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1. 发明申请

US20140335633A1 SEPARATION METHOD, COMPUTER STORAGE MEDIUM, AND SEPARATION SYSTEM 有权
标题翻译：分离方法，计算机存储介质和分离系统
公开(公告)号：US20140335633A1
公开(公告)日：2014-11-13
申请号：US14343598
申请日：2012-08-22
申请人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
发明人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
IPC分类号： H01L21/66 , H01L21/67
CPC分类号： H01L22/12 , H01L21/02068 , H01L21/67017 , H01L21/67092 , H01L21/6715 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/1911
摘要： A superposed wafer is separated to a processing target wafer and a supporting wafer while being heated. Then, an adhesive on a joint surface of the processing target wafer is removed by supplying an organic solvent onto the joint surface of the processing target wafer. Then, an oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed by supplying acetic acid to the joint surface of the processing target wafer. Then, the joint surface of the processing target wafer is inspected. Then, based on an inspection result, the adhesive on the joint surface of the processing target wafer is removed and the oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed.
摘要翻译：叠加的晶片在被加热的同时被分离成处理目标晶片和支撑晶片。然后，通过向处理目标晶片的接合表面上提供有机溶剂，去除处理目标晶片的接合表面上的粘合剂。然后，通过向处理目标晶片的接合表面供给乙酸，去除在处理目标晶片的接合表面上形成在预定图案上的氧化膜。然后，检查处理目标晶片的接合表面。然后，基于检查结果，去除处理目标晶片的接合面上的粘合剂，去除在处理对象晶片的接合面上形成在规定图案上的氧化膜。

2. 发明申请

US20140224414A1 JOINING METHOD AND JOINING SYSTEM 有权
标题翻译：加工方法和加工系统
公开(公告)号：US20140224414A1
公开(公告)日：2014-08-14
申请号：US14342704
申请日：2012-08-30
申请人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
发明人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
IPC分类号： B32B38/10 , B32B38/00
CPC分类号： B32B38/10 , B32B37/12 , B32B38/0012 , B32B2457/14 , C09J5/00 , H01L21/6708 , H01L21/67092 , H01L21/6715 , H01L21/6835 , H01L21/68707 , H01L2221/68327 , H01L2221/6834 , Y10T156/14
摘要： The present disclosure is a joining method that joins a target substrate and a support substrate, wherein the method has: a joining operation that includes pressing and joining the target substrate and the support substrate by interposing an adhesive therebetween; and an adhesive removing operation that includes supplying a solvent of the adhesive to the outer adhesive that is the adhesive between the target substrate and the support substrate protruding in the joining operation from the outer lateral surface of the stacked substrate made by joining the target substrate and the support substrate, and to remove the surface of the outer adhesive so that the outer adhesive is formed at a predetermined size.
摘要翻译：本公开是连接目标基板和支撑基板的接合方法，其中，所述方法具有：连接操作，其包括通过在其间插入粘合剂来挤压和接合所述目标基板和所述支撑基板; 以及粘合剂去除操作，其包括将粘合剂的溶剂供应到作为在接合操作中突出的目标基板和支撑基板之间的粘合剂的外部粘合剂，所述粘合剂从通过连接目标基板制成的层叠基板的外侧表面和支撑基板，并且去除外部粘合剂的表面，使得外部粘合剂形成为预定尺寸。

3. 发明授权

US10008419B2 Separation method, computer storage medium, and separation system 有权
公开(公告)号：US10008419B2
公开(公告)日：2018-06-26
申请号：US14343598
申请日：2012-08-22
申请人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi , Xavier Francois Brun , Charles Wayne Singleton, Jr. , Kabirkumar Mirpuri
发明人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi , Xavier Francois Brun , Charles Wayne Singleton, Jr. , Kabirkumar Mirpuri
IPC分类号： H01L21/00 , H01L21/66 , H01L21/67 , H01L21/02 , H01L21/683
CPC分类号： H01L22/12 , H01L21/02068 , H01L21/67017 , H01L21/67092 , H01L21/6715 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/1911
摘要： A superposed wafer is separated to a processing target wafer and a supporting wafer while being heated. Then, an adhesive on a joint surface of the processing target wafer is removed by supplying an organic solvent onto the joint surface of the processing target wafer. Then, an oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed by supplying acetic acid to the joint surface of the processing target wafer. Then, the joint surface of the processing target wafer is inspected. Then, based on an inspection result, the adhesive on the joint surface of the processing target wafer is removed and the oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed.

