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    • 1. 发明专利
    • Easily attachable or detachable electrical fence for orchard
    • 易于连接或可拆卸的电机
    • JP2006042763A
    • 2006-02-16
    • JP2004247566
    • 2004-07-30
    • Shinji Okada信司 岡田
    • OKADA SHINJI
    • A01M29/24A01M29/30
    • PROBLEM TO BE SOLVED: To provide an electrical fence capable of being simply and effectively set up at a low cost by the use of a frame pipe 9 existing in the periphery, as a vermin damage countermeasure against rboreal animals such as Paguma larvata.
      SOLUTION: A small wiring fitting processed in a form capable of being simply attached in combination with a packer (clamp for green house) 7 or binding band 8 as commercially available agricultural material is used. The small wiring fitting can economically be used in an easily attachable or detachable state, and the conductivity of a cathodic wire 6 used as the scaffold of harmful animals is effectively ensured.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了提供一种能够通过使用存在于周边的框架管道9而以低成本简单有效地设置的电气围栏,作为针对诸如白蛾(Paguma larvata)等野生动物的害虫损害对策 。

      解决方案:使用以能够简单地与封隔器(用于温室的夹具)7或作为市售农用材料的结合带8组合的形式加工的小型接线配件。 小型接线配件可以经济地以易于安装或拆卸的状态使用,并且有效地确保了用作有害动物脚手架的阴极线6的导电性。 版权所有(C)2006,JPO&NCIPI

    • 5. 发明申请
    • JOINING METHOD AND JOINING SYSTEM
    • 加工方法和加工系统
    • US20140224763A1
    • 2014-08-14
    • US14342941
    • 2012-08-03
    • Shinji OkadaMasatoshi ShiraishiMasatoshi Deguchi
    • Shinji OkadaMasatoshi ShiraishiMasatoshi Deguchi
    • H01L21/683
    • H01L21/683B32B38/10B81C1/00238H01L21/6708H01L21/67092H01L21/6715H01L21/6835H01L21/68707H01L2221/68327H01L2221/6834
    • This joining method of joining a target substrate and a support substrate includes: an adhesive coating operation that includes coating the target substrate or the support substrate with an adhesive; an adhesive removing operation that includes supplying a solvent of the adhesive onto an outer peripheral portion of the target substrate or the support substrate, which is coated with the adhesive in the adhesive coating operation, to thereby remove the adhesive on the outer peripheral portion; and a joining operation that includes pressing and joining the target substrate and the support substrate together, in which the adhesive on the outer peripheral portion is removed in the adhesive removing operation, and the support substrate coated with no adhesive, or pressing and joining the support substrate, in which the adhesive on the outer peripheral portion is removed in the adhesive removing operation, and the target substrate coated with no adhesive.
    • 该接合目标基板和支撑基板的接合方法包括:粘合剂涂布操作,其包括用粘合剂涂覆目标基板或支撑基板; 一种粘合剂去除操作,其包括在粘合剂涂覆操作中将粘合剂的溶剂供给到涂覆有粘合剂的目标基材或支撑基材的外周部分上,从而除去外周部分上的粘合剂; 以及接合操作,其包括将粘合剂去除操作中除去外周部分上的粘合剂并且没有粘合剂涂覆的支撑基板,或者将支撑体 基板,其中在粘合剂去除操作中去除外周部分上的粘合剂,并且没有粘合剂涂覆的目标基板。