device equipped with the same 审中-公开
标题翻译：燃料电池和电子设备配备相同
公开(公告)号：US20060003196A1
公开(公告)日：2006-01-05
申请号：US11171218
申请日：2005-07-01
申请人： Ryuji Kohno , Tatsuya Nagata , Makoto Kitano
发明人： Ryuji Kohno , Tatsuya Nagata , Makoto Kitano
IPC分类号： H01M8/00
CPC分类号： H01M8/04201 , H01M8/04186 , H01M8/04208 , H01M8/1011 , Y02E60/523
摘要： It is an object of the present invention to provide a fuel cell which can supply a liquid fuel, without changing its composition, to every corner of the membrane electrode assemblies arranged two- dimensionally over a wide area, to generate power at a high efficiency. The fuel cell 10A comprises the membrane electrode assembly modules 20 which consume the liquid fuel 40 to generate power, and the fuel chamber 30 which holds the liquid fuel 40 inside and has the principal plane on which the membrane electrode assembly modules 20 are arranged, wherein the fuel chamber 30 is provided with the fuel injection hole 33 inside, through which the liquid fuel 40 is supplied under pressure from the outside, and the fuel supply gear 42 inside, which is located to come close to the membrane electrode assembly modules 20, the fuel supply gear 42 being provided, on the surface, with the fine pores 43 through which the liquid fuel 40 can pass.
摘要翻译：本发明的一个目的是提供一种燃料电池，其可以在不改变其组成的情况下将液体燃料供应到在广泛区域上二维布置的膜电极组件的每个角部，以高效率发电。燃料电池10A包括消耗液体燃料40以产生动力的膜电极组件模块20和将液体燃料40保持在内部并且具有其上布置有膜电极组件模块20的主平面的燃料室30，其中燃料室30内设有燃料喷射孔33，液体燃料40通过该燃料喷射孔33从外部受到压力供给，燃料供给齿轮42位于靠近膜电极组件模块20的位置燃料供给齿轮42在表面上设置有液体燃料40可以通过的细孔43。

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