4. 发明授权

US09484236B2 Joining method and joining system 有权
标题翻译：加盟方式和加盟制度
公开(公告)号：US09484236B2
公开(公告)日：2016-11-01
申请号：US14342941
申请日：2012-08-03
申请人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
发明人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
IPC分类号： C03C15/00 , H01L21/683 , B81C1/00 , B32B38/10 , H01L21/67 , H01L21/687
CPC分类号： H01L21/683 , B32B38/10 , B81C1/00238 , H01L21/6708 , H01L21/67092 , H01L21/6715 , H01L21/6835 , H01L21/68707 , H01L2221/68327 , H01L2221/6834
摘要： This joining method of joining a target substrate and a support substrate includes: an adhesive coating operation that includes coating the target substrate or the support substrate with an adhesive; an adhesive removing operation that includes supplying a solvent for removing the adhesive onto an outer peripheral portion of the target substrate or the support substrate, which is coated with the adhesive in the adhesive coating operation, to thereby remove the adhesive on the outer peripheral portion; and a joining operation that includes pressing and joining the target substrate and the support substrate together, in which the adhesive on the outer peripheral portion is removed in the adhesive removing operation, and the support substrate coated with no adhesive, or pressing and joining the support substrate, in which the adhesive on the outer peripheral portion is removed in the adhesive removing operation, and the target substrate coated with no adhesive.
摘要翻译：该接合目标基板和支撑基板的接合方法包括：粘合剂涂布操作，其包括用粘合剂涂覆目标基板或支撑基板; 一种粘合剂去除操作，其包括在粘合剂涂覆操作中将用于除去粘合剂的溶剂供给到涂覆有粘合剂的目标基材或支撑基材的外周部分上，从而除去外周部分上的粘合剂; 以及接合操作，其包括将粘合剂去除操作中除去外周部分上的粘合剂并且没有粘合剂涂覆的支撑基板，或者将支撑体基板，其中在粘合剂去除操作中去除外周部分上的粘合剂，并且没有粘合剂涂覆的目标基板。

5. 发明授权

US08899289B2 Joint method, joint apparatus and joint system 有权
标题翻译：联合方法，联合装置和联合系统
公开(公告)号：US08899289B2
公开(公告)日：2014-12-02
申请号：US13613050
申请日：2012-09-13
申请人： Masatoshi Deguchi , Masatoshi Shiraishi , Shinji Okada
发明人： Masatoshi Deguchi , Masatoshi Shiraishi , Shinji Okada
IPC分类号： B29C65/00 , G05G15/00 , B23K31/00 , H01L21/30 , H01L21/687 , H01L21/67 , H01L21/18 , B32B38/00 , H01L21/683 , B32B38/18
CPC分类号： H01L21/6715 , B32B38/0036 , B32B2038/1891 , B32B2309/02 , B32B2309/62 , B32B2457/14 , B32B2457/20 , H01L21/187 , H01L21/67109 , H01L21/67126 , H01L21/6719 , H01L21/6838 , H01L21/68707 , H01L21/68742
摘要： When joining a processing target substrate and a supporting substrate together by suction-holding the processing substrate and the supporting substrate respectively on a first holding unit and a second holding unit arranged to face each other and pressing the second holding unit toward the first holding unit while heating the substrates by heating mechanisms of the holding units, the present invention preheats at least the processing target substrate before suction-holding the processing target substrate on the first holding unit to suppress generation of particles when joining the processing target substrate and the supporting substrate together so as to properly perform the joining of the processing target substrate and the supporting substrate.
摘要翻译：通过将处理基板和支撑基板分别吸附在第一保持单元和第二保持单元上而将处理目标基板和支撑基板接合在一起，第一保持单元和第二保持单元被布置成彼此面对并且将第二保持单元朝向第一保持单元按压，同时通过加热保持单元的加热机构来加热基板，本发明在将处理对象基板吸附到第一保持单元之前至少预热处理对象基板，以抑制在将处理对象基板与支撑基板接合在一起时产生粒子从而适当地执行处理目标基板和支撑基板的接合。

6. 发明申请

US20140224763A1 JOINING METHOD AND JOINING SYSTEM 有权
标题翻译：加工方法和加工系统
公开(公告)号：US20140224763A1
公开(公告)日：2014-08-14
申请号：US14342941
申请日：2012-08-03
申请人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
发明人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
IPC分类号： H01L21/683
CPC分类号： H01L21/683 , B32B38/10 , B81C1/00238 , H01L21/6708 , H01L21/67092 , H01L21/6715 , H01L21/6835 , H01L21/68707 , H01L2221/68327 , H01L2221/6834
摘要： This joining method of joining a target substrate and a support substrate includes: an adhesive coating operation that includes coating the target substrate or the support substrate with an adhesive; an adhesive removing operation that includes supplying a solvent of the adhesive onto an outer peripheral portion of the target substrate or the support substrate, which is coated with the adhesive in the adhesive coating operation, to thereby remove the adhesive on the outer peripheral portion; and a joining operation that includes pressing and joining the target substrate and the support substrate together, in which the adhesive on the outer peripheral portion is removed in the adhesive removing operation, and the support substrate coated with no adhesive, or pressing and joining the support substrate, in which the adhesive on the outer peripheral portion is removed in the adhesive removing operation, and the target substrate coated with no adhesive.
摘要翻译：该接合目标基板和支撑基板的接合方法包括：粘合剂涂布操作，其包括用粘合剂涂覆目标基板或支撑基板; 一种粘合剂去除操作，其包括在粘合剂涂覆操作中将粘合剂的溶剂供给到涂覆有粘合剂的目标基材或支撑基材的外周部分上，从而除去外周部分上的粘合剂; 以及接合操作，其包括将粘合剂去除操作中除去外周部分上的粘合剂并且没有粘合剂涂覆的支撑基板，或者将支撑体基板，其中在粘合剂去除操作中去除外周部分上的粘合剂，并且没有粘合剂涂覆的目标基板。

