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    • 8. 发明申请
    • REFLOW FURNACE
    • 冷却炉
    • US20080014542A1
    • 2008-01-17
    • US11689156
    • 2007-03-21
    • Toshiyuki ASAIMotohiro YamaneTakayuki MatsuokaAtsushi Tanaka
    • Toshiyuki ASAIMotohiro YamaneTakayuki MatsuokaAtsushi Tanaka
    • F27B9/14
    • B23K1/008B23K2101/42
    • A reflow furnace comprises: a carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, and a returning device to return a high temperature gas after being burned to the heating chamber.
    • 回流炉包括:载体装置,用于承载安装有电子部件的印刷电路板; 加热室,其通过环境气体加热承载在其中的印刷电路板,以将印刷电路板的表面上的电子部件焊接; 以及环境气体净化设备,其包括回收装置,用于在焊接时回收含有汽化助焊剂组分的环境气体的一部分,用于将回收的环境气体加热至所需温度的加热装置,用于燃烧所含有的助熔剂组分的氧化催化剂 加热环境气体和返回装置,以在燃烧到加热室之后返回高温气体。
    • 10. 发明授权
    • Reflow furnace
    • 回流炉
    • US07766651B2
    • 2010-08-03
    • US11689156
    • 2007-03-21
    • Toshiyuki AsaiMotohiro YamaneTakayuki MatsuokaAtsushi Tanaka
    • Toshiyuki AsaiMotohiro YamaneTakayuki MatsuokaAtsushi Tanaka
    • F27B9/04
    • B23K1/008B23K2101/42
    • A reflow furnace comprises: a carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, and a returning device to return a high temperature gas after being burned to the heating chamber.
    • 回流炉包括:载体装置,用于承载安装有电子部件的印刷电路板; 加热室,其通过环境气体加热承载在其中的印刷电路板,以将印刷电路板的表面上的电子部件焊接; 以及环境气体净化设备,其包括回收装置,用于在焊接时回收含有汽化助焊剂组分的环境气体的一部分,用于将回收的环境气体加热至所需温度的加热装置,用于燃烧所含有的助熔剂组分的氧化催化剂 加热环境气体和返回装置,以在燃烧到加热室之后返回高温气体。