7. 发明授权

US09463612B2 Joining method and joining system 有权
标题翻译：加盟方式和加盟制度
公开(公告)号：US09463612B2
公开(公告)日：2016-10-11
申请号：US14342704
申请日：2012-08-30
申请人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
发明人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
IPC分类号： C09J5/00 , B32B38/10 , H01L21/67 , H01L21/687 , H01L21/683 , B32B38/00 , B32B37/12
CPC分类号： B32B38/10 , B32B37/12 , B32B38/0012 , B32B2457/14 , C09J5/00 , H01L21/6708 , H01L21/67092 , H01L21/6715 , H01L21/6835 , H01L21/68707 , H01L2221/68327 , H01L2221/6834 , Y10T156/14
摘要： The present disclosure is a joining method that joins a target substrate and a support substrate, wherein the method has: a joining operation that includes pressing and joining the target substrate and the support substrate by interposing an adhesive therebetween; and an adhesive removing operation that includes supplying a solvent of the adhesive to the outer adhesive that is the adhesive between the target substrate and the support substrate protruding in the joining operation from the outer lateral surface of the stacked substrate made by joining the target substrate and the support substrate, and to remove the surface of the outer adhesive so that the outer adhesive is formed at a predetermined size.
摘要翻译：本公开是连接目标基板和支撑基板的接合方法，其中，所述方法具有：连接操作，其包括通过在其间插入粘合剂来挤压和接合所述目标基板和所述支撑基板; 以及粘合剂去除操作，其包括将粘合剂的溶剂供应到作为在接合操作中突出的目标基板和支撑基板之间的粘合剂的外部粘合剂，所述粘合剂从通过连接目标基板制成的层叠基板的外侧表面和支撑基板，并且去除外部粘合剂的表面，使得外部粘合剂形成为预定尺寸。

8. 发明授权

US09454638B2 Motor design method, motor designed by motor design method, and electric vehicle provided with motor 有权
标题翻译：电动机设计方法，电动机设计方法，电动汽车等
公开(公告)号：US09454638B2
公开(公告)日：2016-09-27
申请号：US13876035
申请日：2011-10-19
申请人： Takashi Fujinaga , Yasushi Mitsuyama , Hideki Hashimoto , Shinji Okada
发明人： Takashi Fujinaga , Yasushi Mitsuyama , Hideki Hashimoto , Shinji Okada
IPC分类号： G06F7/60 , G06F17/10 , G06F17/50 , B60L15/20 , H02K15/00 , B60W10/08
CPC分类号： G06F17/5095 , B60L3/0061 , B60L3/12 , B60L11/1803 , B60L11/1861 , B60L11/1864 , B60L11/1877 , B60L15/2045 , B60L2200/18 , B60L2220/44 , B60L2240/12 , B60L2240/421 , B60L2240/423 , B60L2240/425 , B60L2240/429 , B60L2240/547 , B60W10/08 , B60W2300/10 , B60Y2304/00 , H02K15/00 , Y02T10/641 , Y02T10/645 , Y02T10/7005 , Y02T10/7044 , Y02T10/7061 , Y02T10/72 , Y02T10/7283
摘要： A motor design method, a motor (11) designed by the motor design method, and an electric vehicle (10) provided with the motor (11) include a first calculation step of obtaining a set of a number of revolutions required to achieve a predetermined running pattern and a torque required to achieve the predetermined running pattern, a second calculation step of selecting a motor efficiency corresponding to the number of revolutions and the torque from any one of motor characteristic curves, a third calculation step of obtaining a work amount from the number of revolutions and the torque and obtaining power consumption by dividing the work amount by the motor efficiency, and a fourth calculation step of obtaining a sum of the power consumption by repeating the first calculation step, the second calculation step, and the third calculation step over the entire running time.
摘要翻译：电动机设计方法，通过电动机设计方法设计的电动机（11）和设置有电动机（11）的电动车辆（10）包括：第一计算步骤，获得实现预定的所需转数运行模式和实现预定运行模式所需的转矩;第二计算步骤，从根据电动机特性曲线中的任何一个选择与转数和转矩相对应的电动机效率;第三计算步骤，从第旋转数和转矩，并通过将工作量除以电动机效率来获得功率消耗;以及第四计算步骤，通过重复第一计算步骤，第二计算步骤和第三计算步骤来获得功率消耗之和在整个运行时间。

9. 发明申请

US20130228032A1 Steering Device 有权
标题翻译：转向装置
公开(公告)号：US20130228032A1
公开(公告)日：2013-09-05
申请号：US13379251
申请日：2011-08-29
申请人： Shinji Okada
发明人： Shinji Okada
IPC分类号： B62D1/184
CPC分类号： B62D1/184
摘要： A steering device provides a driver operation feeling that lets the driver definitely feel that a movable tilt lock gear and a fixed tilt lock gear are securely engaged. Gear noise in tilt adjustment when the movable tilt lock gear and the fixed tilt lock gear are engaged halfway is prevented. As the control force of an operating lever is rapidly decreased when a fitting protrusion is fitted to a stepped part, a click and click stop feeling occur and a definite operation feeling that the clamping is securely performed is acquired. As the fitting protrusion is integrated with the operating lever and a sliding surface configured by a groove, an inclined face and the stepped part are also formed as an outside face of the fixed tilt lock gear, the number of parts and man-hours for assembly can be reduced.
摘要翻译：转向装置提供驾驶员操作感觉，其使驾驶员确实感觉到可动倾斜锁定齿轮和固定倾斜锁定齿轮牢固地接合。防止当可动倾斜锁定齿轮和固定倾斜锁定齿轮啮合时的倾斜调整中的齿轮噪声。当装配凸起装配到阶梯部分时操作杆的控制力迅速降低，发生点击和点击停止感，并且获得了可靠地执行夹紧的确定的操作感觉。当安装突起与操作杆一体化并且由凹槽构成的滑动表面时，倾斜面和台阶部分也形成为固定倾斜锁定齿轮的外表面，部件数量和组装工时可以减少

10. 发明申请

US20130179133A1 MOTOR DESIGN METHOD, MOTOR DESIGNED BY MOTOR DESIGN METHOD, AND ELECTRIC VEHICLE PROVIDED WITH MOTOR 有权
标题翻译：电动机设计方法，电机设计方法和电动汽车设计的电动机
公开(公告)号：US20130179133A1
公开(公告)日：2013-07-11
申请号：US13876035
申请日：2011-10-19
申请人： Takashi Fujinaga , Yasushi Mitsuyama , Hideki Hashimoto , Shinji Okada
发明人： Takashi Fujinaga , Yasushi Mitsuyama , Hideki Hashimoto , Shinji Okada
IPC分类号： G06F17/50
CPC分类号： G06F17/5095 , B60L3/0061 , B60L3/12 , B60L11/1803 , B60L11/1861 , B60L11/1864 , B60L11/1877 , B60L15/2045 , B60L2200/18 , B60L2220/44 , B60L2240/12 , B60L2240/421 , B60L2240/423 , B60L2240/425 , B60L2240/429 , B60L2240/547 , B60W10/08 , B60W2300/10 , B60Y2304/00 , H02K15/00 , Y02T10/641 , Y02T10/645 , Y02T10/7005 , Y02T10/7044 , Y02T10/7061 , Y02T10/72 , Y02T10/7283
摘要： A motor design method, a motor (11) designed by the motor design method, and an electric vehicle (10) provided with the motor (11) include a first calculation step of obtaining a set of a number of revolutions required to achieve a predetermined running pattern and a torque required to achieve the predetermined running pattern, a second calculation step of selecting a motor efficiency corresponding to the number of revolutions and the torque from any one of motor characteristic curves, a third calculation step of obtaining a work amount from the number of revolutions and the torque and obtaining power consumption by dividing the work amount by the motor efficiency, and a fourth calculation step of obtaining a sum of the power consumption by repeating the first calculation step, the second calculation step, and the third calculation step over the entire running time.
摘要翻译：电动机设计方法，通过电动机设计方法设计的电动机（11）和设置有电动机（11）的电动车辆（10）包括：第一计算步骤，获得实现预定的所需转数运行模式和实现预定运行模式所需的转矩;第二计算步骤，从根据电动机特性曲线中的任何一个选择与转数和转矩相对应的电动机效率;第三计算步骤，从第旋转数和转矩，并通过将工作量除以电动机效率来获得功率消耗;以及第四计算步骤，通过重复第一计算步骤，第二计算步骤和第三计算步骤来获得功率消耗之和在整个运行时间。

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